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1-9 of 9
Jing Wu
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Journal Articles
Article Type: Research Papers
J. Electrochem. En. Conv. Stor. August 2021, 18(3): 031014.
Paper No: JEECS-20-1141
Published Online: January 28, 2021
Proceedings Papers
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, October 27–29, 2020
Paper No: IPACK2020-2695
Proceedings Papers
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A016, October 27–29, 2020
Paper No: IPACK2020-2691
Journal Articles
Article Type: Research Papers
J. Electrochem. En. Conv. Stor. May 2021, 18(2): 020902.
Paper No: JEECS-20-1071
Published Online: November 5, 2020
Proceedings Papers
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A011, October 7–9, 2019
Paper No: IPACK2019-6571
Proceedings Papers
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, August 29–September 1, 2017
Paper No: IPACK2017-74266
eBook Chapter
Series: ASME Press Select Proceedings
Publisher: ASME Press
Published: 2010
ISBN: 9780791859582
eBook Chapter
Series: ASME Press Select Proceedings
Publisher: ASME Press
Published: 2010
ISBN: 9780791859582
eBook Chapter
Series: ASME Press Select Proceedings
Publisher: ASME Press
Published: 2010
ISBN: 9780791859582