...K. Lafdi; O. Mesalhy; A. Elgafy In the present work, the potential of using foam structures impregnated with phase change materials (PCMs) as heat sinks for cooling of electronic devices has been numerically studied. Different design parameters have been investigated such as foam properties...

...Johnathan S. Coursey; Jungho Kim; Paul J. Boudreaux This paper presents the results of an investigation of the thermal performance of a graphite foam thermosyphon evaporator and discusses the foam’s potential for use in the thermal management of electronics. The graphitized carbon foam used...

...Tzer-Ming Jeng; Li-Kang Liu; Ying-Huei Hung A novel semi-empirical model with an improved single blow method for exploring the heat transfer performance of porous aluminum-foam heat sinks in a channel has been successfully developed. The influencing parameters such as the steady-state air...

...A. Bhattacharya, Research Assistant; R. L. Mahajan, Professor In this paper, we present recent experimental results on forced convective heat transfer in novel finned metal foam heat sinks. Experiments were conducted on aluminum foams of 90 percent porosity and pore size corresponding to 5 PPI (200...