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Journal Articles

Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept: Part 2—Verification and Application

C. Basaran, C. S. Desai, T. Kundu
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 48–53.
DOI: https://doi.org/10.1115/1.2792285
Published Online: March 1, 1998
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Topics: Electronic packaging, Finite element analysis, Thermomechanics, Alloys, Solders, Modeling, Surface mount technology
Journal Articles

Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept: Part 1—Theory and Formulation

C. Basaran, C. S. Desai, T. Kundu
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 41–47.
DOI: https://doi.org/10.1115/1.2792284
Published Online: March 1, 1998
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Topics: Electronic packaging, Finite element analysis, Thermomechanics, Constitutive equations, Cycles, Damage, Deformation, Design, Failure, Semiconductor devices
Journal Articles

Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part I—Unified Constitutive Model and Calibration

C. S. Desai, J. Chia, T. Kundu, J. L. Prince
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 294–300.
DOI: https://doi.org/10.1115/1.2792252
Published Online: December 1, 1997
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Topics: Calibration, Constitutive equations, Electronic packaging, Thermomechanics, Failure, Creep, Damage, Design, Fatigue, Fatigue failure
Journal Articles

Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part II—Unified Constitutive Models, Validation, and Design

C. S. Desai, J. Chia, T. Kundu, J. L. Prince
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 301–309.
DOI: https://doi.org/10.1115/1.2792253
Published Online: December 1, 1997
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Topics: Constitutive equations, Design, Electronic packaging, Thermomechanics, Failure, Fatigue, Fatigue failure, Modeling, Solders, Stress
Journal Articles

Detection of Delamination Cracks in Layered Fiber-Reinforced Composite Plates

M. R. Karim, T. Kundu, C. S. Desai
Journal: Journal of Pressure Vessel Technology
Article Type: Research Papers
J. Pressure Vessel Technol. May 1989, 111(2): 165–171.
DOI: https://doi.org/10.1115/1.3265653
Published Online: May 1, 1989
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Topics: Delamination, Fiber reinforced composites, Fracture (Materials), Plates (structures), Composite materials, Damage, Displacement, Dynamic response, Fast Fourier transforms, Integral equations
Journal Articles

Proceedings, International Conference on Constitutive Laws for Engineering Materials, Theory and Application

C. S. Desai, Editor, R. H. Gallagher, Editor, L. B. Freund, Reviewer
Journal: Journal of Applied Mechanics
Article Type: Book Reviews
J. Appl. Mech. September 1983, 50(3): 703–704.
DOI: https://doi.org/10.1115/1.3167128
Published Online: September 1, 1983
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Topics: Constitutive equations
Journal Articles

Elementary Finite Element Method

C. S. Desai, Author, S. Kelsey, Reviewer
Journal: Journal of Applied Mechanics
Article Type: Book Reviews
J. Appl. Mech. December 1982, 49(4): 932.
DOI: https://doi.org/10.1115/1.3162676
Published Online: December 1, 1982
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Topics: Finite element methods
Journal Articles

Elementary Finite Element Method

C. S. Desai, Author, H. Saunders, Reviewer
Journal: Journal of Mechanical Design
Article Type: Book Reviews
J. Mech. Des. October 1981, 103(4): 685.
DOI: https://doi.org/10.1115/1.3254971
Published Online: October 1, 1981
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Topics: Finite element methods
Journal Articles

Introduction to the Finite-Element Method

C. S. Desai, Author, J. F. Abel, Author, P. V. Marcal, Reviewer
Journal: Journal of Applied Mechanics
Article Type: Book Reviews
J. Appl. Mech. June 1973, 40(2): 404.
DOI: https://doi.org/10.1115/1.3422995
Published Online: June 1, 1973
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Topics: Finite element methods