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Proceedings Papers

Thermal Transport Across Al-(Al x Ga 1-x ) 2 O 3 and Al-Ga 2 O 3 Interfaces

Jingjing Shi, Anusha Krishnan, A. F. M. Anhar Uddin Bhuiyan, Yee Rui Koh, Kenny Huynh, Akhil Mauze, Sai Mu, Brian M. Foley, Habib Ahmad, Takeki Itoh, Yuewei Zhang, Chao Yuan, Samuel Kim, W. Alan Doolittle, Chris Van de Walle, James S. Speck, Mark Goorsky, Patrick Hopkins, Hongping Zhao, Samuel Graham
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A005, October 26–28, 2021
Paper No: IPACK2021-74116
DOI: https://doi.org/10.1115/IPACK2021-74116
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Topics: Alloys, Aluminum, Cathode rays, Chemical reactions, Cooling, Electrical conductance, Electron beams, Electronics, Energy dissipation, Gallium
Journal Articles

Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging

Ronald J. Warzoha, Adam A. Wilson, Brian F. Donovan, Nazli Donmezer, Ashutosh Giri, Patrick E. Hopkins, Sukwon Choi, Darshan Pahinkar, Jingjing Shi, Samuel Graham, Zhiting Tian, Laura Ruppalt
Journal: Journal of Electronic Packaging
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020804.
Paper No: EP-20-1070
DOI: https://doi.org/10.1115/1.4049293
Published Online: February 22, 2021
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Topics: Electronics, Gallium nitride, Heat, Nanoscale phenomena, Phonons, Temperature, Thermal conductivity, Electromagnetic scattering, Energy gap, Diamonds
Journal Articles

Guidelines for Reduced-Order Thermal Modeling of Multifinger GaN HEMTs

Robert Pearson, Bikramjit Chatterjee, Samuel Kim, Samuel Graham, Alexander Rattner, Sukwon Choi
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021012.
Paper No: EP-19-1087
DOI: https://doi.org/10.1115/1.4046620
Published Online: April 6, 2020
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Topics: Gallium nitride, Gates (Closures), Heat, Modeling, Temperature, Heat flux, Heating, Critical heat flux, Heart failure, Approximation
Proceedings Papers

Electrothermal Modeling and Analysis of Gallium Oxide Power Switching Devices

Ramchandra M. Kotecha, Andriy Zakutayev, Wyatt K. Metzger, Paul Paret, Gilberto Moreno, Bidzina Kekelia, Kevin Bennion, Barry Mather, Sreekant Narumanchi, Samuel Kim, Samuel Graham
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A017, October 7–9, 2019
Paper No: IPACK2019-6453
DOI: https://doi.org/10.1115/IPACK2019-6453
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Topics: Electronics, Energy gap, Gallium, Modeling
Journal Articles

Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages

Darshan G. Pahinkar, Lauren Boteler, Dimeji Ibitayo, Sreekant Narumanchi, Paul Paret, Douglas DeVoto, Joshua Major, Samuel Graham
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041001.
Paper No: EP-18-1031
DOI: https://doi.org/10.1115/1.4043406
Published Online: May 8, 2019
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Topics: Cooling, Flow (Dynamics), Heat, Heat sinks, Temperature, Geometry, Coolants, Fins, Silicon, Electronic packages
Proceedings Papers

Investigation of the Heterogeneous Thermal Conductivity in Bulk CVD Diamond for Use in Electronics Thermal Management

Luke Yates, Ramez Cheaito, Aditya Sood, Zhe Cheng, Thomas Bougher, Mehdi Asheghi, Kenneth Goodson, Mark Goorsky, Firooz Faili, Dan Twitchen, Samuel Graham
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A014, August 29–September 1, 2017
Paper No: IPACK2017-74163
DOI: https://doi.org/10.1115/IPACK2017-74163
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Topics: Electronics, Synthetic diamonds, Thermal conductivity, Thermal management, Diamonds, Chemical vapor deposition, Electron backscatter diffraction, Lasers, Boron, Heat flux
Proceedings Papers

