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Keywords: interface structure
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Journal Articles
Publisher: ASME
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020907.
Published Online: June 23, 2011
...Stephen L. Hodson; Thiruvelu Bhuvana; Baratunde A. Cola; Xianfan Xu; G. U. Kulkarni; Timothy S. Fisher Carbon nanotube (CNT) arrays can be effective thermal interface materials with high compliance and conductance over a wide temperature range. Here, we study CNT interface structures in which free...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 314–323.
Published Online: November 24, 2004
... be extended to include inelastic behavior, and can be adapted to problems involving external loads and a variety of geometries. The results have been compared to available data in the literature and finite element analysis. 15 04 2004 24 11 2004 elasticity interface structure thermal...
Journal Articles
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 397–402.
Published Online: December 12, 2002
... flip-chip devices integrated circuit interconnections encapsulation integrated circuit packaging plastic packaging shear strength heat treatment interface structure reflow soldering surface chemistry As the trend in requirements of electronic packaging is toward higher I/O, greater...