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Proceedings Papers

Liquid to Air Cooling for High Heat Density Liquid Cooled Data Centers

Ali Heydari, Vahideh Radmard, Bahareh Eslami, Mohammad I. Tradat, Yaman Manaserh, Harold Miyamura, Uschas Chowdhury, Pardeep Shahi, Kevin Dave Hall, Bahgat Sammakia, Jeremy Rodriguez

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A005, October 25–27, 2022

Paper No: IPACK2022-97386

DOI: https://doi.org/10.1115/IPACK2022-97386

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Topics: Cooling, Data centers, Density, Heat, Heat exchangers

Proceedings Papers

Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry

William T. Chen, David Questad, David Read, Bahgat Sammakia

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 183-192, November 16–21, 1997

Paper No: IMECE1997-0515

DOI: https://doi.org/10.1115/IMECE1997-0515

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Topics: Fracture mechanics, Microelectronic packaging, Packaging, Ball-Grid-Array packaging, Electronic packaging, Design, Electronic packages, Electronic products, Low temperature, Manufacturing

Journal Articles

A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification

Ghazal Mohsenian, Cong Hiep Hoang, Kourosh Nemati, Hussam Alissa, Mohammad Tradat, Najmeh Fallahtafti, Vahideh Radmard, Bruce Murray, Bahgat Sammakia

J. Electron. Packag. December 2022, 144(4): 041015.

Paper No: EP-21-1139

DOI: https://doi.org/10.1115/1.4053643

Published Online: February 23, 2022

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Topics: Air flow, Design, Stress, Flow (Dynamics), Control systems, Heat, Data centers, Inertia (Mechanics)

Proceedings Papers

Thermal Issues That Arise due to Manufacturing Processes: Evaluation and Measurement Techniques

Bahgat Sammakia, Sanjeev Sathe

Proc. ASME. IMECE99, Electronics Manufacturing Issues, 121-138, November 14–19, 1999

Paper No: IMECE1999-0925

DOI: https://doi.org/10.1115/IMECE1999-0925

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Topics: Manufacturing, Heat sinks, Adhesives, Delamination, Design, Lamination, Signals, Stress, Accounting, Ball-Grid-Array packaging

Proceedings Papers

Some Transport Issues in the Development, Qualification, and Manufacture of Electronic Packages

Bahgat Sammakia, Koneru Ramakrishna, Frank Andros, Jayathi Y. Murthy, Vijay Sarihan, D. H. R. Sarma, Sanjeev Sathe

Proc. ASME. IMECE2001, Manufacturing Engineering, 461-463, November 11–16, 2001

Paper No: IMECE2001/MED-23350

DOI: https://doi.org/10.1115/IMECE2001/MED-23350

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Topics: Adhesives, Computer cooling, Computer simulation, Computers, Concurrent engineering, Design, Drilling, Electronic packages, Electronics, Engineering design processes

Proceedings Papers

Selection of Method for Fatigue Life Prediction Under Random Loading

Amit Awasthi, Stephen Mckeown, C. Sahay, Bahgat Sammakia

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 289-304, November 11–16, 2001

Paper No: IMECE2001/EPP-24738

DOI: https://doi.org/10.1115/IMECE2001/EPP-24738

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Topics: Algorithms, Aluminum, Copper, Cycles, Electronic packages, Fatigue, Fatigue failure, Fatigue life, Fatigue testing, Gaussian distribution

Journal Articles

Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model

Ayushman Singh, Srikanth Rangarajan, Leila Choobineh, Bahgat Sammakia

J. Electron. Packag. June 2022, 144(2): 021104.

Paper No: EP-20-1142

DOI: https://doi.org/10.1115/1.4052074

Published Online: September 24, 2021

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Topics: Composite materials, Energy storage, Thermal conductivity, Electronics, Optimization, Temperature, Design, Heat sinks, Latent heat, Phase change materials

Journal Articles

Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid

Bharath Ramakrishnan, Cong Hiep Hoang, Sadegh Khalili, Yaser Hadad, Srikanth Rangarajan, Arvind Pattamatta, Bahgat Sammakia

