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Proceedings Papers

Characterization and Prevention of Metal Overflow in Ultra-Thin Au-Sn Eutectic Chip Bonding for Packaging and Integration of Extreme Heat Flux Micro-Coolers

Sougata Hazra, Yashvi Singh, Mehdi Asheghi, Kenneth Goodson

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 27–29, 2020

Paper No: IPACK2020-2533

DOI: https://doi.org/10.1115/IPACK2020-2533

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Topics: Bonding, Flip-chip, Heat flux, Intermetallic compounds, Metals, Microcoolers, Packaging, Tin

Proceedings Papers

Lasered Roughness to Increase Wicking Rates in Pin-Fin Microstructure

Sougata Hazra, Tanya Liu, Mehdi Asheghi, Kenneth Goodson

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, October 27–29, 2020

Paper No: IPACK2020-2640

DOI: https://doi.org/10.1115/IPACK2020-2640

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Topics: Lasers, Surface roughness, Vapors

Proceedings Papers

Design and Fabrication of Graded Copper Inverse Opals (g-CIOs) for Capillary-Fed Boiling in High Heat Flux Cooling Applications

Qianying Wu, Chi Zhang, Mehdi Asheghi, Kenneth Goodson

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A011, October 27–29, 2020

Paper No: IPACK2020-2603

DOI: https://doi.org/10.1115/IPACK2020-2603

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Topics: Boiling, Cooling, Copper, Design, Heat flux, Manufacturing, Critical heat flux, Heat, Modeling, Permeability

Proceedings Papers

Investigation of the Heterogeneous Thermal Conductivity in Bulk CVD Diamond for Use in Electronics Thermal Management

Luke Yates, Ramez Cheaito, Aditya Sood, Zhe Cheng, Thomas Bougher, Mehdi Asheghi, Kenneth Goodson, Mark Goorsky, Firooz Faili, Dan Twitchen, Samuel Graham

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A014, August 29–September 1, 2017

Paper No: IPACK2017-74163

DOI: https://doi.org/10.1115/IPACK2017-74163

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Topics: Electronics, Synthetic diamonds, Thermal conductivity, Thermal management, Diamonds, Chemical vapor deposition, Electron backscatter diffraction, Lasers, Boron, Heat flux

Proceedings Papers

Validation Study for VOF Simulations of Boiling in a Microchannel

Catherine Gorlé, Hyoungsoon Lee, Farzad Houshmand, Mehdi Asheghi, Kenneth Goodson, Pritish R. Parida

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A022, July 6–9, 2015

Paper No: IPACK2015-48129

DOI: https://doi.org/10.1115/IPACK2015-48129

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Topics: Boiling, Microchannels, Simulation, Boundary-value problems, Temperature, Two-phase flow, Flow (Dynamics), Fluids, Heat flux, Heat transfer

Proceedings Papers

Numerical Simulation of Advanced Monolithic Microcooler Designs for High Heat Flux Microelectronics

Sebastian Scholl, Catherine Gorle, Farzad Houshmand, Tanya Liu, Hyoungsoon Lee, Yoonjin Won, Mehdi Asheghi, Kenneth Goodson, Hooman Kazemi

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A009, July 6–9, 2015

Paper No: IPACK2015-48122

DOI: https://doi.org/10.1115/IPACK2015-48122

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Topics: Boundary-value problems, Computational fluid dynamics, Computer simulation, Cooling, Design, Fins, Flow (Dynamics), Fluid dynamics, Geometry, Heat conduction

Proceedings Papers

Full Scale Simulation of an Integrated Monolithic Heat Sink for Thermal Management of a High Power Density GaN-SiC Chip

Tanya Liu, Farzad Houshmand, Catherine Gorle, Sebastian Scholl, Hyoungsoon Lee, Yoonjin Won, Mehdi Asheghi, Kenneth Goodson, Hooman Kazemi, Kenneth Vanhille

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A057, July 6–9, 2015

Paper No: IPACK2015-48592

DOI: https://doi.org/10.1115/IPACK2015-48592

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Topics: Gallium nitride, Heat sinks, Power density, Simulation, Thermal management, Cooling, Flow (Dynamics), Microchannels, Design, Heat transfer

Proceedings Papers

Numerical Optimization of Advanced Monolithic Microcoolers for High Heat Flux Microelectronics

Sebastian Scholl, Catherine Gorle, Farzad Houshmand, Mehdi Asheghi, Kenneth Goodson, Tom Verstraete

Paper No: IPACK2015-48123

DOI: https://doi.org/10.1115/IPACK2015-48123

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Topics: Heat flux, Microcoolers, Microelectronic devices, Optimization, Cooling, Fluids, Heat transfer, Computational fluid dynamics, Design, Engineering simulation

Proceedings Papers

Modeling and Optimization of Small Thermoelectric Generators for Low-Power Electronics

