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Keywords: pool boiling
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Journal Articles

Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

Omidreza Ghaffari, Wei Tong, Yaser Nabavi Larimi, Chady al Sayed, Alireza Ganjali, Jean-François Morissette, Francis Grenier, Simon Jasmin, Luc Fréchette, Julien Sylvestre
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041103.
Paper No: EP-21-1083
https://doi.org/10.1115/1.4051943
Published Online: August 27, 2021
... of electronics. Reference pool boiling tests were performed by attaching a 25.4 mm by 25.4 mm square copper plate to a same-sized heater, thus minimizing lateral heat spreading. Experimental measurements showed that the critical heat flux (CHF) happened at a heat flux of 17.4±0.8 W/cm 2 . Then, lateral heat...
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Topics: Boiling, Cooling, Dielectric liquids, Heat, Temperature, Copper, Flat heat pipes, Pool boiling, Critical heat flux, Subcooling
Journal Articles

Investigation of Microporous Coatings and Mesoscale Evaporator Enhancements for Two-Phase Cooling of Electronic Components

Mark A. Trautman, Murli Tirumala, S. M. You
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011007.
https://doi.org/10.1115/1.2837509
Published Online: February 4, 2008
... 2007 04 02 2008 coatings cooling electronics packaging evaporation heat conduction microprocessor chips pool boiling microporous enhancement electronics cooling heat spreader experimental Historically the power dissipated from a microprocessor has increased with its...
View Article titled, Investigation of Microporous Coatings and Mesoscale Evaporator Enhancements for Two-Phase Cooling of Electronic Components
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Topics: Boiling, Coatings, Cooling, Heat, Fluids, Fins, Heat conduction, Coating processes