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Proceedings Papers

Computational Models of Additive Manufactured Heat Spreading Device for Enhanced Localized Cooling

Zion Clarke, Sonya Smith, Reece Whitt, David Huitink
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A006, October 25–27, 2022
Paper No: IPACK2022-97446
https://doi.org/10.1115/IPACK2022-97446
View Paper titled, Computational Models of Additive Manufactured Heat Spreading Device for Enhanced Localized Cooling
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Topics: Additive manufacturing, Computer simulation, Cooling, Geometry, Heat, Heat sinks, Heat transfer, Manifolds, Nozzles
Proceedings Papers

Thermal Analysis of Wavy Thermal Management System With Phase Change Composite and Pyrolytic Graphite Sheet for Cylindrical Lithium-Ion Battery Packs

Damon Gresham-Chisolm, Sonya Smith
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A005, October 27–29, 2020
Paper No: IPACK2020-2565
https://doi.org/10.1115/IPACK2020-2565
View Paper titled, Thermal Analysis of Wavy Thermal Management System With Phase Change Composite and Pyrolytic Graphite Sheet for Cylindrical Lithium-Ion Battery Packs
Open the PDF for Thermal Analysis of Wavy Thermal Management System With Phase Change Composite and Pyrolytic Graphite Sheet for Cylindrical Lithium-Ion Battery Packs in another window
Topics: Composite materials, Graphite, Lithium-ion batteries, Thermal analysis, Thermal management, Cooling, Design, Heat, Batteries, Stress
Proceedings Papers

Comparative Study of Effective Cooling in Microchannel Heat Sinks (MCHS) With Nanofluid and Hydrophobic Nanostructures Using Computational Fluid Dynamics

Darryl Jennings, Jr., Sonya Smith
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A002, October 27–29, 2020
Paper No: IPACK2020-2527
https://doi.org/10.1115/IPACK2020-2527
View Paper titled, Comparative Study of Effective Cooling in Microchannel Heat Sinks (MCHS) With Nanofluid and Hydrophobic Nanostructures Using Computational Fluid Dynamics
Open the PDF for Comparative Study of Effective Cooling in Microchannel Heat Sinks (MCHS) With Nanofluid and Hydrophobic Nanostructures Using Computational Fluid Dynamics in another window
Topics: Computational fluid dynamics, Cooling, Friction, Heat sinks, Microchannels, Nanofluids, Nanostructures
Proceedings Papers

Quantitative Characterization of Sapphire and Silicon Nitride for Space Applications Circuit Subassemblies Using Cryogenic Cycling

Kirsten Lovelace, Sonya Smith
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A022, October 7–9, 2019
Paper No: IPACK2019-6499
https://doi.org/10.1115/IPACK2019-6499
View Paper titled, Quantitative Characterization of Sapphire and Silicon Nitride for Space Applications Circuit Subassemblies Using Cryogenic Cycling
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Topics: Circuits, Sapphire, Silicon nitride ceramics, Thermal expansion
Proceedings Papers

Additive Manufactured, Low EMI, Non-Metallic Convective Heat Spreader Design and Optimization

Reece Whitt, David Huitink, Skyler Hudson, Bakhtiyar Nafis, Zhao Yuan, Balaji Narayanasamy, Amol Deshpande, Fang Luo, Asif Imran, Zion Clarke, Sonya Smith
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A015, October 7–9, 2019
Paper No: IPACK2019-6442
https://doi.org/10.1115/IPACK2019-6442
View Paper titled, Additive Manufactured, Low EMI, Non-Metallic Convective Heat Spreader Design and Optimization
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Topics: Additive manufacturing, Design, Flat heat pipes, Optimization, Heat, Convection, Heat sinks, Nonmetallic materials, Thermal management, Density
Proceedings Papers

Feasibility Study of Effective Cooling Through Microchannel Heat Sink (MCHS) and Nanofluid Applications

Darryl Jennings, Jr., Sonya Smith
Proc. ASME. IMECE2018, Volume 8B: Heat Transfer and Thermal Engineering, V08BT10A045, November 9–15, 2018
Paper No: IMECE2018-88690
https://doi.org/10.1115/IMECE2018-88690
View Paper titled, Feasibility Study of Effective Cooling Through Microchannel Heat Sink (MCHS) and Nanofluid Applications
Open the PDF for Feasibility Study of Effective Cooling Through Microchannel Heat Sink (MCHS) and Nanofluid Applications in another window
Topics: Cooling, Heat sinks, Microchannels, Nanofluids, Nanostructures , Pressure drop, Forced convection, Geometry, Performance characterization, Transient analysis