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Journal Articles

Ultraminiaturized Three-Dimensional IPAC Packages With 100 μ m Thick Glass Substrates for Radio Frequency Front-End Modules

Zihan Wu, Junki Min, Vanessa Smet, Markondeya Raj Pulugurtha, Venky Sundaram, Rao R. Tummala
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041001.
Paper No: EP-16-1151
DOI: https://doi.org/10.1115/1.4037221
Published Online: July 27, 2017
View Article titled, Ultraminiaturized Three-Dimensional IPAC Packages With 100 μ m Thick Glass Substrates for Radio Frequency Front-End Modules
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Topics: Glass, Manufacturing, Filters
Proceedings Papers

Reliability Estimation of Stretchable Electronics Using a Dimension Reduction Framework

Sungkun Hwang, Recep M. Gorguluarslan, Seung-Kyum Choi, Junki Min, Jack Moon
Proc. ASME. IDETC-CIE2016, Volume 1A: 36th Computers and Information in Engineering Conference, V01AT02A025, August 21–24, 2016
Paper No: DETC2016-59995
DOI: https://doi.org/10.1115/DETC2016-59995
View Paper titled, Reliability Estimation of Stretchable Electronics Using a Dimension Reduction Framework
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Topics: Dimensions, Electronics, Reliability, Artificial neural networks, Algorithms, Entropy, Feature extraction, Feature selection, Principal component analysis, Solder joints