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Keywords: system-in-package
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Journal Articles
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031006.
Published Online: June 23, 2009
...-Transmissionselektronenmikroskopie zur Zeitaufgelösten Untersuchung der Laserablation Dünner Metallfolien ,” Ph.D. thesis, Technische Universität Berlin, Germany. 02 12 2008 22 04 2009 23 06 2009 failure analysis laser materials processing system-in-package One of the major trends in electronic...
Topics: Lasers, Silicon
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011012.
Published Online: February 13, 2009
...B. Wunderle; T. Braun; D. May; B. Michel; H. Reichl The use of multilayer ceramic chip capacitors as integrated passive in, e.g., system in package applications needs methods to examine and predict their reliability. Therefore, a nondestructive failure analytical technique is described to detect...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 287–290.
Published Online: August 24, 2006
...Päivi H. Karjalainen; Pekka Heino New packaging materials make it possible to produce flexible system in package (SIP) and system on package (SOP) modules. However, in these the integrated circuits are exposed to increased mechanical stresses. The stresses may become even more severe when thinned...