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Mandar Kulkarni
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Proceedings Papers

Evaluation of Cracks Embedded in Zones With Large Scale Plasticity in Subsea HPHT Equipment – Comparing FAD and Driving Force Approaches

Mandar Kulkarni, Carlos Lopez, Daniel Kluk, John Chappell
Proc. ASME. PVP2021, Volume 3: Fluid Structure Interaction; High Pressure Technology, V003T05A005, July 13–15, 2021
Paper No: PVP2021-62992
DOI: https://doi.org/10.1115/PVP2021-62992
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Topics: Fracture (Materials), Ocean engineering, Plasticity, American Petroleum Institute, Fracture mechanics, Failure, Fatigue life, Finite element model, Fitness-for-service, Inspection
Proceedings Papers

A Methodology to Assess Elbow Fittings With Localized Material Variations

Pritha Ghosh, Mandar Kulkarni, Brent Vyvial, James Ferguson
Proc. ASME. PVP2019, Volume 3: Design and Analysis, V003T03A079, July 14–19, 2019
Paper No: PVP2019-93746
DOI: https://doi.org/10.1115/PVP2019-93746
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Topics: Fittings, Pressure, Failure, Heat treating (Metalworking), Yield strength, ASME Boiler and Pressure Vessel Code, Design, Finite element model, Pipe fitting, Pipelines
Proceedings Papers

Constitutive Behavior of SAC Leadfree Alloys at High Strain Rates

Pradeep Lall, Sandeep Shantaram, Mandar Kulkarni, Geeta Limaye, Jeff Suhling
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 519-536, July 6–8, 2011
Paper No: IPACK2011-52194
DOI: https://doi.org/10.1115/IPACK2011-52194
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Topics: Alloys, Shock (Mechanics), Failure, Solders, Constitutive equations, Copper, Fracture (Process), Lead-free solders, Damage, Electronic products
Proceedings Papers

SIF Evaluation Using XFEM and Line Spring Models Under High Strain Rate Environment for Leadfree Alloys

Pradeep Lall, Mandar Kulkarni, Sandeep Shantaram, Jeff Suhling
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 281-297, July 6–8, 2011
Paper No: IPACK2011-52196
DOI: https://doi.org/10.1115/IPACK2011-52196
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Topics: Alloys, Springs, Copper, Solders, Fracture (Materials), Shock (Mechanics), Failure, Fracture toughness, Stress, Ball-Grid-Array packages
Proceedings Papers

Damage Accumulation and Life-Prediction Models for SnAgCu Leadfree Electronics Under Shock-Impact

Pradeep Lall, Sandeep Shantaram, Arjun Angral, Mandar Kulkarni, Jeff Suhling
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 887-901, July 19–23, 2009
Paper No: InterPACK2009-89307
DOI: https://doi.org/10.1115/InterPACK2009-89307
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Topics: Damage, Electronics, Shock (Mechanics), Alloys, Failure mechanisms, Solders, Transients (Dynamics), Failure, Finite element analysis, Reliability