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Journal Articles

An Origami-Based Medical Support System to Mitigate Flexible Shaft Buckling

Brandon Sargent, Jared Butler, Kendall Seymour, David Bailey, Brian Jensen, Spencer Magleby, Larry Howell
Journal: Journal of Mechanisms and Robotics
Article Type: Research Papers
J. Mechanisms Robotics. August 2020, 12(4): 041005.
Paper No: JMR-19-1228
DOI: https://doi.org/10.1115/1.4045846
Published Online: March 6, 2020
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Topics: Biomedicine, Buckling, Cylinders, Design, Instrumentation, Robots, Engineering prototypes, Robotics, Stress, Testing
Proceedings Papers

Patterned Carbon Nanotube Growth on Convex Cylindrical Stainless Steel Substrates for the Production of Coronary Stents

Warren Robison, Brian Jensen, Anton Bowden
Proc. ASME. IDETC-CIE2016, Volume 4: 21st Design for Manufacturing and the Life Cycle Conference; 10th International Conference on Micro- and Nanosystems, V004T08A021, August 21–24, 2016
Paper No: DETC2016-60243
DOI: https://doi.org/10.1115/DETC2016-60243
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Topics: Carbon nanotubes, Stainless steel, Stents, Cracking (Materials), Fracture (Process), Carbon, Manufacturing
Proceedings Papers

Simultaneous On-Chip Sensing and Actuation Using the Thermomechanical In-Plane Microactuator

Tyler Waterfall, Kendall Teichert, Brian Jensen
Proc. ASME. IDETC-CIE2007, Volume 3: 19th International Conference on Design Theory and Methodology; 1st International Conference on Micro- and Nanosystems; and 9th International Conference on Advanced Vehicle Tire Technologies, Parts A and B, 829-834, September 4–7, 2007
Paper No: DETC2007-34982
DOI: https://doi.org/10.1115/DETC2007-34982
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Topics: Actuators, Biological cells, Displacement, Microactuators, Microelectromechanical systems, Motion control, Sensors, Thermomechanics
Proceedings Papers

Simultaneous Electrical and Thermal Modeling of a Contact-Type RF MEMS Switch

Brian Jensen, Zhongde Wang, Kazuhiro Saitou, John L. Volakis, Katsuo Kurabayashi
Proc. ASME. IMECE2003, Microelectromechanical Systems, 225-228, November 15–21, 2003
Paper No: IMECE2003-41422
DOI: https://doi.org/10.1115/IMECE2003-41422
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Topics: Microelectromechanical systems, Modeling, Switches, Temperature, Contact resistance, Energy dissipation, Bulk solids, Currents, Metals