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Keywords: numerical simulation
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031017.
Paper No: EP-21-1164
Published Online: May 19, 2022
... ( 6 ), pp. 22 – 31 . https://www.copper.org/publications/pub_list/pdf/a4073.pdf electronics cooling manifold heat sink thermal resistance numerical simulation National Science Foundation 10.13039/100000001 NSF IUCRC Award No. IIP-1738793 and MRI Award No. CNS1040666...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021007.
Paper No: EP-13-1082
Published Online: April 29, 2014
... in microchannels to dissipate large heat fluxes approaching 1 kW/cm 2 . Steinke and Kandlikar [ 6 ] measured the heat transfer coefficients with the offset strip fin geometry investigated by Colgan et al. to be above 500,000 W/m 2 K. 3D IC electronics cooling numerical simulation temperature...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2013, 135(4): 041007.
Paper No: EP-13-1018
Published Online: November 5, 2013
..., which can be substantially improved by 5.43 times to 4165 cycles after optimized factor combination design based on the presented method. In this study, a DOE methodology based on numerical simulation was presented to improve thermal fatigue reliability of multirow QFN packages. The influences...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041010.
Published Online: December 6, 2012
... microchannel is superior to the traditional straight rectangular microchannel. It is suggested such wavy microchannel can be used to cool chips effectively with much smaller pressure drop penalty. transversal wavy microchannel pressure drop overall thermal resistance numerical simulation...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021005.
Published Online: April 1, 2009
... numerical simulation surrogate method optimization The ever-growing demands for handling high heat flux and trends toward miniaturization have encouraged intensive research in the field of microcooling technology. The limitations of space in microdevices and power to drive cooling devices have...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 348–355.
Published Online: December 19, 2006
... management (packaging) thermal resistance spreading resistance rectangular plate numerical simulation experimental investigation vapor chamber The need of integrating more functions to the electronic products with a stringent constraint on physical sizes has considerably elevated the power...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 200–210.
Published Online: September 3, 1999
... . Manuscript received by the EEPD September 3, 1999. Associate Editor: R. Wirtz. 03 September 1999 packaging finite volume methods heat transfer convergence of numerical methods temperature distribution thermodynamics Cabinets Numerical Simulation Experimental Validation Volume...