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Journal Articles

Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities

Paul Paret, Donal Finegan, Sreekant Narumanchi

J. Electron. Packag. September 2023, 145(3): 034501.

Paper No: EP-22-1053

DOI: https://doi.org/10.1115/1.4056306

Published Online: December 9, 2022

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Topics: Artificial intelligence, Design, Electric vehicles, Electronics, Thermal management, Semiconductor devices, Reliability, Manufacturing, Semiconductors (Materials)

Proceedings Papers

Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module

Gilberto Moreno, Joshua Major, Douglas DeVoto, Faisal Khan, Sreekant Narumanchi, Xuhui Feng, Paul Paret

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A003, October 25–27, 2022

Paper No: IPACK2022-97283

DOI: https://doi.org/10.1115/IPACK2022-97283

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Topics: Bridges (Structures), Electronics, Energy gap, Optimization, Silicon, Design, Thermal resistance, Computational fluid dynamics, Heat exchangers, Fluids

Proceedings Papers

Multiphysics Co-Optimization Design and Analysis of a Double-Side-Cooled Silicon Carbide-Based Power Module

Xuhui Feng, Gilberto Moreno, Sreekant Narumanchi, Paul Paret

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A004, October 25–27, 2022

Paper No: IPACK2022-97355

DOI: https://doi.org/10.1115/IPACK2022-97355

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Topics: Cooling, Design, Electronics, Finite element analysis, Optimization, Silicon

Journal Articles

Validation and Parametric Investigations of an Internal Permanent Magnet Motor Using a Lumped Parameter Thermal Model

Sebastien Sequeira, Kevin Bennion, J. Emily Cousineau, Sreekant Narumanchi, Gilbert Moreno, Satish Kumar, Yogendra Joshi

J. Electron. Packag. June 2022, 144(2): 021114.

Paper No: EP-21-1052

DOI: https://doi.org/10.1115/1.4053121

Published Online: February 7, 2022

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Topics: Engines, Finite element analysis, Lamination, Motors, Stators, Temperature, Thermal conductivity, Winding (process), Sensitivity analysis, Contact resistance

Journal Articles

Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions

Gilberto Moreno, Sreekant Narumanchi, Xuhui Feng, Paul Anschel, Steve Myers, Phil Keller

J. Electron. Packag. March 2022, 144(1): 011004.

Paper No: EP-20-1093

DOI: https://doi.org/10.1115/1.4049815

Published Online: August 6, 2021

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Topics: Cooling, Electronics, Fluids, Heat exchangers, Heat transfer, Thermal management, Thermal resistance, Vehicles, Heat, Temperature

Proceedings Papers

Comparison of Thermal Management Approaches for Integrated Traction Drives in Electric Vehicles

Bidzina Kekelia, J. Emily Cousineau, Kevin Bennion, Sreekant Narumanchi, Shajjad Chowdhury

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 27–29, 2020

Paper No: IPACK2020-2524

DOI: https://doi.org/10.1115/IPACK2020-2524

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Topics: Electric vehicles, Thermal management, Traction, Electronics, Machinery, Cooling, Cooling systems, Engines, Finite element analysis, Fluids

Proceedings Papers

Validation and Parametric Investigations Using a Lumped Thermal Parameter Model of an Internal Permanent Magnet Motor

Sebastien Sequeira, Kevin Bennion, J. Emily Cousineau, Sreekant Narumanchi, Gilbert Moreno, Satish Kumar, Yogendra Joshi

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, October 27–29, 2020

Paper No: IPACK2020-2550

DOI: https://doi.org/10.1115/IPACK2020-2550

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Topics: Electric motors, Engines, Finite element analysis, Motors, Permanent magnets, Sensitivity analysis, Thermal management

Journal Articles

Special Issue on InterPACK 2019 – Part 1

Sreekant Narumanchi, Sukwon Choi, Saket Karajgikar, Haiding Sun, Guangsheng Zhang

J. Electron. Packag. September 2020, 142(3): 030301.

Paper No: EP-20-1092

DOI: https://doi.org/10.1115/1.4048039

Published Online: August 14, 2020

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Topics: Cloud computing, Electric vehicles, Electronic packaging, Electronics, Energy conversion, Engineering teachers, Feedback, Internet of things, Manufacturing, Mechanical engineers

