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Keywords: system-in-package
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Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031006.
Published Online: June 23, 2009
... materials processing system-in-package One of the major trends in electronic packaging is 3D integration. 3D integrated system-in packages (SiPs) are smaller, lighter, and thinner, and have improved interchip signals and power distribution. Moreover, SiP technology allows various electronic...
Topics: Lasers, Silicon
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011012.
Published Online: February 13, 2009
...B. Wunderle; T. Braun; D. May; B. Michel; H. Reichl The use of multilayer ceramic chip capacitors as integrated passive in, e.g., system in package applications needs methods to examine and predict their reliability. Therefore, a nondestructive failure analytical technique is described to detect...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 287–290.
Published Online: August 24, 2006
...Päivi H. Karjalainen; Pekka Heino New packaging materials make it possible to produce flexible system in package (SIP) and system on package (SOP) modules. However, in these the integrated circuits are exposed to increased mechanical stresses. The stresses may become even more severe when thinned...