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Keywords: curing
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Eng. Mater. Technol. October 2011, 133(4): 041009.
Published Online: October 14, 2011
... the sonication cycle was completed, the mixture was then placed in a three roll milling processor for six successive cycles incrementally reduced from 20 to 5 μ m gap spacings at 140 rpm. Epikure curing agent W was then added to the modified resin and mixed using a high-speed mechanical stirrer. To reduce...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Eng. Mater. Technol. July 2011, 133(3): 031006.
Published Online: July 18, 2011
...Z. Ahmad; M. P. Ansell; D. Smedley Adhesives used for bonded-in steel or composite pultruded rods and plate to make connections in timber structures are commonly room temperature cure adhesives. The room temperature cure, applied without pressure, thixotropic, and shear thinning characteristics...
Journal Articles
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Eng. Mater. Technol. January 2010, 132(1): 011005.
Published Online: November 3, 2009
...% to maintain light weight structures. Several FGSF specimens having similar density are fabricated with different layer arrangements. The different layers are integrated before major solidification takes place. Quasistatic compression testing is then performed on the cured FGSF samples using MTS-810...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Eng. Mater. Technol. July 2008, 130(3): 031005.
Published Online: June 10, 2008
... epoxy resin. The epoxy∕clay compound is then mixed with EPI-CURE 3282 curing agent by a custom made molding setup and injected into a disk shaped mold cavity. Upon completion of curing, nanoclay dispersion is quantified on a sample cut along the radius of the composite disk. Dispersion of nanoclay...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Eng. Mater. Technol. October 2006, 128(4): 484–488.
Published Online: July 14, 2006
...L. Chen; J. Cao; Y. J. Weitsman This article concerns the minimization of residual thermal stresses in geometrically constrained adhesive layers and thin polymeric composite lay-ups with emphasis on the role of initial stresses. Such residual stresses evolve during cure and subsequently during post...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Eng. Mater. Technol. October 2006, 128(4): 595–602.
Published Online: May 19, 2006
... propagation and a contact algorithm to enforce crack closure due to an artificial wedge in the wake of the crack. The healing kinetics of the self-healing material is captured by introducing along the fracture plane a state variable representing the evolving degree of cure of the healing agent. The atomic...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Eng. Mater. Technol. October 2006, 128(4): 579–585.
Published Online: May 9, 2006
... with monotonic and cyclic loading. The agreement is very good for various loading regimes. The constitutive model is further implemented in a finite element code and the residual stresses arising from the curing process of polymer reinforced composites is determined for two different epoxy resins...
Journal Articles
Journal Articles
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Eng. Mater. Technol. January 2004, 126(1): 14–18.
Published Online: January 22, 2004
.... The rubber particles had larger diameters in the vicinity of the aluminum-adherend surface. It is possible that an interface with a aluminum adherend slows the curing rate of epoxy resin and the surfaces of aluminum adherends draw rubber particles due to the higher affinity between aluminum and butadiene...