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Journal Articles

Numerical Study of Large Footprint (24 × 24 mm 2 ) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers

Tiwei Wei, Sougata Hazra, Yujui Lin, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, Kenneth E. Goodson

J. Electron. Packag. June 2023, 145(2): 021008.

Paper No: EP-22-1046

DOI: https://doi.org/10.1115/1.4055468

Published Online: September 28, 2022

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Topics: Flow (Dynamics), Manifolds, Microchannels, Silicon, Pressure, Temperature, Intake manifolds, Pressure drop

Proceedings Papers

Impact of Phonon Dispersion Upon the Size Effect on Thermal Conduction Along Thin Semiconductor Films

Y. Sungtaek Ju, Kenneth E. Goodson

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 181-190, November 16–21, 1997

Paper No: IMECE1997-0956

DOI: https://doi.org/10.1115/IMECE1997-0956

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Topics: Heat conduction, Phonons, Semiconductor films, Size effect, Thermal conductivity, Semiconductors (Materials), Silicon, Electromagnetic scattering, Radiation scattering, Scattering (Physics)

Proceedings Papers

Modeling and Prediction of Sub-Micrometer Heat Transfer During Thermomechanical Data Storage

William P. King, Juan G. Santiago, Thomas W. Kenny, Kenneth E. Goodson

Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 583-588, November 14–19, 1999

Paper No: IMECE1999-0324

DOI: https://doi.org/10.1115/IMECE1999-0324

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Topics: Data storage systems, Heat transfer, Modeling, Thermomechanics, Polymers, Cantilevers, Temperature, Atomic force microscopy, Heat, Phonons

Proceedings Papers

Thermal Conductivity of Porous Silicon Layers for MEMS

Uma Srinivasan, Peter Breh, Mehdi Asheghi, Maxat Touzelbaev, Kenneth E. Goodson

Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 575-582, November 14–19, 1999

Paper No: IMECE1999-0323

DOI: https://doi.org/10.1115/IMECE1999-0323

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Topics: Microelectromechanical systems, Silicon, Thermal conductivity, Porosity, Temperature, Crystals, Electrical resistance, Electromagnetic scattering, Electron microscopy, Heating

Proceedings Papers

Sub-Continuum Simulations of Heat Conduction in Silicon-on-Insulator Transistors

Per G. Sverdrup, Y. Sungtaek Ju, Kenneth E. Goodson

Proc. ASME. IMECE99, Heat Transfer: Volume 3, 41-49, November 14–19, 1999

Paper No: IMECE1999-1061

DOI: https://doi.org/10.1115/IMECE1999-1061

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Topics: Engineering simulation, Heat conduction, Silicon-on-insulator, Simulation, Transistors, Phonons, Silicon, Temperature, Thermal diffusion, Mean free path

Proceedings Papers

Contact Angle Tuning of Copper Microporous Structures

Farid Soroush, Tanya Liu, Qianying Wu, Mehdi Asheghi, Kenneth E. Goodson, Lorenz Marco, Egger Christian, Rittner Martin

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A010, October 26–28, 2021

Paper No: IPACK2021-73334

DOI: https://doi.org/10.1115/IPACK2021-73334

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Topics: Copper

Proceedings Papers

A Hybrid Microporous Copper Structure for High Performance Capillary-Driven Liquid Film Boiling

Farid Soroush, Tanya Liu, Qianying Wu, Chi Zhang, Mehdi Asheghi, Kenneth E. Goodson, Lorenz Marco, Egger Christian, Rittner Martin

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 26–28, 2021

Paper No: IPACK2021-73309

DOI: https://doi.org/10.1115/IPACK2021-73309

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Topics: Boiling, Copper, Liquid films

Proceedings Papers

Microscale Liquid Impingement Cooling

Lian Zhang, Evelyn N. Wang, Jon D. Koch, Jonathan T. C. Liu, Jae-Mo Koo, Linan Jiang, Kenneth E. Goodson, Juan G. Santiago, Thomas W. Kenny

Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 135-140, November 11–16, 2001

Paper No: IMECE2001/MEMS-23820

DOI: https://doi.org/10.1115/IMECE2001/MEMS-23820

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Topics: Impingement cooling, Microelectromechanical systems, Microscale devices, Jets, Water, Computer cooling, Flow (Dynamics), Heat flux, Heat transfer coefficients, Orifices

