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Journal Articles

Lead-Free Alternatives for Interconnects in High-Temperature Electronics

Sandeep Mallampati, Liang Yin, David Shaddock, Harry Schoeller, Junghyun Cho
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010906.
Paper No: EP-17-1101
DOI: https://doi.org/10.1115/1.4039027
Published Online: March 2, 2018
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Topics: Alloys, Electronics, High temperature, Solders, Temperature, Testing, Thermal conductivity, Failure, Melting, Tensile testing
Proceedings Papers

Lead-Free Alternatives for Interconnects in High-Temperature Electronics

Sandeep Mallampati, Liang Yin, David Shaddock, Harry Schoeller, Junghyun Cho
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A004, August 29–September 1, 2017
Paper No: IPACK2017-74169
DOI: https://doi.org/10.1115/IPACK2017-74169
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Topics: Electronics, High temperature, Alloys, Fracture (Materials), Deformation, Shear strength, Solders, Tension, Thermal conductivity, Brittleness
Proceedings Papers

Adhesive Tiecoat/Polyimide Interactions in High Temperature Flex Packaging

Harry Schoeller, Aaron Knobloch, Hua Xia, David Shaddock, Chris Kapusta, Kevin Durocher, Jungyun Cho
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 517-524, July 8–12, 2007
Paper No: IPACK2007-33419
DOI: https://doi.org/10.1115/IPACK2007-33419
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Topics: Adhesives, High temperature, Packaging, Stress, Simulation, Adhesion, Elastic moduli, Finite element analysis, Electronic packages, Heat treating (Metalworking)
Proceedings Papers

Effects of Microstructure Evolution on High-Temperature Mechanical Deformation of 95Sn-5Sb

Harry Schoeller, Shubhra Bansal, Aaron Knobloch, David Shaddock, Junghyun Cho
Proc. ASME. IMECE2008, Volume 6: Electronics and Photonics, 25-32, October 31–November 6, 2008
Paper No: IMECE2008-68952
DOI: https://doi.org/10.1115/IMECE2008-68952
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Topics: Deformation, High temperature, Solders, Creep, Temperature, Alloys, Electronics, Stress, Tin, Drilling
Proceedings Papers

Constitutive Relations of High Temperature Solders

Harry Schoeller, Shubhra Bansal, Aaron Knobloch, David Shaddock, Junghyun Cho
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 201-208, November 11–15, 2007
Paper No: IMECE2007-42215
DOI: https://doi.org/10.1115/IMECE2007-42215
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Topics: Constitutive equations, High temperature, Solders, Wire, Nanoindentation, Creep, Failure, Finite element analysis, Mechanical properties, Temperature
Proceedings Papers

Solderability of Indium With Various Oxide Thickness

Seungbae Park, Jongman Kim, Junghyun Cho, Harry Schoeller
Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 155-159, November 5–10, 2006
Paper No: IMECE2006-16271
DOI: https://doi.org/10.1115/IMECE2006-16271
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Topics: Solders, Stress, Wetting