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Keywords: thermal engineering
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Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Foreword
J. Electron. Packag. December 2004, 126(4): 409.
Published Online: January 24, 2005
... that symposium and is a token of appreciation for Richard Chu’s sustained contributions to electronics cooling and thermal management of electronic systems. Richard Chu began his professional career at IBM in 1960 as a thermal engineer. During these early years he worked on the development of the IBM System...
