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Proceedings Papers

Physics of Failure Based CAD Software for Reliability Assessment of Hybrid Optoelectronic Packages

Patricia F. Mead, Patrick McCluskey, Qing Yan Chen, Don Haislett
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 205-211, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0735
https://doi.org/10.1115/IMECE1996-0735
View Paper titled, Physics of Failure Based CAD Software for Reliability Assessment of Hybrid Optoelectronic Packages
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Topics: Computer software, Computer-aided design, Failure, Physics, Reliability, Lasers, Light-emitting diodes, Optoelectronic devices, Printed circuit board assemblies, Computer-aided engineering
Journal Articles

Special Section on InterPACK2021

Jin Yang, Przemyslaw Gromala, Sukwon Choi, Damena Agonafer, Patrick McCluskey
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. March 2023, 145(1): 010301.
Paper No: EP-22-1094
https://doi.org/10.1115/1.4056558
Published Online: January 11, 2023
View Article titled, Special Section on InterPACK2021
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Topics: Additive manufacturing, Artificial intelligence, Data centers, Electronic packaging, Electronics, Engineering teachers, Integrated circuit packaging, Integrated circuits, Microelectromechanical systems, Microelectronic devices
Proceedings Papers

AI-Based Reliability Assessment of Power Electronic Systems

F. Patrick McCluskey, Clifton Buxbaum, Sudip K. Mazumder, Arif Sarwat, Matt Ursino, Miles C. Russell
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A015, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97614
https://doi.org/10.1115/IPACK2022-97614
View Paper titled, AI-Based Reliability Assessment of Power Electronic Systems
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Topics: Digital twin, Electronic systems, Reliability
Proceedings Papers

Reliable Additive Manufacturing Using Transient Liquid Phase Sintering

Gilad Nave, Clifton Buxbaum, F. Patrick McCluskey
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A012, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73367
https://doi.org/10.1115/IPACK2021-73367
View Paper titled, Reliable Additive Manufacturing Using Transient Liquid Phase Sintering
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Topics: Additive manufacturing, Sintering, Tension-leg platforms, Transients (Dynamics)
Journal Articles

Air Cooling of Power Electronics Through Vertically Enhanced Manifold Microchannel Systems (VEMMS)

Sevket U. Yuruker, Raphael K. Mandel, Patrick McCluskey, Michael M. Ohadi
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. October 2021, 143(10): 101501.
Paper No: HT-21-1514
https://doi.org/10.1115/1.4051999
Published Online: September 8, 2021
View Article titled, Air Cooling of Power Electronics Through Vertically Enhanced Manifold Microchannel Systems (VEMMS)
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Topics: Cooling, Electronics, Flow (Dynamics), Heat, Heat sinks, Manifolds, Manufacturing, Microchannels, Switches, Thermal management
Proceedings Papers

Advanced Packaging and Thermal Management of High-Power DC-DC Converters

Sevket U. Yuruker, Raphael K. Mandel, Patrick McCluskey, Michael M. Ohadi, Shiladri Chakraborty, Yongwan Park, He Yun, Alireza Khaligh, Lauren Boteler, Miguel Hinojosa
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A026, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6559
https://doi.org/10.1115/IPACK2019-6559
View Paper titled, Advanced Packaging and Thermal Management of High-Power DC-DC Converters
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Topics: Electronics, Packaging, Packaging density (Electronics), Thermal management
Proceedings Papers

Thermal Assessment and In-Situ Monitoring of Insulated Gate Bipolar Transistors in Power Electronic Modules

Erick Gutierrez, Kevin Lin, Douglas DeVoto, Patrick McCluskey
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A020, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6470
https://doi.org/10.1115/IPACK2019-6470
View Paper titled, Thermal Assessment and In-Situ Monitoring of Insulated Gate Bipolar Transistors in Power Electronic Modules
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Topics: Gates (Closures), Transistors
Proceedings Papers

Mechanical Characterization of Transient Liquid Phase Sintered (TLPS) Cu-Sn

Erick Gutierrez, Subramani Manoharan, Maxim Serebreni, Patrick McCluskey
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A018, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8392
https://doi.org/10.1115/IPACK2018-8392
View Paper titled, Mechanical Characterization of Transient Liquid Phase Sintered (TLPS) Cu-Sn
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Topics: Tension-leg platforms, Tin, Transients (Dynamics), Alloys, High temperature, Nanoindentation, Shear (Mechanics), Stress, Copper, Electronic systems
Proceedings Papers

Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects Under Mean Temperature Conditions

Maxim Serebreni, Patrick McCluskey, David Hillman, Nathan Blattau, Craig Hillman
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8338
https://doi.org/10.1115/IPACK2018-8338
View Paper titled, Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects Under Mean Temperature Conditions
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Topics: Cycles, Fatigue, Solders, Temperature, Solder joints, Ball-Grid-Array packages, Ball-Grid-Array packaging, Coatings, Dimensions, Electronic products
Journal Articles

Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermomechanical Simulation

Hannes Greve, S. Ali Moeini, Patrick McCluskey, Shailesh Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020903.
Paper No: EP-17-1100
https://doi.org/10.1115/1.4039265
Published Online: May 9, 2018
View Article titled, Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermomechanical Simulation
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Proceedings Papers

