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J. Michael Brown
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Journal Articles

Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices

Shuv Dey, Luis Diego Monge Jimenez, J. Michael Brown, Yogendra Joshi
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021004.
Paper No: EP-22-1038
DOI: https://doi.org/10.1115/1.4055094
Published Online: August 18, 2022
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Topics: Climate, Design, Solar energy, Temperature, Thermal management, Transients (Dynamics), Solar radiation, Smart cities, Computer simulation, Cycles
Proceedings Papers

Passive Implementation of Multibody Simulations for Haptic Display

J. Michael Brown, J. Edward Colgate
Proc. ASME. IMECE97, Dynamic Systems and Control, 85-92, November 16–21, 1997
Paper No: IMECE1997-0381
DOI: https://doi.org/10.1115/IMECE1997-0381
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Topics: Haptics, Simulation, Stability, Algorithms, Collisions (Physics), Design, Hardware
Proceedings Papers

Minimum Mass for Haptic Display Simulations

J. Michael Brown, J. Edward Colgate
Proc. ASME. IMECE98, Dynamic Systems and Control, 249-256, November 15–20, 1998
Paper No: IMECE1998-0262
DOI: https://doi.org/10.1115/IMECE1998-0262
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Topics: Haptics, Simulation, Numerical analysis, Stability, Virtual reality
Journal Articles

Packaging Environmental Sensors for Monitoring Urban-Microclimates

Shuv Dey, J. Michael Brown, Yogendra Joshi
Journal: ASME Journal of Engineering for Sustainable Buildings and Cities
Article Type: Research Papers
J. Eng. Sustain. Bldgs. Cities. August 2020, 1(3): 031001.
Paper No: JESBC-20-1004
DOI: https://doi.org/10.1115/1.4047422
Published Online: June 18, 2020
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Topics: Packaging, Sensors, Design
Journal Articles

Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components

Jeho Kim, J. Michael Brown, Yogendra Joshi, Kevin O'Connor, Marcos Diaz, Zhuomin Zhang, Peiyan Yang
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031120.
Paper No: EP-19-1127
DOI: https://doi.org/10.1115/1.4046933
Published Online: May 4, 2020
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Topics: Glass, Heat, Manufacturing, Solar energy, Solar radiation, Temperature, Testing, Simulation, Liquid crystals, Computational fluid dynamics
Proceedings Papers

Packaging Environmental Sensors for an Internet-of-Things Solution for Urban-Microclimate Studies

Shuv Dey, Yogendra Joshi, J. Michael Brown
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 7–9, 2019
Paper No: IPACK2019-6515
DOI: https://doi.org/10.1115/IPACK2019-6515
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Topics: Cities, Heat, Internet of things, Packaging, Pollution, Sensor networks, Sensors
Proceedings Papers

Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components

Jeho Kim, J. Michael Brown, Yogendra Joshi, Kevin O’Connor, Marcos Diaz, Zhuomin Zhang, Peiyan Yang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 7–9, 2019
Paper No: IPACK2019-6391
DOI: https://doi.org/10.1115/IPACK2019-6391
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Topics: Computational fluid dynamics, Glass, Heat, Heat transfer, Liquid crystals, Solar energy, Solar radiation, Testing, Temperature, Computer software