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Keywords: pressure-less sinteringClose
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041013.
Paper No: EP-21-1109
Published Online: February 1, 2022
...Xinyue Wang; Zejun Zeng; Guoqi Zhang; Jing Zhang; Pan Liu Recent years, the sintered silver paste was introduced and further developed for power electronics packaging due to low processing temperature and high working temperature. The pressure-less sintering technology reduces the stress damage...