Proceedings Papers

Impact of Pumping Surface Separation Distance on Micromachined Silicon Electroosmotic Pump Performance

Daniel J. Laser, Kenneth E. Goodson, Juan G. Santiago, Thomas W. Kenny

Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 531-535, November 11–16, 2001

Paper No: IMECE2001/MEMS-23876

DOI: https://doi.org/10.1115/IMECE2001/MEMS-23876

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Topics: Microelectromechanical systems, Micromachining, Pumps, Separation (Technology), Silicon, Micropumps, Design, Electrical measurement, Energy consumption, Engineering prototypes

Proceedings Papers

Modeling and Measurement of Pressure-Dependent Junction-Spreader Thermal Resistance for Integrated Circuits

Peng Zhou, Kenneth E. Goodson

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 51-57, November 11–16, 2001

Paper No: IMECE2001/HTD-24377

DOI: https://doi.org/10.1115/IMECE2001/HTD-24377

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Topics: Integrated circuits, Junctions, Modeling, Pressure, Thermal resistance, Electronic packages, Transients (Dynamics), Electronic packaging, Experimental methods, Fillers (Materials)

Proceedings Papers

Measurements and Modeling of Two-Phase Flow in Microchannels With Nearly-Constant Heat Flux Boundary Conditions

Lian Zhang, Jae-Mo Koo, Linan Jiang, Shilajeet S. Banerjee, Mehdi Ashegi, Kenneth E. Goodson, Juan G. Santiago, Thomas W. Kenny

Proc. ASME. IMECE2000, Micro-Electro-Mechanical Systems (MEMS), 129-135, November 5–10, 2000

Paper No: IMECE2000-1082

DOI: https://doi.org/10.1115/IMECE2000-1082

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Topics: Boundary-value problems, Heat flux, Microchannels, Modeling, Two-phase flow, Boiling, Dimensions, Flow (Dynamics), Silicon, Bubbles

Journal Articles

Performance and Manufacturing of Silicon-Based Vapor Chambers

Tanya Liu, Mehdi Asheghi, Kenneth E. Goodson

Appl. Mech. Rev. January 2021, 73(1): 010802.

Paper No: AMR-20-1085

DOI: https://doi.org/10.1115/1.4049801

Published Online: February 18, 2021

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Topics: Manufacturing, Silicon, Vapors, Heat

Journal Articles

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa

Ki Wook Jung, Eunho Cho, Hyoungsoon Lee, Chirag Kharangate, Feng Zhou, Mehdi Asheghi, Ercan M. Dede, Kenneth E. Goodson

J. Electron. Packag. September 2020, 142(3): 031117.

Paper No: EP-20-1030

DOI: https://doi.org/10.1115/1.4047846

Published Online: August 17, 2020

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Topics: Flow (Dynamics), Fluids, Heat, Heat flux, Manifolds, Microchannels, Pressure drop, Temperature, Uncertainty, Cooling

Journal Articles

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices

Sougata Hazra, Ki Wook Jung, Madhusudan Iyengar, Chris Malone, Mehdi Asheghi, Kenneth E. Goodson

J. Electron. Packag. September 2020, 142(3): 031119.

Paper No: EP-20-1022

DOI: https://doi.org/10.1115/1.4047847

Published Online: August 17, 2020

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Topics: Coatings, Lasers, Manufacturing, Microcoolers, Micromachining, Silicon, Protective coatings, Bonding, Coating processes, Etching

Journal Articles

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm 2 ) Power Electronics Cooling

Ki Wook Jung, Sougata Hazra, Heungdong Kwon, Alisha Piazza, Edward Jih, Mehdi Asheghi, Man Prakash Gupta, Michael Degner, Kenneth E. Goodson

J. Electron. Packag. September 2020, 142(3): 031118.

Paper No: EP-20-1032

DOI: https://doi.org/10.1115/1.4047883

Published Online: August 17, 2020

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Topics: Computational fluid dynamics, Design, Fluids, Manifolds, Microchannels, Pressure drop, Simulation, Coolers

Proceedings Papers

Addressing the Challenges in Laser Micro-Machining and Bonding of Silicon Microchannel Cold-Plate and 3D-Manifold for Embedded Cooling Applications: Perfect Debris Removal

Sougata Hazra, Ki Wook Jung, Madhusudan Iyengar, Chris Malone, Mehdi Asheghi, Kenneth E. Goodson

