Search Results | J. Heat Transfer | ASME Digital Collection

1-20 of 53

2 3

Sort by

Sort Order Select

Journal Articles

Air Cooling of Power Electronics Through Vertically Enhanced Manifold Microchannel Systems (VEMMS)

Sevket U. Yuruker, Raphael K. Mandel, Patrick McCluskey, Michael M. Ohadi

J. Heat Transfer. October 2021, 143(10): 101501.

Paper No: HT-21-1514

DOI: https://doi.org/10.1115/1.4051999

Published Online: September 8, 2021

View Article

Topics: Cooling, Electronics, Flow (Dynamics), Heat, Heat sinks, Manifolds, Manufacturing, Microchannels, Switches, Thermal management

Journal Articles

Single Phase Liquid Cooling of High Heat Flux Devices With Local Hotspot in a Microgap With Nonuniform Fin Array

Yuanchen Hu, Thomas Sarvey, Muhannad S. Bakir, Yogendra Joshi

J. Heat Transfer. March 2021, 143(3): 031501.

Paper No: HT-20-1115

DOI: https://doi.org/10.1115/1.4049189

Published Online: January 18, 2021

View Article

Topics: Cooling, Design, Flow (Dynamics), Heat flux, Hydrofoil, Pressure drop, Temperature, Coolants, Fins, Heat transfer coefficients

Journal Articles

Thermal-Hydraulic Performance of Circular Electronic Components With Parabolic and Hyperbolic Front Facing the Upstream Flow

Ashwin Mahendra, Rajendran Senthil Kumar

J. Heat Transfer. January 2021, 143(1): 011501.

Paper No: HT-19-1705

DOI: https://doi.org/10.1115/1.4048623

Published Online: November 4, 2020

View Article

Topics: Drag (Fluid dynamics), Electronic components, Flow (Dynamics), Fluids, Heat transfer, Reynolds number, Pressure drop, Shapes, Cylinders, Pressure

Journal Articles

Temperature Fields Generated by a Circular Heat Source: Solution of a Composite Solid of Two Different Isotropic Semi-Infinite Media

Michael Emanuel, Avi Emanuel

J. Heat Transfer. December 2019, 141(12): 121401.

Paper No: HT-19-1412

DOI: https://doi.org/10.1115/1.4044829

Published Online: October 8, 2019

View Article

Topics: Composite materials, Heat, Temperature, Flux (Metallurgy), Steady state

Journal Articles

Thermal Performance of Microelectronic Substrates With Submillimeter Integrated Vapor Chamber

Sangbeom Cho, Yogendra Joshi

J. Heat Transfer. May 2019, 141(5): 051401.

Paper No: HT-18-1568

DOI: https://doi.org/10.1115/1.4042328

Published Online: March 27, 2019

View Article

Topics: Copper, Heat, Vapors, Condensers (steam plant), Columns (Structural), Heat conduction, Heat transfer

Journal Articles

Constructal Placement of Discrete Heat Sources With Different Lengths in Vertical Ducts Under Natural and Mixed Convection

Bugra Sarper, Mehmet Saglam, Orhan Aydin

J. Heat Transfer. December 2018, 140(12): 121401.

Paper No: HT-18-1224

DOI: https://doi.org/10.1115/1.4041187

Published Online: September 25, 2018

View Article

Topics: Heat, Mixed convection, Natural convection, Temperature, Heat transfer, Convection

Journal Articles

Passive Heat Transfer in Solid-State Lighting: Relaxing the Boussinesq Approximation Analytically in the Vertical Channel

Thomas D. Dreeben

J. Heat Transfer. April 2016, 138(4): 041401.

Paper No: HT-15-1537

DOI: https://doi.org/10.1115/1.4032176

Published Online: January 12, 2016

View Article

Topics: Approximation, Boundary layers, Flow (Dynamics), Heat, Heat transfer, Simulation, Temperature, Thermal boundary layers, Convection, Heat flux

Journal Articles

Optimal Time-Varying Heat Transfer in Multilayered Packages With Arbitrary Heat Generations and Contact Resistance

