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Keywords: thermal cycling
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011003.
Paper No: EP-23-1001
Published Online: May 15, 2023
... fatigue thermal cycling BGA surrogate-model The ever-rising electrification and the increasing percentage of electrified vehicles lead to a wider range of electronic equipment. Due to changing thermal loads and vibrations, these components need to withstand challenging conditions during...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031012.
Paper No: EP-21-1125
Published Online: December 27, 2021
... are performed for sintered silver in typical die-attach interconnection under different thermal cycles. Based on thermal cycling test, the Young's modulus and hardness of sintered silver layer have been presented. It is found that the Young's modulus and hardness of sintered silver layer changes slightly...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031110.
Paper No: EP-20-1013
Published Online: May 13, 2020
..., as potential midtemperature mPCM, has been evaluated. The results suggest that these mPCMs maintain their thermo-physical stability over large periods of thermal cycles. This work is in part a work of the U.S. Government. ASME disclaims all interest in the U.S. Government's contributions. 12 01...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031011.
Paper No: EP-18-1099
Published Online: May 24, 2019
...Mahsa Montazeri; Cody J. Marbut; David Huitink In this work, a rapid and low-cost accelerated reliability test methodology which was designed to simulate mechanical stresses induced in flip–chip bonded devices during the thermal cycling reliability test under isothermal conditions, is introduced...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021002.
Paper No: EP-17-1123
Published Online: March 1, 2019
... thermal cycling is complex, and their small dimensions prevent direct measurements from being performed. This paper reports the experimentation based on strain gage measurements, allowing the construction of the shear stress–strain hysteresis loop corresponding to Sn3.0Ag0.5Cu (SAC305) solder joints...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021001.
Published Online: June 22, 2011
... in thermal cycling together with controls soldered with a SAC305 paste. Mixed joints were found to outperform pure SAC305 in −40/125°C tests but not in 0/100°C, and general trends suggest that mixed joints may compare more poorly in service. 27 09 2009 03 02 2011 22 06 2011 22 06 2011...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011005.
Published Online: January 31, 2008
...Dezhi Li; Changqing Liu; Paul P. Conway The reliability of fine pitch Sn–3.8Ag–0.7Cu flip chip solder joints with three different pads, i.e., bare pads, pads with solder masks, and pads with microvia, on printed circuit boards (PCBs) was studied through thermal cycling. After assembly, ( Au , Ni...
Journal Articles
Journal Articles