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Journal Articles

Prediction of Board Level Pad Cratering Strength With the Predefined Failure Criteria From Joint Level Testing

Qiming Zhang, S. W. Ricky Lee
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041010.
Paper No: EP-21-1030
https://doi.org/10.1115/1.4053309
Published Online: January 28, 2022
View Article titled, Prediction of Board Level Pad Cratering Strength With the Predefined Failure Criteria From Joint Level Testing
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Topics: Failure, Shear (Mechanics), Testing, Finite element analysis
Proceedings Papers

Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications

John H. Lau, S. W. Ricky Lee, Stephen H. Pan, Chris Chang
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 135-144, November 5–10, 2000
Paper No: IMECE2000-2255
https://doi.org/10.1115/IMECE2000-2255
View Paper titled, Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications
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Topics: Flip-chip, Flip-chip devices, Solders, Creep, Solder joints, Cross section (Physics), Design, Printed circuit board assemblies, Printed circuit boards, Reliability
Journal Articles

Fabrication and Reliability Assessment of Cu Pillar Microbumps With Printed Polymer Cores

Xing Qiu, Jeffery C. C. Lo, Yuanjie Cheng, S. W. Ricky Lee, Yong Jhe Tseng, Peter Chiu
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031010.
Paper No: EP-20-1102
https://doi.org/10.1115/1.4049129
Published Online: January 19, 2021
View Article titled, Fabrication and Reliability Assessment of Cu Pillar Microbumps With Printed Polymer Cores
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Topics: Columns (Structural), Manufacturing, Polymers, Reliability, Temperature, Silicon chips, Bonding
Journal Articles

Assessment of Fatigue Induced Pad Cratering With a Universal Expression of Printed Circuit Board Fatigue Resistance

Qiming Zhang, S. W. Ricky Lee
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021008.
Paper No: EP-19-1006
https://doi.org/10.1115/1.4046555
Published Online: March 18, 2020
View Article titled, Assessment of Fatigue Induced Pad Cratering With a Universal Expression of Printed Circuit Board Fatigue Resistance
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Topics: Ball-Grid-Array packaging, Epoxy resins, Failure, Fatigue, Finite element analysis, Printed circuit boards, Cycles, Fatigue failure
Journal Articles

Correlation of Warpage Distribution With the Material Property Scattering for Warpage Range Prediction of PBGA Components

Qiming Zhang, Jeffery C. C. Lo, S. W. Ricky Lee, Wei Xu
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041005.
Paper No: EP-17-1072
https://doi.org/10.1115/1.4041064
Published Online: September 10, 2018
View Article titled, Correlation of Warpage Distribution With the Material Property Scattering for Warpage Range Prediction of PBGA Components
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Topics: Ball-Grid-Array packaging, Electromagnetic scattering, Materials properties, Radiation scattering, Scattering (Physics), Temperature, Thermal expansion, Warping, Simulation, Laminates
Proceedings Papers

Modeling and Parametric Study of Light Scattering, Absorption and Emission of Phosphor in a White Light-Emitting Diode

Jiaqi Wang, Jeffery C. C. Lo, S. W. Ricky Lee, Feng Yun, Mian Tao
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A046, July 6–9, 2015
Paper No: IPACK2015-48664
https://doi.org/10.1115/IPACK2015-48664
View Paper titled, Modeling and Parametric Study of Light Scattering, Absorption and Emission of Phosphor in a White Light-Emitting Diode
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Topics: Absorption, Emissions, Light scattering, Light-emitting diodes, Modeling, Phosphors, Wavelength, Excitation, Emission spectra, Plates (structures)
Journal Articles

Comparison of Ball Pull Strength Among Various Sn-Cu-Ni Solder Joints With Different Pad Surface Finishes

Chaoran Yang, Fubin Song, S. W. Ricky Lee
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011003.
Paper No: EP-12-1017
https://doi.org/10.1115/1.4025915
Published Online: November 28, 2013
View Article titled, Comparison of Ball Pull Strength Among Various Sn-Cu-Ni Solder Joints With Different Pad Surface Finishes
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Topics: Finishes, Solder joints, Solders, Tin, Temperature, Inspection
Proceedings Papers

