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Krishna Bhavana Sivaraju
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Journal Articles

Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core

Pratik Bansode, Rohit Suthar, Rabin Bhandari, Akshay Lakshminarayana, Naga Tejesh Eda, Gautam Gupta, Vibin Simon, Himanshu Modi, Vivek Nair, Pardeep Shahi, Satyam Saini, Krishna Bhavana Sivaraju, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041112.
Paper No: EP-24-1042
https://doi.org/10.1115/1.4066044
Published Online: August 9, 2024
View Article titled, Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core
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Topics: Cooling, Elastic moduli, Fluids, Temperature, Thermomechanics, Heat, Energy dissipation, Glass transition, Data centers, Reliability
Proceedings Papers

Optimization of a Air-Cooled Heatsink for Immersion Cooling Application

Gautam Gupta, Vivek Nair, Sai Abhideep Pundla, Pratik Bansode, Rohit Suthar, Joseph Herring, Jacob Lamotte-Dawaghreh, Krishna Bhavana Sivaraju, Dereje Agonafer, Poornima Mynampati, Mike Sweeney
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A013, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112054
https://doi.org/10.1115/IPACK2023-112054
View Paper titled, Optimization of a Air-Cooled Heatsink for Immersion Cooling Application
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Topics: Cooling, Fluids, Heat sinks, Optimization
Proceedings Papers

A Numerical Study Comparing Forced and Natural Convection in a High-Density Single-Phase Immersed Cooled Server

Gautam Gupta, Vivek Nair, Pratik Bansode, Rohit Suthar, Sai Abhideep Pundla, Joseph Herring, Jacob Lamotte-Dawaghreh, Krishna Bhavana Sivaraju, Dereje Agonafer, Poornima Mynampati, Mike Sweeney
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A014, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112065
https://doi.org/10.1115/IPACK2023-112065
View Paper titled, A Numerical Study Comparing Forced and Natural Convection in a High-Density Single-Phase Immersed Cooled Server
Open the PDF for A Numerical Study Comparing Forced and Natural Convection in a High-Density Single-Phase Immersed Cooled Server in another window
Topics: Cooling, Density, Forced convection, Natural convection
Proceedings Papers

Energy Analysis of Rear Door Heat Exchangers in Data Centers With Spatial Workload Distribution

Vibin Shalom Simon, Saket Karajgikar, Veerendra Mulay, Sai Abhideep Pundla, Krishna Bhavana Sivaraju, Gautam Gupta, Pratik Bansode, Dereje Agonafer
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A015, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112078
https://doi.org/10.1115/IPACK2023-112078
View Paper titled, Energy Analysis of Rear Door Heat Exchangers in Data Centers With Spatial Workload Distribution
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Topics: Cooling, Data centers, Doors, Heat exchangers
Proceedings Papers

Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core

Pratik Bansode, Mohan Sai Ramalingam, Rohit Suthar, Rabin Bhandari, Akshay Boovanahally Lakshminarayana, Gautam Gupta, Vibin Shalom Simon, Himanshu Modi, Vivek Nair, Krishna Bhavana Sivaraju, Pardeep Shahi, Satyam Saini, Dereje Agonafer
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111056
https://doi.org/10.1115/IPACK2023-111056
View Paper titled, Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core
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Topics: Cooling, Thermomechanics
Proceedings Papers

Comparative Study of Single-Phase Immersion Cooled Two Socket Server in Tank and Sled Configurations

Krishna Bhavana Sivaraju, Pratik Bansode, Gautam Gupta, Jacob Lamotte-Dawaghreh, Satyam Saini, Vibin Simon, Joseph Herring, II, Saket Karajgikar, Veerendra Mulay, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97429
https://doi.org/10.1115/IPACK2022-97429
View Paper titled, Comparative Study of Single-Phase Immersion Cooled Two Socket Server in Tank and Sled Configurations
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Topics: Building renovation, Computational fluid dynamics, Coolants, Cooling, Data centers, Flow (Dynamics), Fluids, Geometry, Heat, Heat transfer
Proceedings Papers

CFD Simulation-Based Comparative Study of Forced Convection Single-Phase Liquid Immersion Cooling for a High-Powered Server

Prajwal Murthy, Gautam Gupta, Joseph Herring, Jacob Lamotte-Dawaghreh, Krishna Bhavana Sivaraju, Pratik Bansode, Himanshu Modi, Dereje Agonafer, Poornima Mynampati, Mike Sweeney
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97402
https://doi.org/10.1115/IPACK2022-97402
View Paper titled, CFD Simulation-Based Comparative Study of Forced Convection Single-Phase Liquid Immersion Cooling for a High-Powered Server
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Topics: Computational fluid dynamics, Cooling, Fluids, Forced convection, Power density, Simulation, Temperature, Thermal conductivity
Proceedings Papers

Impact of Immersion Cooling on Thermomechanical Properties of Non-Halogenated Substrate

Rabin Bhandari, Akshay Boovanahally Lakshminarayana, Krishna Bhavana Sivaraju, Pratik Vithoba Bansode, Ephrem Kejela, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A007, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97423
https://doi.org/10.1115/IPACK2022-97423
View Paper titled, Impact of Immersion Cooling on Thermomechanical Properties of Non-Halogenated Substrate
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Topics: Cooling, Thermomechanics
Proceedings Papers

Feasibility Study of Rear Door Heat Exchanger for a High Capacity Data Center

Vibin Shalom Simon, Himanshu Modi, Krishna Bhavana Sivaraju, Pratik Bansode, Satyam Saini, Pardeep Shahi, Saket Karajgikar, Veerendra Mulay, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A018, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97494
https://doi.org/10.1115/IPACK2022-97494
View Paper titled, Feasibility Study of Rear Door Heat Exchanger for a High Capacity Data Center
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Topics: Cooling, Data centers, Density, Doors, Heat exchangers