J. Electron. Packag. June 2021, 143(2): 020904.

Paper No: EP-20-1119

DOI: https://doi.org/10.1115/1.4049928

Published Online: March 5, 2021

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Topics: Boiling, Coolants, Cooling, Data centers, Density, Flow (Dynamics), Fluids, Heat flux, Heat transfer coefficients, Plates (structures)

Proceedings Papers

Effective Thermal Conductivity of Phase Change Material-Based Composites for High Heat Flux Electronic Cooling

Ayushman Singh, Srikanth Rangarajan, Leila Choobineh, Bahgat Sammakia

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 27–29, 2020

Paper No: IPACK2020-2562

DOI: https://doi.org/10.1115/IPACK2020-2562

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Topics: Composite materials, Computer cooling, Heat flux, Heat sinks, Phase change materials, Thermal conductivity

Proceedings Papers

Liquid Cooling Utilizing a Hybrid Microchannel/Multi-Jet Heat Sink: A Component Level Study of Commercial Product

Cong Hiep Hoang, Mohammad Tradat, Yaman Manaserh, Bharath Ramakrisnan, Srikanth Rangarajan, Yaser Hadad, Scott Schiffres, Bahgat Sammakia

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A008, October 27–29, 2020

Paper No: IPACK2020-2627

DOI: https://doi.org/10.1115/IPACK2020-2627

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Topics: Cooling, Fins, Heat sinks, Microchannels, Pressure drop, Thermal resistance

Journal Articles

Minimizing the Effects of On-Chip Hotspots Using Multi-Objective Optimization of Flow Distribution in Water-Cooled Parallel Microchannel Heatsinks

Yaser Hadad, Vahideh Radmard, Srikanth Rangarajan, Mahdi Farahikia, Gamal Refai-Ahmed, Paul R. Chiarot, Bahgat Sammakia

J. Electron. Packag. June 2021, 143(2): 021007.

Paper No: EP-19-1111

DOI: https://doi.org/10.1115/1.4048590

Published Online: October 30, 2020

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Topics: Design, Electrical resistivity, Flow (Dynamics), Pumps, Temperature, Optimization, Microchannels, Coolants, Pareto optimization, Heat flux

Journal Articles

An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient Information Technology Loads

Sadegh Khalili, Srikanth Rangarajan, Vadim Gektin, Husam Alissa, Bahgat Sammakia

J. Electron. Packag. December 2020, 142(4): 041002.

Paper No: EP-19-1138

DOI: https://doi.org/10.1115/1.4048180

Published Online: September 4, 2020

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Topics: Coolants, Cooling, Cooling systems, Flow (Dynamics), Fluids, Heat, Manifolds, Pressure, Stress, Temperature

Journal Articles

Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits

Srikanth Rangarajan, Yaser Hadad, Leila Choobineh, Bahgat Sammakia

J. Electron. Packag. December 2020, 142(4): 041109.

Paper No: EP-19-1123

DOI: https://doi.org/10.1115/1.4047471

Published Online: June 29, 2020

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Topics: Genetic algorithms, Heat, Optimization, Temperature, Artificial neural networks, Heat transfer, Integrated circuits, Algorithms, Boundary-value problems

Proceedings Papers

Optimal Arrangement of Multiple Heat Sources in Vertically Stacked Two-Layer 3-D IC Using Genetic Algorithm

Srikanth Rangarajan, Yaser Hadad, Leila Choobineh, Bahgat Sammakia

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, October 7–9, 2019

Paper No: IPACK2019-6334

DOI: https://doi.org/10.1115/IPACK2019-6334

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Topics: Artificial neural networks, Genetic algorithms, Heat

Proceedings Papers

An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient IT Load

Sadegh Khalili, Srikanth Rangarajan, Bahgat Sammakia, Vadim Gektin

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, October 7–9, 2019

Paper No: IPACK2019-6463

DOI: https://doi.org/10.1115/IPACK2019-6463

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Topics: Cooling, Fluids, Stress, Transients (Dynamics)

Journal Articles

Thermal Analysis of Cold Plate for Direct Liquid Cooling of High Performance Servers

