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Nicolas Lamaison
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Journal Articles

Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis

Nicolas Lamaison, Raffaele L. Amalfi, Todd Salamon, Jackson B. Marcinichen, John R. Thome
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010901.
Paper No: EP-17-1085
DOI: https://doi.org/10.1115/1.4039091
Published Online: March 2, 2018
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Topics: Condensers (steam plant), Flow (Dynamics), Heat, Secondary cells, Stress, Temperature, Subcooling, Cooling systems, Refrigerants, Electronics
Proceedings Papers

Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis

Nicolas Lamaison, Raffaele L. Amalfi, Jackson B. Marcinichen, John R. Thome, Todd Salamon
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, August 29–September 1, 2017
Paper No: IPACK2017-74020
DOI: https://doi.org/10.1115/IPACK2017-74020
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Topics: Cooling systems, Electronics, Experimental analysis, Secondary cells, Boiling, Computer cooling, Condensers (steam plant), Cooling, Cylinders, Electronic components
Proceedings Papers

Two-Phase Mini-Thermosyphon for Cooling of Datacenters: Experiments, Modeling and Simulations

Chin L. Ong, Raffaele L. Amalfi, Jackson B. Marcinichen, Nicolas Lamaison, John R. Thome
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, August 29–September 1, 2017
Paper No: IPACK2017-74030
DOI: https://doi.org/10.1115/IPACK2017-74030
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Topics: Cooling, Modeling, Simulation, Heat, Density, Energy dissipation, Flow (Dynamics), Temperature, Water, Acoustics
Journal Articles

Transient Data Processing of Flow Boiling Local Heat Transfer in a Multi-Microchannel Evaporator Under a Heat Flux Disturbance

Houxue Huang, Nicolas Lamaison, John R. Thome
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011005.
Paper No: EP-16-1083
DOI: https://doi.org/10.1115/1.4035386
Published Online: January 5, 2017
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Topics: Boiling, Flow (Dynamics), Fluids, Heat conduction, Heat flux, Heat transfer, Heat transfer coefficients, Microchannels, Pressure drop, Temperature
Proceedings Papers

Passive Thermosyphon Cooling System for High Heat Flux Servers

Sylwia Szczukiewicz, Nicolas Lamaison, Jackson B. Marcinichen, John R. Thome, Peter J. Beucher
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A009, July 6–9, 2015
Paper No: IPACK2015-48288
DOI: https://doi.org/10.1115/IPACK2015-48288
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Topics: Cooling systems, Heat flux, Cooling, Critical heat flux, Design, Condensers (steam plant), Fluids, Heat, Heat exchangers, Pipeline risers
Proceedings Papers

Dynamic Modeling of a Two-Phase On-Chip Cooling System Applied on Parallel High Performance Microprocessors

Nicolas Lamaison, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A021, July 16–18, 2013
Paper No: IPACK2013-73264
DOI: https://doi.org/10.1115/IPACK2013-73264
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Topics: Cooling systems, Dynamic modeling, Heat, Critical heat flux, Flow (Dynamics), Temperature, Transients (Dynamics), Condensers (steam plant), Pumps, Simulation
Journal Articles

Two-Phase Flow Control of Electronics Cooling With Pseudo-CPUs in Parallel Flow Circuits: Dynamic Modeling and Experimental Evaluation

Nicolas Lamaison, Jackson Braz Marcinichen, John Richard Thome
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 030908.
Paper No: EP-12-1088
DOI: https://doi.org/10.1115/1.4024590
Published Online: July 24, 2013
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Topics: Cooling, Flow (Dynamics), Heat, Simulation, Transients (Dynamics), Vapors, Two-phase flow, Temperature, Pipes, Steady state