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Journal Articles

Flow-Induced Vibrations of a Rotated Square Tube Array Subjected to Single-Phase Cross-Flow

Sameh Darwish, Abdallah Hadji, H. P. Pham, Njuki Mureithi, Minki Cho
Journal: Journal of Pressure Vessel Technology
Article Type: Research-Article
J. Pressure Vessel Technol. August 2022, 144(4): 041405.
Paper No: PVT-21-1139
https://doi.org/10.1115/1.4053164
Published Online: January 13, 2022
View Article titled, Flow-Induced Vibrations of a Rotated Square Tube Array Subjected to Single-Phase Cross-Flow
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Topics: Cross-flow, Flow (Dynamics), Flow-induced vibrations, Vibration, Spectra (Spectroscopy), Water, Vorticity, Excitation
Proceedings Papers

Buckling Analysis of Tube for Steam Generator According to ASME B&PV Code

Jungpyo Kong, Changhoon Ha, Minki Cho, Seunghoon Yeo, Tae-Jung Park
Proc. ASME. ICONE22, Volume 1: Plant Operations, Maintenance, Engineering, Modifications, Life Cycle and Balance of Plant; Nuclear Fuel and Materials; Plant Systems, Structures and Components; Codes, Standards, Licensing and Regulatory Issues, V001T03A020, July 7–11, 2014
Paper No: ICONE22-30598
https://doi.org/10.1115/ICONE22-30598
View Paper titled, Buckling Analysis of Tube for Steam Generator According to ASME B&PV Code
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Topics: Boilers, Buckling, Pressure, External pressure, Collapse, Finite element analysis, Computer software, Eigenvalues, Failure, Heat transfer
Journal Articles

Thermal Investigation Into Power Multiplexing for Homogeneous Many-Core Processors

Man Prakash Gupta, Minki Cho, Saibal Mukhopadhyay, Satish Kumar
Journal: Journal of Heat Transfer
Article Type: Electronic Cooling
J. Heat Transfer. June 2012, 134(6): 061401.
https://doi.org/10.1115/1.4006012
Published Online: May 2, 2012
View Article titled, Thermal Investigation Into Power Multiplexing for Homogeneous Many-Core Processors
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Topics: Temperature, Thermal management
Proceedings Papers

An Investigation of Power Migration Policies for Many-Core Processors to Manage On-Chip Thermal Profile

Man Prakash Gupta, Minki Cho, Saibal Mukhopadhyay, Satish Kumar
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 153-163, July 6–8, 2011
Paper No: IPACK2011-52094
https://doi.org/10.1115/IPACK2011-52094
View Paper titled, An Investigation of Power Migration Policies for Many-Core Processors to Manage On-Chip Thermal Profile
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Topics: Electronic packages, Energy dissipation, Integrated circuits, Reliability, Temperature, Temperature gradient, Thermal management