... Corresponding author. e-mail:  smh0083@auburn.edu 14 09 2022 15 12 2022 27 01 2023 microstructure BGA fatigue solder joint stress–strain The high-temperature variations in electronic packages, particularly during the operation of high power-density devices or in the presence...

... to be insensitive. Several failure modes were detected for Sn-3.5Ag in both shear strength and fatigue tests. 1 Corresponding author. e-mail:  smh0083@auburn.edu e-mail:  arnazmus.sakib@nxp.com 28 05 2022 16 08 2022 28 09 2022 microstructure Sn alloys shear fatigue solder...

...Zheng Liu; Li Yang; Yifeng Xiong; Huiming Gao The effect of trace Nb nanoparticles on the thermal properties, wettability, microstructure, and mechanical properties of Sn–0.7Cu solder alloy was investigated. The results showed that the melting temperature of Sn–0.7Cu composite solder alloy...

.... 27 11 2017 07 02 2019 lead-free solder hysteresis thermal cycling damage microstructure Electronic equipment for aerospace and military applications can encounter a wide range of environmental stresses mainly due to thermomechanical loadings (temperature variations...

...Chu-Hsuan Sha; Chin C. Lee A fundamental study is carried out to investigate the microstructure and surface treatment possibilities of 304 stainless steel (304SS) substrates. To expose the microstructure, mirror-finished 304SS is applied with a self-mixed etchant containing ammonium sulfite ((NH 4...

... integrated circuit bonding scanning electron microscopy silicon thermal expansion solid state bonding gold electroplating microstructure silicon chip alumina substrate Even though plastic packages are popular these days, ceramic packages still play as a significant role in high...

...Dapeng Zhu; Xiaoqin Lin; Le Luo The aim of this work is to evaluate the changes in microstructures and electrical properties of a tantalum nitride (Ta–N) thin film integrated on an aluminum anodization multichip module deposited (MCM-D) substrate. A Ta–N resistor with a thickness of 100 nm...