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Bruno Michel
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Proceedings Papers

Enhancement of Mass and Heat Transfer Using Herringbone-Inspired Microstructures for Application in Microfluidic Redox Flow Cells

Julian Marschewski, Patrick Ruch, Bruno Michel, Dimos Poulikakos
Proc. ASME. ICNMM2016, ASME 2016 14th International Conference on Nanochannels, Microchannels, and Minichannels, V001T07A001, July 10–14, 2016
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2016-7920
https://doi.org/10.1115/ICNMM2016-7920
View Paper titled, Enhancement of Mass and Heat Transfer Using Herringbone-Inspired Microstructures for Application in Microfluidic Redox Flow Cells
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Topics: Flow (Dynamics), Heat transfer, Microfluidics, Diffusion (Physics), Boundary layers, Chemical reactions, Coolants, Cooling, Dimensions, Electrolytes
Proceedings Papers

Thermal Design of a Hierarchical Radially Expanding Cavity for Two-Phase Cooling of Integrated Circuits

Arvind Sridhar, Chin Lee Ong, Stefan Paredes, Bruno Michel, Thomas Brunschwiler, Pritish Parida, Evan Colgan, Timothy Chainer, Catherine Gorle, Kenneth E. Goodson
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A039, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48690
https://doi.org/10.1115/IPACK2015-48690
View Paper titled, Thermal Design of a Hierarchical Radially Expanding Cavity for Two-Phase Cooling of Integrated Circuits
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Topics: Cavities, Cooling, Design, Integrated circuits, Fluids, Pressure, Blocks (Building materials), Computer simulation, Construction, Drainage
Journal Articles

Modeling of Two-Phase Evaporative Heat Transfer in Three-Dimensional Multicavity High Performance Microprocessor Chip Stacks

Yassir Madhour, Brian P. d'Entremont, Jackson Braz Marcinichen, Bruno Michel, John Richard Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021006.
Paper No: EP-13-1080
https://doi.org/10.1115/1.4027436
Published Online: April 29, 2014
View Article titled, Modeling of Two-Phase Evaporative Heat Transfer in Three-Dimensional Multicavity High Performance Microprocessor Chip Stacks
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Topics: Flow (Dynamics), Heat, Stress, Vapors, Heat flux, Temperature, Heat transfer
Proceedings Papers

Hot Water Cooled Electronics for High Exergetic Utility

Severin Zimmermann, Manish K. Tiwari, Ingmar Meijer, Bruno Michel, Dimos Poulikakos
Proc. ASME. HT2012, Volume 1: Heat Transfer in Energy Systems; Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat and Mass Transfer in Biotechnology; Environmental Heat Transfer; Visualization of Heat Transfer; Education and Future Directions in Heat Transfer, 373-380, July 8–12, 2012
Publisher: American Society of Mechanical Engineers
Paper No: HT2012-58432
https://doi.org/10.1115/HT2012-58432
View Paper titled, Hot Water Cooled Electronics for High Exergetic Utility
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Topics: Electronics, Hot water, Heat sinks, Cooling, Data centers, Coolants, Heat, Temperature, Engineering prototypes, Manifolds
Journal Articles

Surface Functionalization Mechanisms of Enhancing Heat Transfer at Solid-Liquid Interfaces

Javier V. Goicochea, Ming Hu, Bruno Michel, Dimos Poulikakos
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. August 2011, 133(8): 082401.
https://doi.org/10.1115/1.4003533
Published Online: April 26, 2011
View Article titled, Surface Functionalization Mechanisms of Enhancing Heat Transfer at Solid-Liquid Interfaces
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Topics: Atoms, Electrical conductance, Heat, Heat transfer, Quartz, Thermal conductivity, Water, Simulation, Chain, Hydrophilicity
Proceedings Papers

Direct Waste Heat Utilization From Liquid-Cooled Supercomputers

Thomas Brunschwiler, Gerhard Ingmar Meijer, Stephan Paredes, Werner Escher, Bruno Michel
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 8, 429-440, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-23352
https://doi.org/10.1115/IHTC14-23352
View Paper titled, Direct Waste Heat Utilization From Liquid-Cooled Supercomputers
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Topics: Carbon, Carbon dioxide, Climate, Cold climates, Combustion, Coolants, Cooling, Emissions, Energy budget (Physics), Flow (Dynamics)
Proceedings Papers

Surface Functionalization Mechanisms of Enhancing Heat Transfer at Solid-Liquid Interfaces

Ming Hu, Javier V. Goicochea, Bruno Michel, Dimos Poulikakos
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 791-796, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22362
https://doi.org/10.1115/IHTC14-22362
View Paper titled, Surface Functionalization Mechanisms of Enhancing Heat Transfer at Solid-Liquid Interfaces
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Topics: Atoms, Chain, Columns (Structural), Energy dissipation, Fluids, Heat, Heat flux, Heat transfer, Hydrophilicity, Molecular dynamics
Proceedings Papers

3D Integrated Water Cooling of a Composite Multilayer Stack of Chips

Fabio Alfieri, Manish K. Tiwari, Igor Zinovik, Dimos Poulikakos, Thomas Brunschwiler, Bruno Michel
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 565-574, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22813
https://doi.org/10.1115/IHTC14-22813
View Paper titled, 3D Integrated Water Cooling of a Composite Multilayer Stack of Chips
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Topics: Composite materials, Cooling, Water, Heat transfer, Heat, Modeling, Porous materials, Temperature, Computational fluid dynamics, Fins
Journal Articles

3D Integrated Water Cooling of a Composite Multilayer Stack of Chips

Fabio Alfieri, Manish K. Tiwari, Igor Zinovik, Dimos Poulikakos, Thomas Brunschwiler, Bruno Michel
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. December 2010, 132(12): 121402.
https://doi.org/10.1115/1.4002287
Published Online: September 22, 2010
View Article titled, 3D Integrated Water Cooling of a Composite Multilayer Stack of Chips
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Topics: Cooling, Flow (Dynamics), Fluids, Heat, Heat transfer, Materials properties, Porous materials, Temperature, Water, Simulation
Proceedings Papers

Progress in the Development of J Estimation Schemes for the RSE-M Code

Patrick Le Delliou, Jean-Philippe Sermage, Pierre Cambefort, Bruno Barthelet, Philippe Gilles, Bruno Michel
Proc. ASME. ICONE10, 10th International Conference on Nuclear Engineering, Volume 1, 771-778, April 14–18, 2002
Publisher: American Society of Mechanical Engineers
Paper No: ICONE10-22691
https://doi.org/10.1115/ICONE10-22691
View Paper titled, Progress in the Development of J Estimation Schemes for the RSE-M Code
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Topics: In-service inspection, Pipes, Power stations, Pressure, Pressurized water reactors, Shells, Stress, Surface cracks, Torsion
Proceedings Papers

Recent Advances for J Simplified Assessment in RSE-M Code

Bruno Michel, Jean-Philippe Sermage, Philippe Gilles, Bruno Barthelet, Patrick Le Delliou
Proc. ASME. PVP2003, Fatigue, Fracture, and Damage Analysis, 29-36, July 20–24, 2003
Publisher: American Society of Mechanical Engineers
Paper No: PVP2003-1986
https://doi.org/10.1115/PVP2003-1986
View Paper titled, Recent Advances for J Simplified Assessment in RSE-M Code
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Topics: Fracture (Materials), In-service inspection, Junctions, Pipes, Power stations, Pressure, Pressurized water reactors, Shells, Stress