M. Fakoor-Pakdaman, Mehran Ahmadi, Farshid Bagheri, Majid Bahrami

J. Heat Transfer. August 2015, 137(8): 081401.

Paper No: HT-13-1570

DOI: https://doi.org/10.1115/1.4028243

Published Online: August 1, 2015

View Article

Topics: Boundary-value problems, Composite materials, Contact resistance, Fluids, Heat, Temperature, Heat transfer, Convection, Radiation (Physics)

Journal Articles

Thermal Resistance in a Rectangular Flux Channel With Nonuniform Heat Convection in the Sink Plane

M. Razavi, Y. S. Muzychka, S. Kocabiyik

J. Heat Transfer. November 2015, 137(11): 111401.

Paper No: HT-14-1786

DOI: https://doi.org/10.1115/1.4030885

Published Online: July 21, 2015

View Article

Topics: Heat transfer coefficients, Thermal resistance, Convection, Heat sinks, Boundary-value problems, Cooling, Finite element methods

Journal Articles

Convective Heat Transfer and Contact Resistances Effects on Performance of Conventional and Composite Thermoelectric Devices

B. V. K. Reddy, Matthew Barry, John Li, Minking K. Chyu

J. Heat Transfer. October 2014, 136(10): 101401.

Paper No: HT-13-1227

DOI: https://doi.org/10.1115/1.4028021

Published Online: August 5, 2014

View Article

Topics: Composite materials, Convection, Temperature, Boundary-value problems, Junctions, Heat recovery

Journal Articles

An Open Loop Pulsating Heat Pipe for Integrated Electronic Cooling Applications

Daniel Kearney, Justin Griffin

J. Heat Transfer. August 2014, 136(8): 081401.

Paper No: HT-13-1372

DOI: https://doi.org/10.1115/1.4027131

Published Online: April 17, 2014

View Article

Topics: Fluids, Heat, Heat pipes, Temperature, Ethanol, Thermal resistance, Heat transfer

Journal Articles

Electronics Cooling System and Component Design According to the Second Law

Ruben Gielen, Martine Baelmans

J. Heat Transfer. May 2014, 136(5): 051401.

Paper No: HT-13-1053

DOI: https://doi.org/10.1115/1.4026058

Published Online: February 26, 2014

View Article

Topics: Design, Entropy, Heat exchangers, Heat sinks, Temperature, Water

Journal Articles

Nonlocal Modeling and Swarm-Based Design of Heat Sinks

David Geb, Ivan Catton

J. Heat Transfer. January 2014, 136(1): 011401.

Paper No: HT-13-1158

DOI: https://doi.org/10.1115/1.4025300

Published Online: October 25, 2013

View Article

Topics: Design, Heat sinks, Optimization, Particle swarm optimization, Modeling, Fins, Thermal resistance, Temperature, Fluids

Journal Articles

Enhanced Flow Boiling Over Open Microchannels With Uniform and Tapered Gap Manifolds

Satish G. Kandlikar, Theodore Widger, Ankit Kalani, Valentina Mejia

J. Heat Transfer. June 2013, 135(6): 061401.

Paper No: HT-12-1537

DOI: https://doi.org/10.1115/1.4023574

Published Online: May 16, 2013

View Article

Topics: Boiling, Flow (Dynamics), Manifolds, Microchannels, Heat flux, Heat transfer

Journal Articles

Charging Station of a Planar Miniature Heat Pipe Thermal Ground Plane

Mohammed T. Ababneh, Shakti Chauhan, Frank M. Gerner, Doug Hurd, Peter de Bock, Tao Deng

J. Heat Transfer. February 2013, 135(2): 021401.

Paper No: HT-11-1479

DOI: https://doi.org/10.1115/1.4007430

Published Online: December 28, 2012

View Article

Topics: Calibration, Errors, Evacuations, Fluids, Heat pipes, Pressure, Vacuum, Valves, Water, Heat

Journal Articles

Thermoreflectance Measurement of Temperature and Thermal Resistance of Thin Film Gold

Christopher Cardenas, Drazen Fabris, Shawn Tokairin, Francisco Madriz, Cary Y. Yang