Optimization of Graphite Composite Latent Heat Storage Systems

Anne Mallow, Kyle Gluesenkamp, Omar Abdelaziz, Samuel Graham
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, August 29–September 1, 2017
Paper No: IPACK2017-74244
DOI: https://doi.org/10.1115/IPACK2017-74244
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Topics: Composite materials, Graphite, Latent heat, Optimization, Storage, Density, Temperature, Heat, Power density, Thermal conductivity
Proceedings Papers

Steady State and Transient Thermal Characterization of Vertical GaN PIN Diodes

Georges Pavlidis, James Dallas, Sukwon Choi, Shyh-Chiang Shen, Samuel Graham
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A011, August 29–September 1, 2017
Paper No: IPACK2017-74149
DOI: https://doi.org/10.1115/IPACK2017-74149
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Topics: Gallium nitride, Steady state, Thermal characterization, Transients (Dynamics), Temperature, Sapphire, Temperature distribution, Heating, Imaging, Joules
Journal Articles

Mechanical Behavior of Carbon Nanotube Forests Grown With Plasma Enhanced Chemical Vapor Deposition: Pristine and Conformally Coated

Parisa Pour Shahid Saeed Abadi, Matthew R. Maschmann, Stephen L. Hodson, Timothy S. Fisher, Jeffery W. Baur, Samuel Graham, Baratunde A. Cola
Journal: Journal of Engineering Materials and Technology
Article Type: Technical Briefs
J. Eng. Mater. Technol. July 2017, 139(3): 034502.
Paper No: MATS-15-1149
DOI: https://doi.org/10.1115/1.4035622
Published Online: March 23, 2017
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Topics: Carbon nanotubes, Mechanical behavior, Plasma-enhanced chemical vapor deposition, Deformation, Stiffness
Proceedings Papers

Transient Thermofluids Analysis of a Ground-Level Integrated Diverse Energy Storage (GLIDES) System

Adewale Odukomaiya, Ayyoub M. Momen, Ahmad Abu-Heiba, Kyle Gluesenkamp, Omar Abdelaziz, Samuel Graham
Proc. ASME. IMECE2015, Volume 6B: Energy, V06BT07A038, November 13–19, 2015
Paper No: IMECE2015-50478
DOI: https://doi.org/10.1115/IMECE2015-50478
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Topics: Energy storage, Thermofluids, Transients (Dynamics), Heat transfer, Amperes, Storage, Compressed air, Density, Differential equations, Electricity (Physics)
Proceedings Papers

The Impact of Interfacial Layers on the Thermal Boundary Resistance and Residual Stress in GaN on Si Epitaxial Layers

Luke Yates, Thomas L. Bougher, Thomas Beechem, Baratunde A. Cola, Samuel Graham
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A009, July 6–9, 2015
Paper No: IPACK2015-48259
DOI: https://doi.org/10.1115/IPACK2015-48259
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Topics: Gallium nitride, Interfacial thermal resistance, Stress, Polishing equipment, Electronics, Crystal structure, Electron mobility, Flow (Dynamics), Heat, Reliability
Proceedings Papers

Transparent Electrodes From Graphene/Single Wall Carbon Nanotube Composites

Hossein Sojoudi, Fernando Reiter, Samuel Graham
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A008, July 16–18, 2013
Paper No: IPACK2013-73158
DOI: https://doi.org/10.1115/IPACK2013-73158
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Topics: Composite materials, Electrodes, Graphene, Single-walled carbon nanotubes, Transparency, Single-walled nanotubes, Chemical vapor deposition, Electrical properties, Annealing, Heat conduction
Proceedings Papers

Modeling the Hotspot Temperature in AlGaN/GaN High Electron Mobility Transistors Using a Non-Gray Phonon BTE Solver