Fast Copper Plating Process for Through Silicon Via (TSV) Filling

Su Wang, S. W. Ricky Lee
Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 855-863, November 11–17, 2011
Paper No: IMECE2011-64782
https://doi.org/10.1115/IMECE2011-64782
View Paper titled, Fast Copper Plating Process for Through Silicon Via (TSV) Filling
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Topics: Copper, Electroplating, Plating, Silicon
Proceedings Papers

Embedded 3D Hybrid IC Integration System-in-Package (SiP) for Opto-Electronic Interconnects in Organic Substrates

John H. Lau, M. S. Zhang, S. W. Ricky Lee
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 129-136, November 12–18, 2010
Paper No: IMECE2010-40974
https://doi.org/10.1115/IMECE2010-40974
View Paper titled, Embedded 3D Hybrid IC Integration System-in-Package (SiP) for Opto-Electronic Interconnects in Organic Substrates
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Topics: Cavities, Circuits, Continuum mechanics, Engineering simulation, Flat heat pipes, Heat, Heat transfer, Lasers, Optical instruments, Optical interconnections
Proceedings Papers

Thermal-Enhanced and Cost-Effective 3D IC Integration With TSV (Through-Silicon Via) Interposers for High-Performance Applications

John H. Lau, Y. S. Chan, S. W. Ricky Lee
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 137-144, November 12–18, 2010
Paper No: IMECE2010-40975
https://doi.org/10.1115/IMECE2010-40975
View Paper titled, Thermal-Enhanced and Cost-Effective 3D IC Integration With TSV (Through-Silicon Via) Interposers for High-Performance Applications
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Topics: Silicon, Flat heat pipes, Heat sinks, Creep, Engineering simulation, Flip-chip devices, Heat transfer, Reliability, Simulation, Structural design
Proceedings Papers

Comparison of Fatigue Crack Initiation/Propagation and Daisy-Chain Resistance in Lead-Free Solder Joints Under Temperature Cycling Test

Y. Sing Chan, F. B. Song, S. W. Ricky Lee, C. R. Yang, Jeffery C. C. Lo
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 579-583, July 6–8, 2011
Paper No: IPACK2011-52219
https://doi.org/10.1115/IPACK2011-52219
View Paper titled, Comparison of Fatigue Crack Initiation/Propagation and Daisy-Chain Resistance in Lead-Free Solder Joints Under Temperature Cycling Test
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Topics: Chain, Fatigue cracks, Lead-free solders, Temperature, Solder joints, Electrical resistance, Failure, Fatigue, Fatigue failure, Fracture (Materials)
Journal Articles

Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards

John H. Lau, M. S. Zhang, S. W. Ricky Lee
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031010.
https://doi.org/10.1115/1.4004861
Published Online: September 26, 2011
View Article titled, Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards
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Topics: Design, Polymers, System-in-package, Waveguides, Simulation, Printed circuit boards, Optical interconnections, Integrated circuits, Engineering simulation, Heat
Proceedings Papers

Assessment of Relative Thermal Fatigue Life of SAC Lead-Free and Tin-Lead Solders With Custom-Made BGA Assemblies Creating Various Stress Ranges

Y. S. Chan, C. Yang, S. W. Ricky Lee
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 803-807, July 19–23, 2009
Paper No: InterPACK2009-89260
https://doi.org/10.1115/InterPACK2009-89260
View Paper titled, Assessment of Relative Thermal Fatigue Life of SAC Lead-Free and Tin-Lead Solders With Custom-Made BGA Assemblies Creating Various Stress Ranges
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Topics: Ball-Grid-Array packaging, Fatigue life, Solders, Stress, Solder joints, Copper, Creep, Cycles, Manufacturing, Relaxation (Physics)
Proceedings Papers

Effects of Tooling Tip Wear and Fixture Rigidity on Solder Ball Shear and Ball Pull Tests

Fubin Song, S. W. Ricky Lee
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 889-894, July 8–12, 2007
Paper No: IPACK2007-33933
https://doi.org/10.1115/IPACK2007-33933
View Paper titled, Effects of Tooling Tip Wear and Fixture Rigidity on Solder Ball Shear and Ball Pull Tests
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Topics: Shear (Mechanics), Solders, Stiffness, Tooling, Wear, Failure mechanisms, Fracture (Materials), Gluing, Brittleness, Electromagnetic scattering
Proceedings Papers

