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Keywords: system-in-package
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Journal Articles

Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards

John H. Lau, M. S. Zhang, S. W. Ricky Lee
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031010.
DOI: https://doi.org/10.1115/1.4004861
Published Online: September 26, 2011
... 2011 26 09 2011 26 09 2011 embedded systems hybrid integrated circuits integrated circuit interconnections integrated optoelectronics optical interconnections printed circuits system-in-package thermal management (packaging) three-dimensional integrated circuits...
View Article titled, Embedded Three-Dimensional Hybrid Integrated Circuit Integration <span class="search-highlight">System</span>-in-<span class="search-highlight">Package</span> With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates&#x2F;Printed Circuit Boards
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Topics: Design, Polymers, System-in-package, Waveguides, Simulation, Printed circuit boards, Optical interconnections, Integrated circuits, Engineering simulation, Heat
Journal Articles

Laser-Based Target Preparation in 3D Integrated Electronic Packages

Stefan Martens, Walter Mack, Frédéric Courtade, Philippe Perdu, Juergen Wilde, Friedemann Voelklein
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031006.
DOI: https://doi.org/10.1115/1.3144157
Published Online: June 23, 2009
...-Transmissionselektronenmikroskopie zur Zeitaufgelösten Untersuchung der Laserablation Dünner Metallfolien ,” Ph.D. thesis, Technische Universität Berlin, Germany. 02 12 2008 22 04 2009 23 06 2009 failure analysis laser materials processing system-in-package One of the major trends in electronic...
View Article titled, Laser-Based Target Preparation in 3D Integrated Electronic Packages
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Topics: Lasers, Silicon
Journal Articles

Nondestructive Failure Analysis and Simulation of Encapsulated 0402 Multilayer Ceramic Chip Capacitors Under Thermal and Mechanical Loading

B. Wunderle, T. Braun, D. May, B. Michel, H. Reichl
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011012.
DOI: https://doi.org/10.1115/1.3078187
Published Online: February 13, 2009
...B. Wunderle; T. Braun; D. May; B. Michel; H. Reichl The use of multilayer ceramic chip capacitors as integrated passive in, e.g., system in package applications needs methods to examine and predict their reliability. Therefore, a nondestructive failure analytical technique is described to detect...
View Article titled, Nondestructive Failure Analysis and Simulation of Encapsulated 0402 Multilayer Ceramic Chip Capacitors Under Thermal and Mechanical Loading
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Topics: Capacitors, Ceramics, Fracture (Materials), Capacitance, Simulation
Journal Articles

On-Wafer Capacitors Under Mechanical Stress

Päivi H. Karjalainen, Pekka Heino
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 287–290.
DOI: https://doi.org/10.1115/1.2753918
Published Online: August 24, 2006
...Päivi H. Karjalainen; Pekka Heino New packaging materials make it possible to produce flexible system in package (SIP) and system on package (SOP) modules. However, in these the integrated circuits are exposed to increased mechanical stresses. The stresses may become even more severe when thinned...
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Topics: Capacitors, Semiconductor wafers, Stress, Complementary metal oxide semiconductors