Skip Nav Destination
Close Modal
Update search
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
NARROW
Date
Availability
1-20 of 136
Suresh V. Garimella
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041019.
Paper No: EP-21-1161
Published Online: April 22, 2022
Proceedings Papers
Proc. ASME. IMECE97, Heat Transfer: Volume 1, 25-34, November 16–21, 1997
Paper No: IMECE1997-0828
Proceedings Papers
Proc. ASME. IMECE98, Heat Transfer: Volume 1 — Heat Transfer in Flowing Systems, 183-190, November 15–20, 1998
Paper No: IMECE1998-0595
Proceedings Papers
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 43-50, November 11–16, 2001
Paper No: IMECE2001/HTD-24376
Proceedings Papers
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 261-268, November 5–10, 2000
Paper No: IMECE2000-2272
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041107.
Paper No: EP-21-1114
Published Online: October 14, 2021
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041008.
Paper No: EP-18-1028
Published Online: October 1, 2018
Journal Articles
Journal:
Journal of Heat Transfer
Article Type: Photo Gallery
J. Heat Transfer. August 2017, 139(8): 080904.
Paper No: HT-17-1162
Published Online: June 5, 2017
Journal Articles
Journal:
Journal of Heat Transfer
Article Type: Photo Gallery
J. Heat Transfer. February 2017, 139(2): 020901.
Paper No: HT-16-1710
Published Online: January 6, 2017
Proceedings Papers
Proc. ASME. HT2016, Volume 2: Heat Transfer in Multiphase Systems; Gas Turbine Heat Transfer; Manufacturing and Materials Processing; Heat Transfer in Electronic Equipment; Heat and Mass Transfer in Biotechnology; Heat Transfer Under Extreme Conditions; Computational Heat Transfer; Heat Transfer Visualization Gallery; General Papers on Heat Transfer; Multiphase Flow and Heat Transfer; Transport Phenomena in Manufacturing and Materials Processing, V002T08A015, July 10–14, 2016
Paper No: HT2016-7243
Journal Articles
Journal:
Journal of Heat Transfer
Article Type: Research-Article
J. Heat Transfer. February 2017, 139(2): 021502.
Paper No: HT-16-1194
Published Online: November 8, 2016
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010903.
Paper No: EP-15-1083
Published Online: March 10, 2016
Proceedings Papers
Proc. ASME. IMECE2015, Volume 8A: Heat Transfer and Thermal Engineering, V08AT10A030, November 13–19, 2015
Paper No: IMECE2015-50238
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A014, July 6–9, 2015
Paper No: IPACK2015-48177
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A015, July 6–9, 2015
Paper No: IPACK2015-48184
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A018, July 6–9, 2015
Paper No: IPACK2015-48175
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A023, July 6–9, 2015
Paper No: IPACK2015-48178
Journal Articles
Journal:
Journal of Heat Transfer
Article Type: Research-Article
J. Heat Transfer. July 2015, 137(7): 071501.
Paper No: HT-14-1040
Published Online: July 1, 2015
Journal Articles
Journal:
Journal of Solar Energy Engineering
Article Type: Research-Article
J. Sol. Energy Eng. June 2015, 137(3): 031012.
Paper No: SOL-14-1213
Published Online: June 1, 2015
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041007.
Paper No: EP-13-1115
Published Online: September 19, 2014