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Keywords: stress
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Journal Articles
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2019, 141(4): 040802.
Paper No: EP-18-1117
Published Online: May 17, 2019
...; published online May 17, 2019. Assoc. Editor: Tse Eric Wong. 18 12 2018 27 03 2019 solder joint fatigue reliability stress strain creep The electronic packaging industry is one of the largest industries in the world [ 1 ]. The role of solder in the electronic packaging has...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021006.
Paper No: EP-14-1025
Published Online: June 1, 2015
...Fei Su; Zheng Zhang; Yuan Wang; Weijia Li Solder morphology changed frequently under current stressing at 8 A (190–450 A/mm 2 ). The catastrophic failure of the solder was caused by an interfacial crack that was initiated at the cathode and gradually extended downward from the surface...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 287–290.
Published Online: August 24, 2006
...Päivi H. Karjalainen; Pekka Heino New packaging materials make it possible to produce flexible system in package (SIP) and system on package (SOP) modules. However, in these the integrated circuits are exposed to increased mechanical stresses. The stresses may become even more severe when thinned...