Proceedings Papers

Electrothermal Modeling and Analysis of Gallium Oxide Power Switching Devices

Ramchandra M. Kotecha, Andriy Zakutayev, Wyatt K. Metzger, Paul Paret, Gilberto Moreno, Bidzina Kekelia, Kevin Bennion, Barry Mather, Sreekant Narumanchi, Samuel Kim, Samuel Graham

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A017, October 7–9, 2019

Paper No: IPACK2019-6453

DOI: https://doi.org/10.1115/IPACK2019-6453

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Topics: Electronics, Energy gap, Gallium, Modeling

Proceedings Papers

Surface Temperature Effect on Convective Heat Transfer Coefficients for Jet Impingement Cooling of Electric Machines With Automatic Transmission Fluid

Bidzina Kekelia, Kevin Bennion, Xuhui Feng, Gilberto Moreno, J. Emily Cousineau, Sreekant Narumanchi, Jeff Tomerlin

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 7–9, 2019

Paper No: IPACK2019-6457

DOI: https://doi.org/10.1115/IPACK2019-6457

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Topics: Convection, Impingement cooling, Machinery, Temperature, Transmission fluids

Journal Articles

Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages

Darshan G. Pahinkar, Lauren Boteler, Dimeji Ibitayo, Sreekant Narumanchi, Paul Paret, Douglas DeVoto, Joshua Major, Samuel Graham

J. Electron. Packag. December 2019, 141(4): 041001.

Paper No: EP-18-1031

DOI: https://doi.org/10.1115/1.4043406

Published Online: May 8, 2019

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Topics: Cooling, Flow (Dynamics), Heat, Heat sinks, Temperature, Geometry, Coolants, Fins, Silicon, Electronic packages

Proceedings Papers

Mechanical Characterization Study of Sintered Silver Pastes Bonded in a Double-Lap Configuration

Paul Paret, Joshua Major, Douglas DeVoto, Sreekant Narumanchi, Yansong Tan, Guo-Quan Lu

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, August 27–30, 2018

Paper No: IPACK2018-8276

DOI: https://doi.org/10.1115/IPACK2018-8276

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Topics: Silver, Particulate matter, Pressure, Collaboration, Displacement, Electronics, Energy gap, High pressure (Physics), High temperature, Manufacturing

Journal Articles

Special Section on InterPACK 2017—Part 2

Kaushik Mysore, Sreekant Narumanchi, Ercan Dede, Reza Khiabani

J. Electron. Packag. June 2018, 140(2): 020301.

Paper No: EP-18-1012

DOI: https://doi.org/10.1115/1.4039963

Published Online: May 9, 2018

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Topics: Batteries, Density, Electronic packaging, Microelectromechanical systems, Optoelectronic devices, Packaging, Semiconductor wafers, Sensors, Reliability

Journal Articles

Special Section on InterPACK 2017—Part 1

Kaushik Mysore, Sreekant Narumanchi, Ercan Dede, Reza Khiabani

J. Electron. Packag. March 2018, 140(1): 010301.

Paper No: EP-18-1005

DOI: https://doi.org/10.1115/1.4039090

Published Online: March 2, 2018

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Topics: Electronic packaging, Reliability

Proceedings Papers

Local-Scale Simulations of Nucleate Boiling on Micrometer-Featured Surfaces

Hariswaran Sitaraman, Gilberto Moreno, Ercan M. Dede, Shailesh N. Joshi, Feng Zhou, Sreekant Narumanchi

Proc. ASME. HT2017, Volume 2: Heat Transfer Equipment; Heat Transfer in Multiphase Systems; Heat Transfer Under Extreme Conditions; Nanoscale Transport Phenomena; Theory and Fundamental Research in Heat Transfer; Thermophysical Properties; Transport Phenomena in Materials Processing and Manufacturing, V002T11A011, July 9–12, 2017

Paper No: HT2017-4710

DOI: https://doi.org/10.1115/HT2017-4710

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Topics: Engineering simulation, Nucleate boiling, Simulation, Cavities, Computational fluid dynamics, Nucleation (Physics), Bubbles, Buoyancy, Convection, Deformation

