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Dongzhi Guo
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021002.
Paper No: EP-13-1053
Published Online: April 29, 2014
Proceedings Papers
Proc. ASME. IMECE2013, Volume 8B: Heat Transfer and Thermal Engineering, V08BT09A022, November 15–21, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2013-63265
Proceedings Papers
Dongzhi Guo, Jinsheng Gao, Ying-Ju Yu, Suresh Santhanam, Gary K. Fedder, Alan J. H. McGaughey, Shi-Chune Yao, Andrew Slippey
Proc. ASME. HT2013, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamental Research in Heat Transfer, V001T01A018, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17396
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. November 2013, 135(11): 111003.
Paper No: HT-12-1144
Published Online: September 23, 2013
Proceedings Papers
Proc. ASME. HT2012, Volume 1: Heat Transfer in Energy Systems; Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat and Mass Transfer in Biotechnology; Environmental Heat Transfer; Visualization of Heat Transfer; Education and Future Directions in Heat Transfer, 331-337, July 8–12, 2012
Publisher: American Society of Mechanical Engineers
Paper No: HT2012-58361
Proceedings Papers
Dongzhi Guo, Jingsheng Gao, Alan J. H. McGaughey, Matthew Moran, Suresh Santhanam, Gary K. Fedder, Bill Anderson, Shi-Chune Yao
Proc. ASME. IMECE2011, Volume 4: Energy Systems Analysis, Thermodynamics and Sustainability; Combustion Science and Engineering; Nanoengineering for Energy, Parts A and B, 83-90, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-63084