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Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A021, October 7–9, 2019

Paper No: IPACK2019-6472

DOI: https://doi.org/10.1115/IPACK2019-6472

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Topics: Computational fluid dynamics, Computer cooling, Coolers, Heat flux, Manifolds, Microchannels, Silicon, Water

Journal Articles

On-Chip Power Generation Using Ultrathin Thermoelectric Generators

Owen Sullivan, Man Prakash Gupta, Saibal Mukhopadhyay, Satish Kumar

J. Electron. Packag. March 2015, 137(1): 011005.

Paper No: EP-14-1012

DOI: https://doi.org/10.1115/1.4027995

Published Online: October 6, 2014

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Topics: Electronic packages, Energy generation, Generators, Heat flux, Junctions, Stress, Temperature, Waste heat, Transients (Dynamics)

Proceedings Papers

A Dissipative Particle Dynamics Study of Liquid Crystals Under Electric Field

Man Prakash Gupta, Satish Kumar

Proc. ASME. MNHMT2013, ASME 2013 4th International Conference on Micro/Nanoscale Heat and Mass Transfer, V001T10A005, December 11–14, 2013

Paper No: MNHMT2013-22125

DOI: https://doi.org/10.1115/MNHMT2013-22125

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Topics: Electric fields, Liquid crystals, Particle dynamics, Anisotropy, Equilibrium (Physics), Mesoscopic systems, Oscillations, Simulation

Proceedings Papers

High Field Breakdown of Carbon Nanotube Network Transistors

Man Prakash Gupta, Ashkan Behnam, David Estrada, Eric Pop, Satish Kumar

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A007, July 16–18, 2013

Paper No: IPACK2013-73115

DOI: https://doi.org/10.1115/IPACK2013-73115

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Topics: Carbon nanotubes, Transistors, Density, Heating, Reliability, Thin film transistors

Proceedings Papers

Impact of Contact Resistances on Electrical and Thermal Transport in Carbon Nanotube Network Transistors

Man Prakash Gupta, David Estrada, Eric Pop, Satish Kumar

Proc. ASME. MNHMT2012, ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer, 769-776, March 3–6, 2012

Paper No: MNHMT2012-75111

DOI: https://doi.org/10.1115/MNHMT2012-75111

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Topics: Carbon nanotubes, Transistors, Density, Thermal conductivity, Thin film transistors, Energy dissipation, Geometry, Simulation results, Statistics, Temperature

Journal Articles

Array of Thermoelectric Coolers for On-Chip Thermal Management

Owen Sullivan, Man Prakash Gupta, Saibal Mukhopadhyay, Satish Kumar

J. Electron. Packag. June 2012, 134(2): 021005.

DOI: https://doi.org/10.1115/1.4006141

Published Online: June 11, 2012

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Topics: Temperature, Thermoelectric coolers, Steady state, Cooling, Transients (Dynamics), Shapes, Temperature control

Journal Articles

Thermal Investigation Into Power Multiplexing for Homogeneous Many-Core Processors

Man Prakash Gupta, Minki Cho, Saibal Mukhopadhyay, Satish Kumar

J. Heat Transfer. June 2012, 134(6): 061401.

DOI: https://doi.org/10.1115/1.4006012

Published Online: May 2, 2012

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Topics: Temperature, Thermal management

Proceedings Papers

Thermoelectric Coolers for Thermal Gradient Management on Chip

Owen Sullivan, Man Prakash Gupta, Saibal Mukhopadhyay, Satish Kumar

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 187-195, November 12–18, 2010

Paper No: IMECE2010-38184

DOI: https://doi.org/10.1115/IMECE2010-38184

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Topics: Temperature gradient, Thermoelectric coolers, Cooling, Temperature, Transients (Dynamics), Electronic packages, Flat heat pipes, Shapes

Proceedings Papers

An Investigation of Power Migration Policies for Many-Core Processors to Manage On-Chip Thermal Profile

Man Prakash Gupta, Minki Cho, Saibal Mukhopadhyay, Satish Kumar

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 153-163, July 6–8, 2011

Paper No: IPACK2011-52094

DOI: https://doi.org/10.1115/IPACK2011-52094

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Topics: Electronic packages, Energy dissipation, Integrated circuits, Reliability, Temperature, Temperature gradient, Thermal management

Journal citation

NARROW

Numerical Study of Large Footprint (24 × 24 mm 2 ) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm 2 ) Power Electronics Cooling

Parametric Study of Silicon-Based Embedded Microchannels With 3D Manifold Coolers (EMMC) for High Heat Flux (~1 kW/cm 2 ) Power Electronics Cooling

On-Chip Power Generation Using Ultrathin Thermoelectric Generators

A Dissipative Particle Dynamics Study of Liquid Crystals Under Electric Field

High Field Breakdown of Carbon Nanotube Network Transistors

Impact of Contact Resistances on Electrical and Thermal Transport in Carbon Nanotube Network Transistors

Array of Thermoelectric Coolers for On-Chip Thermal Management

Thermal Investigation Into Power Multiplexing for Homogeneous Many-Core Processors

Thermoelectric Coolers for Thermal Gradient Management on Chip

An Investigation of Power Migration Policies for Many-Core Processors to Manage On-Chip Thermal Profile

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