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Peter Borgesen
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Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A015, July 16–18, 2013
Paper No: IPACK2013-73225
Journal Articles
Proceedings Papers

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 105-109, November 17–22, 2002
Paper No: IMECE2002-39251
Proceedings Papers

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 111-115, November 17–22, 2002
Paper No: IMECE2002-39252
Proceedings Papers

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 465-469, November 17–22, 2002
Paper No: IMECE2002-39208
Proceedings Papers

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 117-123, November 17–22, 2002
Paper No: IMECE2002-39253
Proceedings Papers

Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 399-405, November 5–11, 2005
Paper No: IMECE2005-83030