Fatma Nazli Donmezer, Munmun Islam, Samuel Graham, Douglas Yoder
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 1175-1188, November 9–15, 2012
Paper No: IMECE2012-89720
DOI: https://doi.org/10.1115/IMECE2012-89720
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Topics: Electron mobility, Gallium nitride, Modeling, Phonons, Temperature, Transistors, Electrons, Electromagnetic spectrum, Gates (Closures), Electric fields
Journal Articles

A Comparative Study of Thermal Metrology Techniques for Ultraviolet Light Emitting Diodes

Shweta Natarajan, Yishak Habtemichael, Samuel Graham
Journal: Journal of Heat Transfer
Article Type: Research-Article
J. Heat Transfer. September 2013, 135(9): 091201.
Paper No: HT-12-1474
DOI: https://doi.org/10.1115/1.4024359
Published Online: July 26, 2013
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Topics: Infrared spectroscopy, Light-emitting diodes, Metrology, Temperature, Temperature measurement, Ultraviolet radiation, Spectroscopy, Sapphire, Stress
Proceedings Papers

Thermal Characterization of Discrete Device Layers in Al x Ga 1−x N Based Ultraviolet Light Emitting Diodes

Shweta Natarajan, Bobby G. Watkins, Vinod Adivarahan, Asif Khan, Samuel Graham
Proc. ASME. MNHMT2012, ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer, 695-705, March 3–6, 2012
Paper No: MNHMT2012-75146
DOI: https://doi.org/10.1115/MNHMT2012-75146
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Topics: Thermal characterization, Ultraviolet radiation, Temperature, Electroluminescence, Light-emitting diodes, Raman spectroscopy, Quantum wells, Reliability, Temperature measurement, Thermal management
Proceedings Papers

Lattice Boltzmann and Discrete Ordinates Methods for Phonon Transport Modeling: A Comparative Study

Fatma Nazli Donmezer, Dhruv Singh, William James, Adam Christensen, Samuel Graham, Jayathi Y. Murthy
Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 333-343, November 11–17, 2011
Paper No: IMECE2011-64008
DOI: https://doi.org/10.1115/IMECE2011-64008
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Topics: Lattice Boltzmann methods, Modeling, Phonons, Errors, Resolution (Optics), Acoustics, Engineering simulation, Heat, Nanoscale phenomena, Polarization (Electricity)
Journal Articles

Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique

Joseph R. Wasniewski, David H. Altman, Stephen L. Hodson, Timothy S. Fisher, Anuradha Bulusu, Samuel Graham, Baratunde A. Cola
Journal: Journal of Electronic Packaging
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020901.
DOI: https://doi.org/10.1115/1.4005909
Published Online: June 11, 2012
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Topics: Bonding, Carbon nanotubes, Diffusion bonding (Metals), Steady state, Test facilities, Testing, Pressure, Thermal resistance, Nanotubes, Solders
Proceedings Papers

Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique

Joseph R. Wasniewski, David H. Altman, Stephen L. Hodson, Timothy S. Fisher, Anuradha Bulusu, Samuel Graham, Baratunde A. Cola
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 231-240, July 6–8, 2011
Paper No: IPACK2011-52148
DOI: https://doi.org/10.1115/IPACK2011-52148
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Topics: Carbon, Nanotubes, Steady state, Carbon nanotubes, Bonding, Design, Heat, Nanomaterials, Optimization, Pressure
Journal Articles

A Review of Carbon Nanotube Ensembles as Flexible Electronics and Advanced Packaging Materials

Satish Kumar, Baratunde A. Cola, Roderick Jackson, Samuel Graham
Journal: Journal of Electronic Packaging
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020906.
DOI: https://doi.org/10.1115/1.4004220
Published Online: June 17, 2011
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Topics: Carbon nanotubes, Electrodes
Proceedings Papers

Steady State and Pulsed Thermal Simulation of Gateless AlGaN/GaN Heterostructures

William T. James, Anusha Venkatachalam, Samuel Graham
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 725-732, August 8–13, 2010
Paper No: IHTC14-23277
DOI: https://doi.org/10.1115/IHTC14-23277
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Topics: Gallium nitride, Heating, Simulation, Steady state, Transmission lines