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Baratunde A. Cola
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Journal Articles

Nanostructured Carbon Electrodes for Increased Power Density in Flow Thermo-Electrochemical Generator Heat Sinks

Ali H. Kazim, Baratunde A. Cola
Journal: Journal of Electrochemical Energy Conversion and Storage
Article Type: Research-Article
J. Electrochem. En. Conv. Stor. February 2019, 16(1): 011007.
Paper No: JEECS-17-1142
DOI: https://doi.org/10.1115/1.4040819
Published Online: August 6, 2018
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Topics: Electrodes, Multi-walled nanotubes, Flow (Dynamics), Temperature, Electrolytes, Power density
Journal Articles

Mechanical Behavior of Carbon Nanotube Forests Grown With Plasma Enhanced Chemical Vapor Deposition: Pristine and Conformally Coated

Parisa Pour Shahid Saeed Abadi, Matthew R. Maschmann, Stephen L. Hodson, Timothy S. Fisher, Jeffery W. Baur, Samuel Graham, Baratunde A. Cola
Journal: Journal of Engineering Materials and Technology
Article Type: Technical Briefs
J. Eng. Mater. Technol. July 2017, 139(3): 034502.
Paper No: MATS-15-1149
DOI: https://doi.org/10.1115/1.4035622
Published Online: March 23, 2017
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Topics: Carbon nanotubes, Mechanical behavior, Plasma-enhanced chemical vapor deposition, Deformation, Stiffness
Proceedings Papers

The Impact of Interfacial Layers on the Thermal Boundary Resistance and Residual Stress in GaN on Si Epitaxial Layers

Luke Yates, Thomas L. Bougher, Thomas Beechem, Baratunde A. Cola, Samuel Graham
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A009, July 6–9, 2015
Paper No: IPACK2015-48259
DOI: https://doi.org/10.1115/IPACK2015-48259
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Topics: Gallium nitride, Interfacial thermal resistance, Stress, Polishing equipment, Electronics, Crystal structure, Electron mobility, Flow (Dynamics), Heat, Reliability
Proceedings Papers

Thermal Boundary Conductance at Metal-Graphene-Metal Interfaces Using Time-Domain Thermoreflectance Method

David B. Brown, Thomas L. Bougher, Baratunde A. Cola, Satish Kumar
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A004, July 6–9, 2015
Paper No: IPACK2015-48444
DOI: https://doi.org/10.1115/IPACK2015-48444
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Topics: Electrical conductance, Graphene, Metals, Thermoreflectance, Chemical vapor deposition, Copper foil
Proceedings Papers

Characterization of Carbon Nanotube Forest Interfaces Using Time Domain Thermoreflectance

Thomas L. Bougher, John H. Taphouse, Baratunde A. Cola
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A005, July 6–9, 2015
Paper No: IPACK2015-48587
DOI: https://doi.org/10.1115/IPACK2015-48587
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Topics: Carbon nanotubes, Thermoreflectance, Contact resistance, Heat transfer, Heating, Mechanical properties, Metrology, Probes, Thermal conductivity, Uncertainty
Proceedings Papers

Solvent Soaking and Drying of Carbon Nanotube Forests for Enhanced Contact Area and Thermal Interface Conductance

John H. Taphouse, Baratunde A. Cola
Proc. ASME. MNHMT2013, ASME 2013 4th International Conference on Micro/Nanoscale Heat and Mass Transfer, V001T03A012, December 11–14, 2013
Paper No: MNHMT2013-22225
DOI: https://doi.org/10.1115/MNHMT2013-22225
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Topics: Carbon nanotubes, Drying, Electrical conductance, Contact resistance, Bonding, Fluids, Mechanical properties, Phonons, Stiffness, Thermal resistance
Proceedings Papers

Thermal Interface Materials From Vertically Aligned Polymer Nanotube Arrays

Thomas L. Bougher, Virendra Singh, Baratunde A. Cola
Proc. ASME. MNHMT2013, ASME 2013 4th International Conference on Micro/Nanoscale Heat and Mass Transfer, V001T03A013, December 11–14, 2013
Paper No: MNHMT2013-22226
DOI: https://doi.org/10.1115/MNHMT2013-22226
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Topics: Nanotubes, Polymers, Thermal conductivity, Bonding, Fillers (Materials), Pressure, Carbon, Heat transfer, Quartz, Thermal resistance
Journal Articles

A Stepped-Bar Apparatus for Thermal Resistance Measurements

Dakotah R. Thompson, Sameer R. Rao, Baratunde A. Cola
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2013, 135(4): 041002.
Paper No: EP-13-1019
DOI: https://doi.org/10.1115/1.4025116
Published Online: August 13, 2013
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Topics: Heat, Measurement uncertainty, Temperature, Thermal resistance, Thermocouples, Uncertainty, Thermal conductivity, Errors, Design, ASTM International
Proceedings Papers

Thermal Conductivity Measurement of Individual Polythiophene Nanofibers With Suspended Micro-Resistance Thermometer Devices

Sally A. McMenamin, Annie Weathers, Virendra Singh, Michael T. Pettes, Baratunde A. Cola, Li Shi
Proc. ASME. MNHMT2012, ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer, 723-728, March 3–6, 2012
Paper No: MNHMT2012-75276
DOI: https://doi.org/10.1115/MNHMT2012-75276
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Topics: Nanofibers, Thermal conductivity measurement, Thermometers, Thermal conductivity, Temperature, Adhesives, Binders (Materials), Conducting polymers, Density, Fibers
Journal Articles

Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique

Joseph R. Wasniewski, David H. Altman, Stephen L. Hodson, Timothy S. Fisher, Anuradha Bulusu, Samuel Graham, Baratunde A. Cola
Journal: Journal of Electronic Packaging
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020901.
DOI: https://doi.org/10.1115/1.4005909
Published Online: June 11, 2012
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Topics: Bonding, Carbon nanotubes, Diffusion bonding (Metals), Steady state, Test facilities, Testing, Pressure, Thermal resistance, Nanotubes, Solders
Proceedings Papers

Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique

Joseph R. Wasniewski, David H. Altman, Stephen L. Hodson, Timothy S. Fisher, Anuradha Bulusu, Samuel Graham, Baratunde A. Cola
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 231-240, July 6–8, 2011
Paper No: IPACK2011-52148
DOI: https://doi.org/10.1115/IPACK2011-52148
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Topics: Carbon, Nanotubes, Steady state, Carbon nanotubes, Bonding, Design, Heat, Nanomaterials, Optimization, Pressure
Journal Articles

Palladium Thiolate Bonding of Carbon Nanotube Thermal Interfaces

Stephen L. Hodson, Thiruvelu Bhuvana, Baratunde A. Cola, Xianfan Xu, G. U. Kulkarni, Timothy S. Fisher
Journal: Journal of Electronic Packaging
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020907.
DOI: https://doi.org/10.1115/1.4004094
Published Online: June 23, 2011
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Topics: Carbon nanotubes, Palladium, Nanoparticles
Journal Articles

A Review of Carbon Nanotube Ensembles as Flexible Electronics and Advanced Packaging Materials

Satish Kumar, Baratunde A. Cola, Roderick Jackson, Samuel Graham
Journal: Journal of Electronic Packaging
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020906.
DOI: https://doi.org/10.1115/1.4004220
Published Online: June 17, 2011
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Topics: Carbon nanotubes, Electrodes
Proceedings Papers

Palladium Thiolate Bonding of Carbon Nanotube Thermal Interfaces for High-Temperature Electronics

Stephen L. Hodson, Thiruvelu Bhuvana, Baratunde A. Cola, Xianfan Xu, G. U. Kulkarni, Timothy S. Fisher
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 631-635, July 19–23, 2009
Paper No: InterPACK2009-89352
DOI: https://doi.org/10.1115/InterPACK2009-89352
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Topics: Bonding, Carbon nanotubes, Electronics, High temperature, Palladium, Electrical conductance, Temperature, Interface structure, Mechanical stability, Thermal resistance
Proceedings Papers

Carbon Nanotube Array Thermal Interfaces on Chemical Vapor Deposited Diamond

Baratunde A. Cola, Xianfan Xu, Timothy S. Fisher
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 967-969, July 8–12, 2007
Paper No: IPACK2007-33824
DOI: https://doi.org/10.1115/IPACK2007-33824
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Topics: Carbon nanotubes, Diamonds, Vapors, Diamond films, Nucleation (Physics), Plasmas (Ionized gases)
Proceedings Papers

Aluminum Foil/Carbon Nanotube Thermal Interface Materials

Baratunde A. Cola, Xianfan Xu, Timothy S. Fisher
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 901-903, July 8–12, 2007
Paper No: HT2007-32815
DOI: https://doi.org/10.1115/HT2007-32815
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Topics: Aluminum foil, Carbon nanotubes, Geometry, Hydrogen embrittlement, Packing (Shipments), Packings (Cushioning), Plasma-enhanced chemical vapor deposition, Temperature
Proceedings Papers

Carbon Nanotube Array Thermal Interfaces Enhanced With Paraffin Wax

Baratunde A. Cola, Stephen L. Hodson, Xianfan Xu, Timothy S. Fisher
Proc. ASME. HT2008, Heat Transfer: Volume 2, 765-770, August 10–14, 2008
Paper No: HT2008-56483
DOI: https://doi.org/10.1115/HT2008-56483
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Topics: Carbon nanotubes, Paraffin wax, Coating processes, Coatings, Electron field emission, Heat, Scanning electron microscopes, Solids, Testing, Thermal resistance
Proceedings Papers

Design, Synthesis, and Performance of a Carbon Nanotube/Metal Foil Thermal Interface Material

Baratunde A. Cola, Xianfan Xu, Timothy S. Fisher
Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 133-136, January 10–13, 2007
Paper No: MNC2007-21418
DOI: https://doi.org/10.1115/MNC2007-21418
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Topics: Carbon nanotubes, Design, Metal foil, Deformation, Heat conduction, Surface roughness
Journal Articles

Effects of Growth Temperature on Carbon Nanotube Array Thermal Interfaces

Baratunde A. Cola, Placidus B. Amama, Xianfan Xu, Timothy S. Fisher
Journal: Journal of Heat Transfer
Article Type: Technical Briefs
J. Heat Transfer. November 2008, 130(11): 114503.
DOI: https://doi.org/10.1115/1.2969758
Published Online: September 2, 2008
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Topics: Carbon nanotubes, Temperature, Thermal resistance, Plasmas (Ionized gases), Chemical vapor deposition, Silicon, Silver