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Keywords: thermal reliability
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041003.
Paper No: EP-18-1070
Published Online: May 24, 2019
... error was less than 2.5%. By optimizing process parameters, the shear strength between dam and DPC substrate reached up to 9.5 MPa. Moreover, thermal cycle and heat resistance tests confirmed that 3DPC exhibits excellent thermal reliability. All experimental results demonstrated that 3DPC ceramic...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021006.
Published Online: June 23, 2010
... ultrasound thermal reliability Based on the report from the International Technology Roadmap for Semiconductors (ITRS) ( 1 ), the power of high performance packaging is projected to increase from 170 W in 2005 to 288 W in 2016. For low-cost packaging, the power is projected to increase from 2.4 W...