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Keywords: thermal stress cracking
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Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021001.
Published Online: June 22, 2011
.... ball grid arrays copper alloys lead alloys printed circuits reflow soldering reliability silver alloys solders thermal stress cracking tin alloys backward compatible mixed solder lead-free thermal cycling A large number of high reliability microelectronics applications...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021009.
Published Online: May 9, 2008
... underfill versus viscoelastic underfill) 21 02 2007 26 09 2007 09 05 2008 assembling flip-chip devices integrated circuit interconnections integrated circuit layout integrated circuit reliability thermal stress cracking viscoelasticity In Part 1 of this paper...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2008, 130(2): 024501.
Published Online: May 8, 2008
... cutting laser thermal stress packaging material 02 12 2006 05 09 2007 08 05 2008 aluminium compounds gas lasers laser beam cutting laser beam machining thermal stress cracking Aluminum nitride (AlN) is an effective electronic packaging material due to its excellent...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 300–306.
Published Online: November 29, 2006
... finite element analysis glass seals (stoppers) thermal management (packaging) thermal stress cracking wires Airbags were responsible for saving nearly 17,000 lives between 1975 and 2004 ( 1 ). Currently about 150 million vehicles in the United States are equipped with airbags...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2004, 126(4): 560–564.
Published Online: January 24, 2005
...) integrated circuit reliability integrated circuit packaging creep testing thermal stress cracking solders Young's modulus thermal expansion glass transition thermal analysis finite element analysis The need of ultra-dense and high I/O for integrated circuit designs has driven the development...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 325–332.
Published Online: October 6, 2004
... 01 Jan 2004 06 10 2004 thermoelasticity heat conduction thermal stress cracking integrated circuit reliability thermal stresses Fourier series integrated circuit packaging The chip-substrate structure is an important part of IC (integrated circuits) devices in which...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 268–275.
Published Online: July 28, 2004
... Phase angle (left crack tip, r ̂ = 10 μ m ) with right crack tip at 0 and 20 μ m from corner 22 07 2004 28 07 2004 integrated circuit packaging thermal management (packaging) soldering thermal stress cracking fracture delamination When...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 164–171.
Published Online: June 8, 2004
... , pp. 25 – 37 . integrated circuit packaging plastic packaging encapsulation soldering delamination fracture mechanics viscoelasticity elasticity thermal analysis thermal stress cracking As vapor pressure is influenced by the content of the absorbed moisture, the analytical...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 531–538.
Published Online: December 15, 2003
... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received November 2002. Associate Editor: L. Ernst. 01 November 2002 15 12 2003 soldering flip-chip devices creep thermal stress cracking fatigue The removal of lead from electronic products necessitates the replacement...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 562–568.
Published Online: December 15, 2003
... devices thermal stress cracking finite element analysis failure analysis As new packaging technologies emerge, thermo-mechanical reliability aspects have to be optimized or compared to the traditional approaches. Accordingly, the ability of the computational design of reliable solder joints...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2003, 125(4): 624–629.
Published Online: December 15, 2003
... stress analysis thermal stress cracking temperature distribution plastic packaging Flip chip (FC) technology can achieve the highest ratio of active silicon surface area since it does not employ the peripheral wire bonding. In this way, it can be used to achieve a very large number of fine...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 426–430.
Published Online: September 17, 2003
... 2002 17 09 2003 ball grid arrays thermal stress cracking soldering reliability surface mount technology finite element analysis Thermal fatigue has been one of the most serious problems for solder joint reliability in electronic packaging. Many researchers have studied...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 347–353.
Published Online: September 17, 2003
... Congress, New York, NY, November 11–16, 2001. Manuscript received at ASME Headquarters, Sept. 2002. Associate Editor: J. Lau. 11 November 2001 01 Sep 2002 17 09 2003 plastic packaging ball grid arrays thermal stress cracking soldering finite element analysis modelling...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 261–267.
Published Online: June 10, 2003
... integrated circuit modelling finite element analysis plastic packaging optical fibre theory thermal stress cracking Thermal stresses and deformations are the major contributor to malfunctions of, and failures in, microelectronics and photonics systems. Various kinds of thermal stress and strain...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 84–92.
Published Online: March 14, 2003
... has a smaller CTE, a higher Young modulus and a higher glass transition temperature 3 4 . tin alloys lead alloys flip-chip devices chip-on-board packaging soldering thermal stress cracking plastic deformation acoustic microscopy inspection finite element analysis viscoelasticity...