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1-20 of 96
Bahgat Sammakia
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Proceedings Papers
Ali Heydari, Vahideh Radmard, Bahareh Eslami, Mohammad I. Tradat, Yaman Manaserh, Harold Miyamura, Uschas Chowdhury, Pardeep Shahi, Kevin Dave Hall, Bahgat Sammakia, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A005, October 25–27, 2022
Paper No: IPACK2022-97386
Proceedings Papers
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 183-192, November 16–21, 1997
Paper No: IMECE1997-0515
Journal Articles
Ghazal Mohsenian, Cong Hiep Hoang, Kourosh Nemati, Hussam Alissa, Mohammad Tradat, Najmeh Fallahtafti, Vahideh Radmard, Bruce Murray, Bahgat Sammakia
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041015.
Paper No: EP-21-1139
Published Online: February 23, 2022
Proceedings Papers
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 121-138, November 14–19, 1999
Paper No: IMECE1999-0925
Proceedings Papers
Bahgat Sammakia, Koneru Ramakrishna, Frank Andros, Jayathi Y. Murthy, Vijay Sarihan, D. H. R. Sarma, Sanjeev Sathe
Proc. ASME. IMECE2001, Manufacturing Engineering, 461-463, November 11–16, 2001
Paper No: IMECE2001/MED-23350
Proceedings Papers
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 289-304, November 11–16, 2001
Paper No: IMECE2001/EPP-24738
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021104.
Paper No: EP-20-1142
Published Online: September 24, 2021
Journal Articles
Bharath Ramakrishnan, Cong Hiep Hoang, Sadegh Khalili, Yaser Hadad, Srikanth Rangarajan, Arvind Pattamatta, Bahgat Sammakia
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020904.
Paper No: EP-20-1119
Published Online: March 5, 2021
Proceedings Papers
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 27–29, 2020
Paper No: IPACK2020-2562
Proceedings Papers
Cong Hiep Hoang, Mohammad Tradat, Yaman Manaserh, Bharath Ramakrisnan, Srikanth Rangarajan, Yaser Hadad, Scott Schiffres, Bahgat Sammakia
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A008, October 27–29, 2020
Paper No: IPACK2020-2627
Journal Articles
Yaser Hadad, Vahideh Radmard, Srikanth Rangarajan, Mahdi Farahikia, Gamal Refai-Ahmed, Paul R. Chiarot, Bahgat Sammakia
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 021007.
Paper No: EP-19-1111
Published Online: October 30, 2020
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041002.
Paper No: EP-19-1138
Published Online: September 4, 2020
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041109.
Paper No: EP-19-1123
Published Online: June 29, 2020
Proceedings Papers
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, October 7–9, 2019
Paper No: IPACK2019-6334
Proceedings Papers
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, October 7–9, 2019
Paper No: IPACK2019-6463
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041005.
Paper No: EP-18-1069
Published Online: July 12, 2019
Journal Articles
Sadegh Khalili, Husam Alissa, Kourosh Nemati, Mark Seymour, Robert Curtis, David Moss, Bahgat Sammakia
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031004.
Paper No: EP-18-1075
Published Online: April 10, 2019
Proceedings Papers
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, August 27–30, 2018
Paper No: IPACK2018-8443
Proceedings Papers
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, August 27–30, 2018
Paper No: IPACK2018-8334
Proceedings Papers
Sadegh Khalili, Husam Alissa, Kourosh Nemati, Mark Seymour, Robert Curtis, David Moss, Bahgat Sammakia
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, August 27–30, 2018
Paper No: IPACK2018-8422
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