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Keywords: thermal interface material
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031014.
Paper No: EP-21-1121
Published Online: March 8, 2022
... of China 10.13039/501100001809 51975594 National Natural Science Foundation of China 10.13039/501100001809 U20A6004 microelectronics packaging flip chip reliability electric-thermal-force multi-field coupling high current density thermal interface material 11 07 2021 13...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031007.
Paper No: EP-21-1039
Published Online: September 15, 2021
.... The improvement of flip chip reliability by using thermal interface materials was studied. First, a three-dimensional finite element model of the flip chip packaging system and the finite element simulation of electric-thermal-force multifield coupling were conducted. Then, the Joule heating, temperature...
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Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2014, 136(3): 034502.
Paper No: EP-13-1099
Published Online: May 12, 2014
..., 2014. Assoc. Editor: Masaru Ishizuka. 07 09 2013 04 04 2014 AlN thin film was coated over Cu substrate (575 mm 2 ) with 400 nm thickness using DC sputtering for thermal interface material (TIM) application. Aluminum Nitride (AlN)-coated Cu substrate (AlN/Cu) was used as a heat sink...
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011009.
Paper No: EP-13-1088
Published Online: January 24, 2014
...; published online January 24, 2014. Assoc. Editor: Masaru Ishizuka. 15 08 2013 25 12 2013 Thermal grease, as a thermal interface material (TIM), has been extensively applied in electronic packaging areas. Generally, thermal greases consist of highly thermally conductive solid fillers...
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Journal Articles