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Darin J. Sharar
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Journal Articles

Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat

Michael Deckard, Darin J. Sharar, Michael Fish, Patrick J. Shamberger
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011201.
Paper No: EP-21-1153
https://doi.org/10.1115/1.4054651
Published Online: July 7, 2022
View Article titled, Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat
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Topics: Heat, Phase change materials, Steady state, Temperature, Transients (Dynamics), Melting, Copper, Heat sinks, Tradeoffs, Simulation
Journal Articles

Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages

Justin Hollis, Darin J. Sharar, Todd Bandhauer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041111.
Paper No: EP-21-1103
https://doi.org/10.1115/1.4052669
Published Online: November 5, 2021
View Article titled, Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages
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Topics: Copper, Cycles, Junctions, Phase change materials, Temperature, Heat, Composite materials, Transients (Dynamics), Thermal management, Cities
Journal Articles

Special Issue Dedicated to Professor Avram Bar-Cohen

Ronald J. Warzoha, Darin J. Sharar, Raffaele Luca Amalfi, Andrew Tay
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. December 2021, 143(4): 040301.
Paper No: EP-21-1127
https://doi.org/10.1115/1.4052174
Published Online: September 13, 2021
View Article titled, Special Issue Dedicated to Professor Avram Bar-Cohen
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Topics: Engineering teachers
Proceedings Papers

Thermal Model of the Package Integrated Cyclone COoler (PICCO): Achieving High Thermal Conductance Using Swirled Two-Phase Flow

Rinaldo L. Miorini, Darin J. Sharar, Peter deBock
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A012, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2605
https://doi.org/10.1115/IPACK2020-2605
View Paper titled, Thermal Model of the Package Integrated Cyclone COoler (PICCO): Achieving High Thermal Conductance Using Swirled Two-Phase Flow
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Topics: Thermal conductivity, Two-phase flow, Flow (Dynamics), Additive manufacturing, Army, Boundary-value problems, Bubbles, Buoyancy, Capacitance, Collaboration
Proceedings Papers

Silicon Carbide Power Module Co-Designed for Enhanced Thermal and Electrical Performance in Steady State and Transient Conditions

Arun V. Gowda, Rinaldo L. Miorini, Michael Fish, Darin J. Sharar, Peter deBock
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A014, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2608
https://doi.org/10.1115/IPACK2020-2608
View Paper titled, Silicon Carbide Power Module Co-Designed for Enhanced Thermal and Electrical Performance in Steady State and Transient Conditions
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Topics: Silicon, Steady state, Transients (Dynamics), Additive manufacturing, Flow (Dynamics), Army, Bubbles, Buoyancy, Capacitance, Collaboration
Proceedings Papers

Non-Intrusive Optical Validation of Two-Phase Flow Regimes in a Small Diameter Tube

Darin J. Sharar, Arthur E. Bergles, Nicholas R. Jankowski, Avram Bar-Cohen
Proc. ASME. ICNMM2014, ASME 2014 12th International Conference on Nanochannels, Microchannels and Minichannels, V001T03A016, August 3–7, 2014
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2014-22029
https://doi.org/10.1115/ICNMM2014-22029
View Paper titled, Non-Intrusive Optical Validation of Two-Phase Flow Regimes in a Small Diameter Tube
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Topics: Two-phase flow, Flow (Dynamics), Film thickness
Proceedings Papers

Analysis and Characterization of Thermal Expansion-Matched Wick-Based Multi-Chip Passive Heat Spreaders in Static and Dynamic Environments

David H. Altman, Anurag Gupta, Thomas E. Dubrowski, Jr., Darin J. Sharar, Nicholas R. Jankowski, Mark T. North
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A018, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73087
https://doi.org/10.1115/IPACK2013-73087
View Paper titled, Analysis and Characterization of Thermal Expansion-Matched Wick-Based Multi-Chip Passive Heat Spreaders in Static and Dynamic Environments
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Topics: Flat heat pipes
Proceedings Papers

Modified Model for Improved Flow Regime Prediction in Internally-Grooved Tubes

Darin J. Sharar, Nicholas R. Jankowski, Avram Bar-Cohen
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A042, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73199
https://doi.org/10.1115/IPACK2013-73199
View Paper titled, Modified Model for Improved Flow Regime Prediction in Internally-Grooved Tubes
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Topics: Flow (Dynamics), Heat transfer
Proceedings Papers

Two-Phase Minichannel Cold Plate for Army Vehicle Power Electronics

Darin J. Sharar, Brian Morgan, Nicholas R. Jankowski, Avram Bar-Cohen
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 133-142, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52079
https://doi.org/10.1115/IPACK2011-52079
View Paper titled, Two-Phase Minichannel Cold Plate for Army Vehicle Power Electronics
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Topics: Army, Electronics, Vehicles, Temperature, Energy dissipation, Heat, Coolants, Cooling, Design, Electrical resistivity