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Journal Articles

Solderability and Reliability of Sintered Nano-Ag Bond Pads of Printed Re-Distribution Layer

J. C. C. Lo, Q. Jiang, X. Qiu, N. Tu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011103.
Paper No: EP-22-1013
https://doi.org/10.1115/1.4055840
Published Online: October 22, 2022
View Article titled, Solderability and Reliability of Sintered Nano-Ag Bond Pads of Printed Re-Distribution Layer
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Topics: High temperature, Inks, Reliability, Shear (Mechanics), Sintering, Storage, Solders, Additive manufacturing, Solder joints
Proceedings Papers

A Model of Crack Nucleation in Layered Electronic Assemblies Under Thermal Cycling

A. Chandra, Y. Huang, Z. Q. Jiang, K. X. Hu
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 139-147, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0926
https://doi.org/10.1115/IMECE1999-0926
View Paper titled, A Model of Crack Nucleation in Layered Electronic Assemblies Under Thermal Cycling
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Topics: Fracture (Materials), Nucleation (Physics), Damage, Cycles, Crack propagation, Dislocations, Fatigue cracks, Fracture mechanics, Microscale devices, Springs
Journal Articles

Numerical Simulation of Forced Convective Condensation of Propane in a Spiral Tube

G. D. Qiu, W. H. Cai, Z. Y. Wu, Y. Yao, Y. Q. Jiang
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. April 2015, 137(4): 041502.
Paper No: HT-14-1162
https://doi.org/10.1115/1.4029475
Published Online: April 1, 2015
View Article titled, Numerical Simulation of Forced Convective Condensation of Propane in a Spiral Tube
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Topics: Computer simulation, Condensation, Flow (Dynamics), Heat transfer coefficients, Pressure drop, Simulation, Turbulence, Vapors, Modeling, Heat transfer
Proceedings Papers

Dynamic Model Construction of an Industrial Flue Gas Recirculation (FGR) Furnace for Real-Time NOx Emission Control

Q. Jiang, C. Zhang, J. Jiang
Proc. ASME. IJPGC2003, 2003 International Joint Power Generation Conference, 763-770, June 16–19, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IJPGC2003-40110
https://doi.org/10.1115/IJPGC2003-40110
View Paper titled, Dynamic Model Construction of an Industrial Flue Gas Recirculation (FGR) Furnace for Real-Time NOx Emission Control
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Topics: Air pollution control, Construction, Dynamic models, Flue gases, Furnaces, Nitrogen oxides, Combustion, Computer simulation, Design, Emissions
Proceedings Papers

A Sensitivity Study of NOx Emission to the Change in the Input Variables of a FGR Industrial Furnace

Q. Jiang, C. Zhang, J. Jiang
Proc. ASME. HT2003, Heat Transfer: Volume 2, 95-102, July 21–23, 2003
Publisher: American Society of Mechanical Engineers
Paper No: HT2003-47315
https://doi.org/10.1115/HT2003-47315
View Paper titled, A Sensitivity Study of NOx Emission to the Change in the Input Variables of a FGR Industrial Furnace
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Topics: Emissions, Industrial furnaces, Nitrogen oxides, Combustion, Dynamic models, Furnaces, Radiation (Physics), Absorption, Density, Equilibrium (Physics)
Journal Articles

Reduction of NOx in a Regenerative Industrial Furnace With the Addition of Methanol in the Fuel

Q. Jiang, C. Zhang, J. Jiang
Journal: Journal of Energy Resources Technology
Publisher: ASME
Article Type: Technical Papers
J. Energy Resour. Technol. June 2004, 126(2): 159–165.
https://doi.org/10.1115/1.1739412
Published Online: June 22, 2004
View Article titled, Reduction of NOx in a Regenerative Industrial Furnace With the Addition of Methanol in the Fuel
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Topics: Combustion, Fuels, Furnaces, Industrial furnaces, Methanol, Nitrogen oxides, Turbulence, Equilibrium (Physics)
Journal Articles

A Model of Crack Nucleation in Layered Electronic Assemblies Under Thermal Cycling

A. Chandra, Y. Huang, Z. Q. Jiang, K. X. Hu, G. Fu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 220–226.
https://doi.org/10.1115/1.1286100
Published Online: November 5, 1999
View Article titled, A Model of Crack Nucleation in Layered Electronic Assemblies Under Thermal Cycling
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Topics: Damage, Fracture (Materials), Nucleation (Physics), Stress, Cycles, Microscale devices
Journal Articles

Thermal Stresses in Layered Electronic Assemblies

Z. Q. Jiang, Y. Huang, A. Chandra
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1997, 119(2): 127–132.
https://doi.org/10.1115/1.2792218
Published Online: June 1, 1997
View Article titled, Thermal Stresses in Layered Electronic Assemblies
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Topics: Thermal stresses, Adhesives, Design, Stress, Electronic packages, Electronics, Euler-Bernoulli beam theory, Failure, Finite element analysis, Finite element methods