Marc T. Dunham, Michael T. Barako, Saniya LeBlanc, Mehdi Asheghi-Roudheni, Baoxing Chen, Kenneth Goodson

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A009, July 16–18, 2013

Paper No: IPACK2013-73297

DOI: https://doi.org/10.1115/IPACK2013-73297

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Topics: Generators, Low-power electronics, Modeling, Optimization, Temperature, Design, Fillers (Materials), Heat, Thermal resistance, Thermoelectric devices

Proceedings Papers

Decoupled Thermal and Fluidic Effects on Hotspot Cooling in a Boiling Flow Microchannel Heat Sink

Roger Flynn, Ching-Hsiang Cheng, Kenneth Goodson

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 179-184, July 8–12, 2007

Paper No: IPACK2007-33484

DOI: https://doi.org/10.1115/IPACK2007-33484

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Topics: Boiling, Cooling, Flow (Dynamics), Heat sinks, Microchannels, Thermal resistance, Convection, Design, Flow instability, Microfluidics

Proceedings Papers

3-D Numerical Simulation of Contact Angle Hysteresis for Slug Flow in Microchannel

Chen Fang, Carlos Hidrovo, Fumin Wang, Julie Steinbrenner, Eonsoo Lee, Dongrip Kim, Kenneth Goodson

Proc. ASME. ICNMM2007, ASME 5th International Conference on Nanochannels, Microchannels, and Minichannels, 955-963, June 18–20, 2007

Paper No: ICNMM2007-30199

DOI: https://doi.org/10.1115/ICNMM2007-30199

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Topics: Computer simulation, Microchannels, Slug flows, Simulation, Dimensions, Accounting, Algorithms, Dynamics (Mechanics), Flow (Dynamics), Nonlinear equations

Proceedings Papers

Thermal Conduction Phenomena in Advanced Interface Materials for Electronics Cooling

Xuejiao Hu, Ravi Prasher, Kenneth Goodson

Proc. ASME. HT2005, Heat Transfer: Volume 4, 963-966, July 17–22, 2005

Paper No: HT2005-72729

DOI: https://doi.org/10.1115/HT2005-72729

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Topics: Computer cooling, Heat conduction, Packaging, Composite materials, Polymers, Semiconductors (Materials), Thermal resistance, Thin films

Proceedings Papers

Design, Fabrication and Thermal Characterization of a MEMS Device for Control of Nerve Cell Growth

Ankur Jain, Kevin Ness, Angie McConnell, Linan Jiang, Kenneth Goodson

Proc. ASME. IMECE2003, Microelectromechanical Systems, 251-257, November 15–21, 2003

Paper No: IMECE2003-41590

DOI: https://doi.org/10.1115/IMECE2003-41590

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Topics: Design, Manufacturing, Microelectromechanical systems, Thermal characterization, Membranes, Temperature, Biomedicine, Finite element analysis, Heating, Modeling

Journal Articles

Thermometry and Thermal Transport in Micro/Nanoscale Solid-State Devices and Structures

David G. Cahill, Kenneth Goodson, Arunava Majumdar

J. Heat Transfer. April 2002, 124(2): 223–241.

DOI: https://doi.org/10.1115/1.1454111

Published Online: December 7, 2001

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Topics: Phonons, Superlattices, Temperature, Temperature measurement, Thermal conductivity, Thin films, Heat conduction, Probes, Heat, Thermoreflectance

Journal citation

NARROW

Characterization and Prevention of Metal Overflow in Ultra-Thin Au-Sn Eutectic Chip Bonding for Packaging and Integration of Extreme Heat Flux Micro-Coolers

Lasered Roughness to Increase Wicking Rates in Pin-Fin Microstructure

Design and Fabrication of Graded Copper Inverse Opals (g-CIOs) for Capillary-Fed Boiling in High Heat Flux Cooling Applications

Investigation of the Heterogeneous Thermal Conductivity in Bulk CVD Diamond for Use in Electronics Thermal Management

Validation Study for VOF Simulations of Boiling in a Microchannel

Numerical Simulation of Advanced Monolithic Microcooler Designs for High Heat Flux Microelectronics

Full Scale Simulation of an Integrated Monolithic Heat Sink for Thermal Management of a High Power Density GaN-SiC Chip

Numerical Optimization of Advanced Monolithic Microcoolers for High Heat Flux Microelectronics

Modeling and Optimization of Small Thermoelectric Generators for Low-Power Electronics

Decoupled Thermal and Fluidic Effects on Hotspot Cooling in a Boiling Flow Microchannel Heat Sink

3-D Numerical Simulation of Contact Angle Hysteresis for Slug Flow in Microchannel

Thermal Conduction Phenomena in Advanced Interface Materials for Electronics Cooling

Design, Fabrication and Thermal Characterization of a MEMS Device for Control of Nerve Cell Growth

Thermometry and Thermal Transport in Micro/Nanoscale Solid-State Devices and Structures

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