Screen-Printing of Yellow Phosphor Powder on Blue Light Emitting Diode (LED) Arrays for White Light Illumination

K. H. Lee, S. W. Ricky Lee
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 19-24, July 8–12, 2007
Paper No: IPACK2007-33971
https://doi.org/10.1115/IPACK2007-33971
View Paper titled, Screen-Printing of Yellow Phosphor Powder on Blue Light Emitting Diode (LED) Arrays for White Light Illumination
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Topics: Light-emitting diodes, Phosphors, Printing, Coating processes, Coatings, Circuit design, Density, Manufacturing, Packing (Shipments), Packings (Cushioning)
Proceedings Papers

Investigation of Moisture Sensitivity Related Failure Mechanism of Quad Flat No-Lead (QFN) Packages

Minshu Zhang, S. W. Ricky Lee
Proc. ASME. IMECE2008, Volume 6: Electronics and Photonics, 213-218, October 31–November 6, 2008
Paper No: IMECE2008-68120
https://doi.org/10.1115/IMECE2008-68120
View Paper titled, Investigation of Moisture Sensitivity Related Failure Mechanism of Quad Flat No-Lead (QFN) Packages
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Topics: Failure mechanisms, Adhesion, Engineering simulation, Failure, Materials properties, Simulation, Ambiguity, Delamination, Finite element analysis, Finite element model
Proceedings Papers

Stress Analysis of Hygrothermal Delamination of Quad Flat No-Lead (QFN) Packages

Minshu Zhang, S. W. Ricky Lee, Xuejun Fan
Proc. ASME. IMECE2008, Volume 12: Mechanics of Solids, Structures and Fluids, 339-347, October 31–November 6, 2008
Paper No: IMECE2008-68110
https://doi.org/10.1115/IMECE2008-68110
View Paper titled, Stress Analysis of Hygrothermal Delamination of Quad Flat No-Lead (QFN) Packages
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Topics: Delamination, Stress analysis (Engineering), Simulation, Stress, Finite element analysis, Finite element model, Reliability, Complex systems, Failure, Failure mechanisms
Proceedings Papers

Fabrication of Nanoscale Vias by Offset Patterning

Chi Ho Lau, S. W. Ricky Lee
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 615-618, June 3–5, 2008
Paper No: MicroNano2008-70131
https://doi.org/10.1115/MicroNano2008-70131
View Paper titled, Fabrication of Nanoscale Vias by Offset Patterning
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Topics: Manufacturing, Nanoscale phenomena, Photolithography, Size reduction (Materials)
Proceedings Papers

Design and Fabrication of MEMS Based Microphone Module by Using 3D Chip-on-Chip Package

Jeffery C. C. Lo, S. W. Ricky Lee
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 47-54, November 11–15, 2007
Paper No: IMECE2007-42561
https://doi.org/10.1115/IMECE2007-42561
View Paper titled, Design and Fabrication of MEMS Based Microphone Module by Using 3D Chip-on-Chip Package
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Topics: Design, Manufacturing, Microelectromechanical systems, Microphones, Packaging, Flip-chip, Flip-chip devices, Flow (Dynamics), Wire, Diaphragms (Mechanical devices)
Proceedings Papers

Thermal-Fatigue Life Prediction Equation for Plastic Ball Grid Array (PBGA) SnAgCu Lead-Free Solder Joints

John Lau, S. W. Ricky Lee, Fubin Song, Dongkai Shangguan, Dennis C. Lau, Walter Dauksher
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1013-1019, July 17–22, 2005
Paper No: IPACK2005-73362
https://doi.org/10.1115/IPACK2005-73362
View Paper titled, Thermal-Fatigue Life Prediction Equation for Plastic Ball Grid Array (PBGA) SnAgCu Lead-Free Solder Joints
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Topics: Ball-Grid-Array packaging, Fatigue, Lead-free solders, Alloys, Failure mechanisms, Vehicles