... to the paper) is Q ' = q · d B l H . The heat from the heat source region of the board to the corresponding part (directly above) of the casing is heat conduction across the air gap (A1) Q ' BC 1 = k I d I ∫ 0 l H ( T B...

... heat conduction effective heat transfer coefficient power scenario electronic equipment In recent years many-core processors are gaining attention of researchers in the industry and the academia. Significant advantage in speedup of processing with reduced power consumption is envisioned...

... heat conduction where the heat source is a rectangle embedded in a semi-infinite medium. In Ref. [ 47 ], the heat source is a rectangular patch, and it is placed at the center of the top surface of the substrate plate. The bottom surface of the substrate is isothermal heat sink plane, and the rest...

... JiaoTong University, China. 03 06 2009 24 05 2010 10 03 2011 10 03 2011 heat conduction heat transfer insulated gate bipolar transistors thermal resistance IGBT module vapor chamber (VC) junction-to-case thermal resistance transient temperature...

...Cheng-Hung Huang; Wei-Lun Chang A three-dimensional inverse heat conduction problem is solved in the present study by using the conjugate gradient method (CGM) and the general-purpose commercial code CFD − ACE + to estimate the strength of the unknown heat generation for an encapsulated chip...

... Δ p ∗ [-] in function of Reynolds number Re: [-] case θ = 0.25 29 07 2008 30 01 2009 31 07 2009 heat conduction heat exchangers numerical analysis heat exchangers extended surfaces Constructal theory computational fluid dynamics...

... and temperature distributions, maximum temperature heat sources, percentage contribution of plate (substrate) heat conduction on the heat removal from electronic components, temperature profile within finite conductive plate and local heat flux density at the plate—modules/PCM interface. The effect of these two...

... is exceedingly high, the coolant may bypass the heat sink completely, if it is not contained within a sealed channel. aluminium computational fluid dynamics finite volume methods forced convection heat conduction heat sinks metal foams stratified flow thermal conductivity 21 11 2007...

..., and the population of vias. 18 09 2008 03 06 2008 14 11 2008 ball grid arrays copper heat conduction integrated circuit design integrated circuit packaging laminates printed circuits resins thermal management (packaging) printed circuit board heat conduction analytical modeling...

...Wataru Nakayama This paper reports the design study performed on a heat conduction panel having several heat sources at separate locations and a heat sink on one of the panel corners. The panel is given a thickness distribution so as to provide spatially varying heat conduction paths from the heat...

... for full chip Joule heating simulations and for clock signal propagation simulations, which are performed as part of designing next generation chip architectures. 13 03 2006 23 10 2007 29 07 2008 heat conduction integrated circuit interconnections mesh generation...

... through experimentation and finite element analysis. atomic clocks bimetals chip scale packaging discs (structures) heat conduction switches temperature control thermal management (packaging) The experiment was run once each for the corner and side resistors in air and vacuum; results...

... 2007 04 02 2008 coatings cooling electronics packaging evaporation heat conduction microprocessor chips pool boiling microporous enhancement electronics cooling heat spreader experimental Historically the power dissipated from a microprocessor has increased with its...

...James Geer; Anand Desai; Bahgat Sammakia This paper presents the results of an analytical study of steady state heat conduction in multiple rectangular domains. Any finite number of domains that are equally sized (in plane) may be considered in the current analysis. The thermal conductivity...

... dimensional constraints. This paper shows a numerical approach, based on computational fluid dynamics (CFD) software, for the evaluation of the heat exchange performances of finned (straight fins) surfaces made of highly heat conductive material. The same geometric constraints assumed in a reference work were...

... building blocks of spintronic devices. Experiments showed that the thermal resistance of nanoscale AlO x tunnel barriers increases linearly with thickness, which is consistent with the theory of energy transport in highly disordered materials. Heat conduction across a tunnel junction is impeded...

... and various w ∕ H as well as X L , at Re > 3000 , sintered porous heat sinks with baffles insignificantly improved heat transfer. 06 02 2005 18 08 2005 heat sinks porous materials heat transfer sintering heat conduction integrated circuit packaging thermal management (packaging...

...Anand Desai; James Geer; Bahgat Sammakia An analytical model of steady state heat conduction in multiple cylindrical domains is presented and discussed. The domains are axisymmetric, contiguous, and coaxial. Three domains are considered in the current study. The thermal conductivities, thicknesses...

...Brian H. Dennis; Zhen-xue Han; George S. Dulikravich A finite element method (FEM) formulation for the prediction of unknown steady boundary conditions in heat conduction for multidomain three-dimensional (3D) solid objects is presented. The FEM formulation is capable of determining temperatures...

... the reliability of electronic packaging structures. Therefore, it is important to provide designers a good estimate of free edge stresses. According to the heat conduction mechanism of integrated circuits, the temperature field distribution in the chip and substrate is derived and solved when the chip works...