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Abel Misrak
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Journal Articles

Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling

Abel Misrak, Rabin Bhandari, Dereje Agonafer
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011204.
Paper No: EP-21-1110
DOI: https://doi.org/10.1115/1.4054784
Published Online: August 3, 2022
View Article titled, Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling
Click here to open pdf in another window PDF for Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling
Topics: Glass transition, Reliability, Semiconductor wafers, Storage, Stress, Temperature, Testing, Viscoelasticity, Solders, Failure
Proceedings Papers

Impact of Immersion Cooling on Thermo-Mechanical Properties of PCB’s and Reliability of Electronic Packages

Shrinath Ramdas, Pavan Rajmane, Tushar Chauhan, Abel Misrak, Dereje Agonafer
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, October 7–9, 2019
Paper No: IPACK2019-6568
DOI: https://doi.org/10.1115/IPACK2019-6568
View Paper titled, Impact of Immersion Cooling on Thermo-Mechanical Properties of PCB’s and Reliability of Electronic Packages
Click here to open pdf in another window PDF for Impact of Immersion Cooling on Thermo-Mechanical Properties of PCB’s and Reliability of Electronic Packages
Topics: Cooling, Electronic packages, Printed circuit boards, Reliability, Thermomechanics
Journal Articles

Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers

Abel Misrak, Tushar Chauhan, Pavan Rajmane, Rabin Bhandari, Dereje Agonafer
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011011.
Paper No: EP-19-1064
DOI: https://doi.org/10.1115/1.4045157
Published Online: November 8, 2019
View Article titled, Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers
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Topics: Fillers (Materials), Fourier transform infrared spectroscopy, Infrared spectroscopy, Mechanical properties, Stress, Temperature, Testing, Thermomechanics, High temperature, Reliability
Journal Articles

Identification and Characterization of Particulate Contaminants Found at a Data Center Using Airside Economization

Jimil M. Shah, Abel Misrak, Dereje Agonafer, Mike Kaler
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031003.
Paper No: EP-18-1103
DOI: https://doi.org/10.1115/1.4043481
Published Online: May 8, 2019
View Article titled, Identification and Characterization of Particulate Contaminants Found at a Data Center Using Airside Economization
Click here to open pdf in another window PDF for Identification and Characterization of Particulate Contaminants Found at a Data Center Using Airside Economization
Topics: Data centers, Fourier transform infrared spectroscopy, Particulate matter, Scanning electron microscopy, Contamination, Dust
Proceedings Papers

A Computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing With Package Power Supply

Unique Rahangdale, Pavan Rajmane, Abel Misrak, Dereje Agonafer
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, August 29–September 1, 2017
Paper No: IPACK2017-74278
DOI: https://doi.org/10.1115/IPACK2017-74278
View Paper titled, A Computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing With Package Power Supply
Click here to open pdf in another window PDF for A Computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing With Package Power Supply
Topics: Manufacturing, Testing, Reliability, Stress, Lumber, Temperature, Failure, Finite element analysis, Young's modulus, Computation
Proceedings Papers

Reliability Analysis of Ultra-Low-K Large-Die Package and Wire Bond Chip Package on Varying Structural Parameter Under Thermal Loading

Unique Rahangdale, Pavan Rajmane, Abel Misrak, Dereje Agonafer
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, August 29–September 1, 2017
Paper No: IPACK2017-74279
DOI: https://doi.org/10.1115/IPACK2017-74279
View Paper titled, Reliability Analysis of Ultra-Low-K Large-Die Package and Wire Bond Chip Package on Varying Structural Parameter Under Thermal Loading
Click here to open pdf in another window PDF for Reliability Analysis of Ultra-Low-K Large-Die Package and Wire Bond Chip Package on Varying Structural Parameter Under Thermal Loading
Topics: Event history analysis, Wire, Reliability, Failure, Solders, Copper, Dielectric materials, Manufacturing, Microelectronic devices, Solder joints