... 2023 artificial bee colony algorithm electronic cooling multi-objective optimization multiple PCMs melting and solidification Thermal management of electronics has emerged as a critical field of study, with continuous performance improvements (technological node) accompanied...

... heat transfer coefficient electronic cooling The development of efficient heat exchangers is imperative in addressing the challenge of increased levels of heat flux dissipation in high-performance miniature electronic devices. High-porosity metal foams (MFs) have emerged as highly efficient...

... for a variety of applications including electronics cooling. In this work, advanced heat management devices are designed and numerically studied employing single and multijet impingement through porous-filled channels with inclined walls. The base of these porous-filled nonuniform heat exchanging channels...

... with pumping power Electronic cooling Heat and mass transfer Heat exchangers Heat transfer enhancement Micro heat transfer Nanoscale heat transfer As the semiconductor industry develops rapidly, the heat production of electronic devices increases drastically. Recently, the researchers...

... received June 28, 2018; published online August 3, 2018. Assoc. Editor: Debjyoti Banerjee. 02 08 2017 28 06 2018 Electronic cooling Energy systems Melting Melting Freezing Solidification Despite the importance of viscosity effects, many of the studies on nanoinclusions...

... Computational fluid dynamics Electronic cooling Experimental techniques Heat and mass transfer Owing to their high efficiency, electrical machines are widely used in various industrial applications such as motors for automobiles, trains, electrical production in nuclear plants, and wind generators...

... Electronic cooling Evaporation Heat transfer enhancement Micro heat transfer Two-phase flow Boiling Condensation Nanoscale heat transfer Heat transfer The spray cooling heat transfer mechanisms are very complex due to many factors such as droplet parameters [ 3 – 5 ], nozzle-to-surface distance...

... role in double droplet train impingement cooling. This work was supported by the National Priority Research Program of the Qatar National Research Fund, Grant No.: NPRP 6-1304-2-525. 1 Corresponding author. 27 04 2018 09 05 2018 Bubbles Computational fluid dynamics Electronic...

... received May 8, 2017; final manuscript received November 13, 2017; published online June 29, 2018. Assoc. Editor: Zhixiong Guo. Computational fluid dynamics Conduction Electronic cooling Energy systems Heat exchangers Heat transfer enhancement Natural convection Porous media Thermal systems...

... temperature given the junction temperature for one specific instance of power dissipation and base temperature and hence may find applicability in fast electrothermal solvers. Conduction Electronic cooling Thermophysical properties An integrated circuit's junction (or channel) temperature...

.... Editor: Antonio Barletta. 02 10 2016 26 04 2018 Electronic cooling Extended surfaces Natural convection Thermal systems Mixed convection Heat is produced as a by-product during the normal operation from the electronic equipment. Miniaturization of these devices...

.... Tafti. 23 01 2018 20 04 2018 Conduction Electronic cooling Forced convection Heat and mass transfer In electronic devices such as computer processors and integrated circuits, the heating density is often large and is restricting the maximum computational power. Typically...

... Aerospace Electronic cooling Extended surfaces Heat exchangers Heat transfer enhancement Heat transfer Heat exchangers (HEXs) play a prominent role in aircraft thermal management systems, while the increasing requirement for effective cooling of aircraft subsystems is driving the efforts...

...; final manuscript received March 22, 2018; published online May 22, 2018. Assoc. Editor: Zhixiong Guo. 23 10 2017 22 03 2018 Electronic cooling Natural convection Radiative heat transfer Mixed convection The interaction between thermal radiation and natural convection...

... OF H EAT T RANSFER . Manuscript received April 24, 2017; final manuscript received October 29, 2017; published online April 6, 2018. Assoc. Editor: Alan McGaughey. 24 04 2017 29 10 2017 Conduction Electronic cooling Thermal management is considered as a key factor...

.... Contributed by the Heat Transfer Division of ASME for publication in the J OURNAL OF H EAT T RANSFER . Manuscript received October 31, 2016; final manuscript received January 6, 2018; published online March 30, 2018. Assoc. Editor: Antonio Barletta. 31 10 2016 06 01 2018 Electronic...

... ] as per Fig. 1 that depicts a structured microchannel etched into the upper portion of a microprocessor die. Computational fluid dynamics Electronic cooling Forced convection Heat transfer enhancement Micro heat transfer Nanoscale heat transfer 05 07 2017 18 01 2018...

..., 2017; final manuscript received October 16, 2017; published online January 30, 2018. Assoc. Editor: Ali Khounsary. 30 05 2017 16 10 2017 Electronic cooling Heat exchangers Micro heat transfer Nanoscale heat transfer Flow networks are characterized by a plurality...

... 13, 2017; published online January 30, 2018. Assoc. Editor: Zhixiong Guo. 30 03 2017 13 09 2017 Electronic cooling Natural convection Thermophysical properties Mixed convection Natural convection plays an important role in the cooling of electrical and electronic...

... in the J OURNAL OF H EAT T RANSFER . Manuscript received February 22, 2017; final manuscript received July 10, 2017; published online October 10, 2017. Assoc. Editor: Danesh K. Tafti. 22 02 2017 10 07 2017 Electronic cooling Forced convection Heat and mass transfer Heat transfer...