Advancements in Silver Wire Bonding

Subramani Manoharan, Chandradip Patel, Patrick McCluskey
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A004, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74286
https://doi.org/10.1115/IPACK2017-74286
View Paper titled, Advancements in Silver Wire Bonding
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Topics: Silver, Wire bonding, Copper, Wire, Reliability, Bonding, Corrosion, Light-emitting diodes, Palladium, Aerospace industry
Proceedings Papers

Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermo-Mechanical Simulation

Hannes Greve, S. Ali Moeini, Patrick McCluskey, Shailesh Joshi
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74138
https://doi.org/10.1115/IPACK2017-74138
View Paper titled, Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermo-Mechanical Simulation
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Topics: Cracking (Materials), Fracture (Process), High temperature, Simulation, Thermomechanics, Transients (Dynamics), Tension-leg platforms, Stress, Fracture (Materials), Tin
Journal Articles

Modeling Thermal Microspreading Resistance in Via Arrays

Michael Fish, Patrick McCluskey, Avram Bar-Cohen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010909.
Paper No: EP-15-1097
https://doi.org/10.1115/1.4032348
Published Online: March 11, 2016
View Article titled, Modeling Thermal Microspreading Resistance in Via Arrays
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Topics: Boundary-value problems, Convection, Electrical conductivity, Modeling, Thermal conductivity, Heat, Flow (Dynamics), Finite element model
Proceedings Papers

High Temperature Shear Strength of Cu-Sn Transient Liquid Phase Sintered Interconnects

Hannes Greve, S. Ali Moeini, Patrick McCluskey, Shailesh Joshi
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A037, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48577
https://doi.org/10.1115/IPACK2015-48577
View Paper titled, High Temperature Shear Strength of Cu-Sn Transient Liquid Phase Sintered Interconnects
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Topics: High temperature, Shear strength, Tin, Transients (Dynamics), Creep, Sinter (Metallurgy), Temperature, Sintering, Tension-leg platforms, Copper
Proceedings Papers

Modeling Thermal Spreading Resistance in Via Arrays

Michael Fish, Patrick McCluskey, Avram Bar-Cohen
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A070, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48422
https://doi.org/10.1115/IPACK2015-48422
View Paper titled, Modeling Thermal Spreading Resistance in Via Arrays
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Topics: Modeling, Boundary-value problems, Anisotropy, Computer simulation, Computer software, Electronic packages, Finite element analysis, Flow (Dynamics), Heat, Heat flux
Proceedings Papers

Reliable Integration of Microchannel Coolers for Power Electronics

David Squiller, Sumeer Khanna, Serguei Dessiatoun, Raphael Mandel, Michael Ohadi, Patrick McCluskey
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A015, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48757
https://doi.org/10.1115/IPACK2015-48757
View Paper titled, Reliable Integration of Microchannel Coolers for Power Electronics
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Topics: Coolers, Electronics, Microchannels, Corrosion, Electronic packages, Electronic systems, Erosion, Failure mechanisms, Fracture (Materials), Fracture (Process)
Proceedings Papers

Embedded Two-Phase Cooling of High Flux Electronics via Micro-Enabled Surfaces and Fluid Delivery Systems (FEEDS)

Raphael Mandel, Serguei Dessiatoun, Patrick McCluskey, Michael Ohadi
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A012, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48496
https://doi.org/10.1115/IPACK2015-48496
View Paper titled, Embedded Two-Phase Cooling of High Flux Electronics via Micro-Enabled Surfaces and Fluid Delivery Systems (FEEDS)
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Topics: Cooling, Electronics, Fluids, Vapors, Heat flux, Pressure drop, Computational fluid dynamics, Engineering simulation, Experimental design, Heat transfer
Proceedings Papers

Transient Liquid Phase Sintered Joints for Power Electronic Modules

Hannes Greve, F. Patrick McCluskey
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A004, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73209
https://doi.org/10.1115/IPACK2013-73209
View Paper titled, Transient Liquid Phase Sintered Joints for Power Electronic Modules
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Topics: Transients (Dynamics), Melting point, Metals, Shear strength, Sinter (Metallurgy), Temperature, Copper, Shear (Mechanics), Tension-leg platforms, Binders (Materials)
Journal Articles

Two-Phase Liquid Cooling for Thermal Management of IGBT Power Electronic Module

Peng Wang, Patrick McCluskey, Avram Bar-Cohen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021001.
Paper No: EP-12-1012
https://doi.org/10.1115/1.4023215
Published Online: March 28, 2013
View Article titled, Two-Phase Liquid Cooling for Thermal Management of IGBT Power Electronic Module
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Topics: Cooling, Flow (Dynamics), Fluids, Heat transfer coefficients, Temperature, Vapors, Thermal resistance, Pressure drop, Thermal management
Proceedings Papers

Evaluation of Two-Phase Cold Plate for Cooling Electric Vehicle Power Electronics

Peng Wang, Patrick McCluskey, Avram Bar-Cohen
Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 823-835, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-64330
https://doi.org/10.1115/IMECE2011-64330
View Paper titled, Evaluation of Two-Phase Cold Plate for Cooling Electric Vehicle Power Electronics
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Topics: Cooling, Electric vehicles, Electronics, Temperature, Thermal management, Engines, Flow (Dynamics), Geometry, Heat flux, Motors