Bharath Ramakrishnan, Yaser Hadad, Sami Alkharabsheh, Paul R. Chiarot, Bahgat Sammakia

J. Electron. Packag. December 2019, 141(4): 041005.

Paper No: EP-18-1069

DOI: https://doi.org/10.1115/1.4044130

Published Online: July 12, 2019

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Topics: Computer simulation, Coolants, Cooling, Flow (Dynamics), Pressure drop, Temperature, Thermal resistance, Heat, Heat transfer coefficients, Heat transfer

Journal Articles

Impact of Server Thermal Design on the Cooling Efficiency: Chassis Design

Sadegh Khalili, Husam Alissa, Kourosh Nemati, Mark Seymour, Robert Curtis, David Moss, Bahgat Sammakia

J. Electron. Packag. September 2019, 141(3): 031004.

Paper No: EP-18-1075

DOI: https://doi.org/10.1115/1.4042983

Published Online: April 10, 2019

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Topics: Air flow, Cooling, Data centers, Design, Exhaust systems, Fans, Leakage, Pressure, Sensors, Temperature

Proceedings Papers

Facility Cooling Failure Analysis of Direct Liquid Cooling System in Data Centers

Sami Alkharabsheh, Udaya L. N. Puvvadi, Bharath Ramakrishnan, Kanad Ghose, Bahgat Sammakia

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, August 27–30, 2018

Paper No: IPACK2018-8443

DOI: https://doi.org/10.1115/IPACK2018-8443

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Topics: Cooling, Cooling systems, Data centers, Failure analysis, Failure, Temperature, Coolants, Heat

Proceedings Papers

Experimental Analysis of Chiller Cooling Failure in a Small Size Data Center Environment Using Wireless Instrumentation

Mohammad Tradat, Bahgat Sammakia, Husam Alissa, Kourosh Nemati

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, August 27–30, 2018

Paper No: IPACK2018-8334

DOI: https://doi.org/10.1115/IPACK2018-8334

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Topics: Cooling, Data centers, Experimental analysis, Failure, Instrumentation, Cooling systems, Temperature, Containment, Equipment performance, Pressure

Proceedings Papers

Impact of Internal Design on the Efficiency of IT Equipment in a Hot Aisle Containment System: An Experimental Study

Sadegh Khalili, Husam Alissa, Kourosh Nemati, Mark Seymour, Robert Curtis, David Moss, Bahgat Sammakia

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, August 27–30, 2018

Paper No: IPACK2018-8422

DOI: https://doi.org/10.1115/IPACK2018-8422

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Topics: Containment systems, Design, Air flow, Containment, Cooling, Fans, Leakage, Sensors, Control equipment, Data centers

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Journal citation

NARROW

Liquid to Air Cooling for High Heat Density Liquid Cooled Data Centers

Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry

A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification

Thermal Issues That Arise due to Manufacturing Processes: Evaluation and Measurement Techniques

Some Transport Issues in the Development, Qualification, and Manufacture of Electronic Packages

Selection of Method for Fatigue Life Prediction Under Random Loading

Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model

Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid

Effective Thermal Conductivity of Phase Change Material-Based Composites for High Heat Flux Electronic Cooling

Liquid Cooling Utilizing a Hybrid Microchannel/Multi-Jet Heat Sink: A Component Level Study of Commercial Product

Minimizing the Effects of On-Chip Hotspots Using Multi-Objective Optimization of Flow Distribution in Water-Cooled Parallel Microchannel Heatsinks

An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient Information Technology Loads

Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits

Optimal Arrangement of Multiple Heat Sources in Vertically Stacked Two-Layer 3-D IC Using Genetic Algorithm

An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient IT Load

Thermal Analysis of Cold Plate for Direct Liquid Cooling of High Performance Servers

Impact of Server Thermal Design on the Cooling Efficiency: Chassis Design

Facility Cooling Failure Analysis of Direct Liquid Cooling System in Data Centers

Experimental Analysis of Chiller Cooling Failure in a Small Size Data Center Environment Using Wireless Instrumentation

Impact of Internal Design on the Efficiency of IT Equipment in a Hot Aisle Containment System: An Experimental Study

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