Journal Articles

Nanothermal Interface Materials: Technology Review and Recent Results

Avram Bar-Cohen, Kaiser Matin, Sreekant Narumanchi

J. Electron. Packag. December 2015, 137(4): 040803.

Paper No: EP-15-1063

DOI: https://doi.org/10.1115/1.4031602

Published Online: October 9, 2015

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Topics: Copper, Cycles, Electrical resistivity, Solders, Teams, Temperature, Testing, Thermal resistance, Bonding, Accelerated life testing

Journal Articles

Effects of Pressure and a Microporous Coating on HFC-245fa Pool Boiling Heat Transfer

Gilberto Moreno, Jana R. Jeffers, Sreekant Narumanchi

J. Heat Transfer. October 2014, 136(10): 101502.

Paper No: HT-13-1510

DOI: https://doi.org/10.1115/1.4027966

Published Online: July 22, 2014

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Topics: Boiling, Coating processes, Coatings, Critical heat flux, Heat transfer, Heat transfer coefficients, Pool boiling, Pressure, Refrigerants, Temperature

Proceedings Papers

Reliability of Bonded Interfaces for Automotive Power Electronics

Douglas DeVoto, Paul Paret, Sreekant Narumanchi, Mark Mihalic

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A004, July 16–18, 2013

Paper No: IPACK2013-73143

DOI: https://doi.org/10.1115/IPACK2013-73143

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Topics: Electronics, Reliability, Cycles, Acoustics, Adhesives, Carbon fibers, Silver, Thermal resistance, Copper, Damage

Proceedings Papers

Effects of Pressure and a Microporous Coating on HFC-245fa Pool Boiling Heat Transfer

Gilberto Moreno, Jana R. Jeffers, Sreekant Narumanchi

Proc. ASME. HT2013, Volume 2: Heat Transfer Enhancement for Practical Applications; Heat and Mass Transfer in Fire and Combustion; Heat Transfer in Multiphase Systems; Heat and Mass Transfer in Biotechnology, V002T07A014, July 14–19, 2013

Paper No: HT2013-17126

DOI: https://doi.org/10.1115/HT2013-17126

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Topics: Boiling, Coating processes, Coatings, Critical heat flux, Heat transfer, Pool boiling, Pressure

Journal Articles

Pool Boiling Heat Transfer Characteristics of HFO-1234yf on Plain and Microporous-Enhanced Surfaces

Gilberto Moreno, Sreekant Narumanchi, Charles King

J. Heat Transfer. November 2013, 135(11): 111014.

Paper No: HT-12-1330

DOI: https://doi.org/10.1115/1.4024622

Published Online: September 23, 2013

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Topics: Boiling, Coating processes, Coatings, Critical heat flux, Heat transfer, Heat transfer coefficients, Pool boiling, Pressure, Temperature, Refrigerants

Journal citation

NARROW

Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities

Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module

Multiphysics Co-Optimization Design and Analysis of a Double-Side-Cooled Silicon Carbide-Based Power Module

Validation and Parametric Investigations of an Internal Permanent Magnet Motor Using a Lumped Parameter Thermal Model

Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions

Comparison of Thermal Management Approaches for Integrated Traction Drives in Electric Vehicles

Validation and Parametric Investigations Using a Lumped Thermal Parameter Model of an Internal Permanent Magnet Motor

Special Issue on InterPACK 2019 – Part 1

Electrothermal Modeling and Analysis of Gallium Oxide Power Switching Devices

Surface Temperature Effect on Convective Heat Transfer Coefficients for Jet Impingement Cooling of Electric Machines With Automatic Transmission Fluid

Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages

Mechanical Characterization Study of Sintered Silver Pastes Bonded in a Double-Lap Configuration

Special Section on InterPACK 2017—Part 2

Special Section on InterPACK 2017—Part 1

Local-Scale Simulations of Nucleate Boiling on Micrometer-Featured Surfaces

Nanothermal Interface Materials: Technology Review and Recent Results

Effects of Pressure and a Microporous Coating on HFC-245fa Pool Boiling Heat Transfer

Reliability of Bonded Interfaces for Automotive Power Electronics

Effects of Pressure and a Microporous Coating on HFC-245fa Pool Boiling Heat Transfer

Pool Boiling Heat Transfer Characteristics of HFO-1234yf on Plain and Microporous-Enhanced Surfaces

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