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 7–9, 2019

Paper No: IPACK2019-6539

DOI: https://doi.org/10.1115/IPACK2019-6539

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Topics: Bonding, Cooling, Lasers, Manifolds, Microchannels, Microfabrication, Micromachining, Silicon

Proceedings Papers

Parametric Study of Silicon-Based Embedded Microchannels With 3D Manifold Coolers (EMMC) for High Heat Flux (~1 kW/cm 2 ) Power Electronics Cooling

Ki Wook Jung, Sougata Hazra, Heungdong Kwon, Alisha Piazza, Edward Jih, Mehdi Asheghi, Man Prakash Gupta, Mike Degner, Kenneth E. Goodson

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A021, October 7–9, 2019

Paper No: IPACK2019-6472

DOI: https://doi.org/10.1115/IPACK2019-6472

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Topics: Computational fluid dynamics, Computer cooling, Coolers, Heat flux, Manifolds, Microchannels, Silicon, Water

Proceedings Papers

Experimental Investigation of Single-Phase Cooling in Embedded Microchannels: 3D Manifold Heat Exchanger With R-245fa

Ki Wook Jung, Hyoungsoon Lee, Chirag Kharangate, Feng Zhou, Mehdi Asheghi, Ercan M. Dede, Kenneth E. Goodson

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A007, October 7–9, 2019

Paper No: IPACK2019-6400

DOI: https://doi.org/10.1115/IPACK2019-6400

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Topics: Cooling, Heat exchangers, Manifolds, Microchannels

Journal Articles

Enhanced Heat Transfer Using Microporous Copper Inverse Opals

Hyoungsoon Lee, Tanmoy Maitra, James Palko, Daeyoung Kong, Chi Zhang, Michael T. Barako, Yoonjin Won, Mehdi Asheghi, Kenneth E. Goodson

J. Electron. Packag. June 2018, 140(2): 020906.

Paper No: EP-18-1003

DOI: https://doi.org/10.1115/1.4040088

Published Online: May 9, 2018

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Topics: Copper, Critical heat flux, Heat transfer, Pool boiling, Boiling, Heat transfer coefficients, Bubbles

Journal Articles

Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop

Chirag R. Kharangate, Ki Wook Jung, Sangwoo Jung, Daeyoung Kong, Joseph Schaadt, Madhusudan Iyengar, Chris Malone, Hyoungsoon Lee, Mehdi Asheghi, Kenneth E. Goodson

J. Electron. Packag. June 2018, 140(2): 021001.

Paper No: EP-17-1126

DOI: https://doi.org/10.1115/1.4039475

Published Online: May 9, 2018

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Topics: Fins, Flow (Dynamics), Fluids, Friction, Heat transfer, Pressure drop, Reynolds number, Water, Heat, Temperature

Journal citation

NARROW

Numerical Study of Large Footprint (24 × 24 mm 2 ) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers

Impact of Phonon Dispersion Upon the Size Effect on Thermal Conduction Along Thin Semiconductor Films

Modeling and Prediction of Sub-Micrometer Heat Transfer During Thermomechanical Data Storage

Thermal Conductivity of Porous Silicon Layers for MEMS

Sub-Continuum Simulations of Heat Conduction in Silicon-on-Insulator Transistors

Contact Angle Tuning of Copper Microporous Structures

A Hybrid Microporous Copper Structure for High Performance Capillary-Driven Liquid Film Boiling

Microscale Liquid Impingement Cooling

Impact of Pumping Surface Separation Distance on Micromachined Silicon Electroosmotic Pump Performance

Modeling and Measurement of Pressure-Dependent Junction-Spreader Thermal Resistance for Integrated Circuits

Measurements and Modeling of Two-Phase Flow in Microchannels With Nearly-Constant Heat Flux Boundary Conditions

Performance and Manufacturing of Silicon-Based Vapor Chambers

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm 2 ) Power Electronics Cooling

Addressing the Challenges in Laser Micro-Machining and Bonding of Silicon Microchannel Cold-Plate and 3D-Manifold for Embedded Cooling Applications: Perfect Debris Removal

Parametric Study of Silicon-Based Embedded Microchannels With 3D Manifold Coolers (EMMC) for High Heat Flux (~1 kW/cm 2 ) Power Electronics Cooling

Experimental Investigation of Single-Phase Cooling in Embedded Microchannels: 3D Manifold Heat Exchanger With R-245fa

Enhanced Heat Transfer Using Microporous Copper Inverse Opals

Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop

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