J. Heat Transfer. November 2012, 134(11): 111401.

DOI: https://doi.org/10.1115/1.4007068

Published Online: September 28, 2012

View Article

Topics: Heating, Temperature, Thermal resistance, Thermoreflectance, Thin films, Joules, Energy dissipation, Temperature measurement, Heat conduction, Calibration

Journal Articles

Thermal Investigation Into Power Multiplexing for Homogeneous Many-Core Processors

Man Prakash Gupta, Minki Cho, Saibal Mukhopadhyay, Satish Kumar

J. Heat Transfer. June 2012, 134(6): 061401.

DOI: https://doi.org/10.1115/1.4006012

Published Online: May 2, 2012

View Article

Topics: Temperature, Thermal management

Journal Articles

Reduced Order Thermal Modeling of Data Centers via Distributed Sensor Data

Emad Samadiani, Yogendra Joshi, Hendrik Hamann, Madhusudan K. Iyengar, Steven Kamalsy, James Lacey

J. Heat Transfer. April 2012, 134(4): 041401.

DOI: https://doi.org/10.1115/1.4004011

Published Online: February 13, 2012

View Article

Topics: Data centers, Modeling, Sensors, Temperature

Journal Articles

Design Optimization of Electrical Power Contact Using Finite Element Method

Amine Beloufa

J. Heat Transfer. January 2012, 134(1): 011401.

DOI: https://doi.org/10.1115/1.4004713

Published Online: November 8, 2011

View Article

Topics: Contact resistance, Design, Finite element analysis, Optimization, Stress, Temperature

Journal Articles

An Investigation of a Tunable Magnetomechanical Thermal Switch

Katherine E. Bulgrin, Y. Sungtaek Ju, Greg P. Carman, Adrienne S. Lavine

J. Heat Transfer. October 2011, 133(10): 101401.

DOI: https://doi.org/10.1115/1.4004166

Published Online: August 11, 2011

View Article

Topics: Elastic constants, Switches, Temperature, Gadolinium, Electrical conductance, Actuators

2 3

Journal citation

NARROW

Air Cooling of Power Electronics Through Vertically Enhanced Manifold Microchannel Systems (VEMMS)

Single Phase Liquid Cooling of High Heat Flux Devices With Local Hotspot in a Microgap With Nonuniform Fin Array

Thermal-Hydraulic Performance of Circular Electronic Components With Parabolic and Hyperbolic Front Facing the Upstream Flow

Temperature Fields Generated by a Circular Heat Source: Solution of a Composite Solid of Two Different Isotropic Semi-Infinite Media

Thermal Performance of Microelectronic Substrates With Submillimeter Integrated Vapor Chamber

Constructal Placement of Discrete Heat Sources With Different Lengths in Vertical Ducts Under Natural and Mixed Convection

Passive Heat Transfer in Solid-State Lighting: Relaxing the Boussinesq Approximation Analytically in the Vertical Channel

Optimal Time-Varying Heat Transfer in Multilayered Packages With Arbitrary Heat Generations and Contact Resistance

Thermal Resistance in a Rectangular Flux Channel With Nonuniform Heat Convection in the Sink Plane

Convective Heat Transfer and Contact Resistances Effects on Performance of Conventional and Composite Thermoelectric Devices

An Open Loop Pulsating Heat Pipe for Integrated Electronic Cooling Applications

Electronics Cooling System and Component Design According to the Second Law

Nonlocal Modeling and Swarm-Based Design of Heat Sinks

Enhanced Flow Boiling Over Open Microchannels With Uniform and Tapered Gap Manifolds

Charging Station of a Planar Miniature Heat Pipe Thermal Ground Plane

Thermoreflectance Measurement of Temperature and Thermal Resistance of Thin Film Gold

Thermal Investigation Into Power Multiplexing for Homogeneous Many-Core Processors

Reduced Order Thermal Modeling of Data Centers via Distributed Sensor Data

Design Optimization of Electrical Power Contact Using Finite Element Method

An Investigation of a Tunable Magnetomechanical Thermal Switch

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only