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Sven Rzepka
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Proceedings Papers

The Effect of Underfill Delamination on the Reliability of Flip Chip Modules

Sven Rzepka, Matt A. Korhonen, Ekkehard Meusel, Che-Yu Li
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 73-83, November 16–21, 1997
Paper No: IMECE1997-0502
DOI: https://doi.org/10.1115/IMECE1997-0502
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Topics: Delamination, Flip-chip, Flip-chip devices, Reliability, Solders, Tension, Failure, Solder joints, Adhesion, Compressive stress
Proceedings Papers

The Systematic Study of Fan-Out Wafer Warpage Using Analytical, Numerical and Experimental Methods

Ghanshyam Gadhiya, Sven Rzepka, Thomas Otto, Sebastiaan Kersjes, Felandorio Fernandes
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, October 27–29, 2020
Paper No: IPACK2020-2555
DOI: https://doi.org/10.1115/IPACK2020-2555
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Topics: Bifurcation, Experimental methods, Gravity (Force), Packaging, Semiconductor wafers, Warping
Journal Articles

Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices

Alexander Otto, Sven Rzepka, Bernhard Wunderle
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031012.
Paper No: EP-18-1098
DOI: https://doi.org/10.1115/1.4043646
Published Online: June 17, 2019
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Topics: Cycles, Failure, Junctions, Temperature, Wire, Stress, Failure mechanisms, Thermomechanics
Proceedings Papers

Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices for Automotive Applications

Alexander Otto, Sven Rzepka, Bernhard Wunderle
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, August 27–30, 2018
Paper No: IPACK2018-8348
DOI: https://doi.org/10.1115/IPACK2018-8348
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Topics: Automotive industry, Cycles, Electronics, Stress, Reliability, Heating, Testing, Failure, Failure mechanisms, Junctions
Journal Articles

Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

Sven Rzepka, Alexander Otto, Dietmar Vogel, Rainer Dudek
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010903.
Paper No: EP-17-1090
DOI: https://doi.org/10.1115/1.4039333
Published Online: March 2, 2018
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Topics: Electronics, Failure, Reliability, Stress, Temperature, Failure mechanisms, Cycles, Safety, Failure analysis, Simulation
Proceedings Papers

Application Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

Sven Rzepka, Alexander Otto, Dietmar Vogel, Rainer Dudek
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A008, August 29–September 1, 2017
Paper No: IPACK2017-74208
DOI: https://doi.org/10.1115/IPACK2017-74208
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Topics: Electronics, Reliability, Safety, Automotive industry, Failure, Vehicles, Actuators, Computation, Design, Electric vehicles
Proceedings Papers

An Integrated Experimental and Theoretical Approach to Evaluate Si Strength Dependent on the Processing History

John Brueckner, Rainer Dudek, Sven Rzepka, Bernd Michel
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 139-145, July 19–23, 2009
Paper No: InterPACK2009-89270
DOI: https://doi.org/10.1115/InterPACK2009-89270
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Topics: Anisotropy, Brittleness, Ceramics, Damage, Experimental characterization, Failure, Finite element analysis, Fracture (Process), Grinding, Grinding wheels