... − 1 L ∕ s for the Pb-free SAC 387 alloy. It is also found that an axial stress influences shear deformation significantly. In return, the shear deformation also influences the axial creep deformation behavior. Pb-free alloys may be very...

... particles in bond pad aluminum metallization are the potential site of void nucleation. 06 09 2004 23 11 2005 lead bonding integrated circuit packaging integrated circuit metallisation materials testing shear deformation nucleation ductile fracture mechanical testing voids...

..., with both step-function and sinusoidal temperature histories being considered. The time-dependent effects in the array’s shear deformation are introduced in an approximate manner by modeling the interconnect material (solder) as a temperature-independent linear viscoelastic material. The viscoelastic...

... is from room temperature to 100°C. In the second case, the real-time technique was used to monitor and measure the shear deformations of solder joints and the warpage of the assembly during the test. For the real-time measurements of thermal deformations, a small-sized thermal chamber having an optical...

.... The modeled axial strain distribution coincided well with the distribution of microstructure coarsening visible in cross sections. The mismatch of thermal expansion resulted in an overall warpage of the assembly for the case with underfill, which decreased the shear deformation of the solder joints...

... of temperature. Classical laminated plate theory and first-order shear deformation theory solutions for the out-of-plane deflection of a bare board configuration with two opposite edges simply supported and the remaining edges free were obtained. The weight of the board was approximated as a distributed...

... laminar layer, which produces a DNP-dependent shear deformation of the layer. The effect of the underfill on the deformation of the microstructures is investigated and its implications on the package reliability are discussed. [S1043-7398(00)01304-9] Contributed by the Electrical and Electronic...

... Solder Interconnects ,” ASME J. Electron. Packag. , 120 , No. 1 , pp. 12 – 17 . Heinrich , S. M. , Shakya , S. , and Lee , P. S. , 1998 , “ Shearing Deformation in Partial Areal Arrays: Analytical Results ,” ASME J. Electron. Packag. , 120 , No. 1 , pp. 18 – 23 . Swanson...