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Journal Articles

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021110.
Paper No: EP-21-1048
DOI: https://doi.org/10.1115/1.4052767
Published Online: November 22, 2021
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Topics: Condensers (steam plant), Cooling, Flow (Dynamics), Heat, Heat exchangers, Refrigerants, Stress, Temperature, Pressure drop, Test facilities
Proceedings Papers

Ultra-Compact Micro-Scale Heat Exchanger for Advanced Thermal Management in Datacenters

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 27–29, 2020
Paper No: IPACK2020-2542
DOI: https://doi.org/10.1115/IPACK2020-2542
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Topics: Heat exchangers, Microscale devices, Thermal management, Cooling, Heat, Pressure drop, Density, Flow (Dynamics), Heat transfer, Refrigerants
Proceedings Papers

Partitioned Heat Sinks for Improved Natural Convection

Todd Salamon, Roger Kempers, Brian Lynch, Kevin Terrell, Elina Simon
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 27–29, 2020
Paper No: IPACK2020-2553
DOI: https://doi.org/10.1115/IPACK2020-2553
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Topics: Heat sinks, Natural convection
Journal Articles

Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis

Nicolas Lamaison, Raffaele L. Amalfi, Todd Salamon, Jackson B. Marcinichen, John R. Thome
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010901.
Paper No: EP-17-1085
DOI: https://doi.org/10.1115/1.4039091
Published Online: March 2, 2018
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Topics: Condensers (steam plant), Flow (Dynamics), Heat, Secondary cells, Stress, Temperature, Subcooling, Cooling systems, Refrigerants, Electronics
Proceedings Papers

Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis

Nicolas Lamaison, Raffaele L. Amalfi, Jackson B. Marcinichen, John R. Thome, Todd Salamon
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, August 29–September 1, 2017
Paper No: IPACK2017-74020
DOI: https://doi.org/10.1115/IPACK2017-74020
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Topics: Cooling systems, Electronics, Experimental analysis, Secondary cells, Boiling, Computer cooling, Condensers (steam plant), Cooling, Cylinders, Electronic components
Journal Articles

Isoflux Nusselt Number and Slip Length Formulae for Superhydrophobic Microchannels

Ryan Enright, Marc Hodes, Todd Salamon, Yuri Muzychka
Journal: Journal of Heat Transfer
Article Type: Research-Article
J. Heat Transfer. January 2014, 136(1): 012402.
Paper No: HT-12-1493
DOI: https://doi.org/10.1115/1.4024837
Published Online: October 17, 2013
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Topics: Boundary-value problems, Columns (Structural), Composite materials, Creeping flow, Flow (Dynamics), Heat transfer, Laplace equations, Microchannels, Temperature, Heat flux
Proceedings Papers

Numerical Analysis of Mist-Cooled High Power Components in Cabinets

Niru Kumari, Vaibhav Bahadur, Marc Hodes, Todd Salamon, Alan Lyons, Paul Kolodner, Suresh V. Garimella
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 933-944, July 19–23, 2009
Paper No: InterPACK2009-89269
DOI: https://doi.org/10.1115/InterPACK2009-89269
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Topics: Numerical analysis, Flow (Dynamics), Heat sinks, Drops, Evaporation, Telecommunications, Thermal management, Acoustics, Circuits, Cooling
Proceedings Papers

Transport in Superhydrophobic Microchannels: A Porous Modeling Approach

Ryan Enright, Cormac Eason, Tara Dalton, Todd Salamon
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 3, 93-105, July 8–12, 2007
Paper No: HT2007-32823
DOI: https://doi.org/10.1115/HT2007-32823
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Topics: Microchannels, Modeling, Flow (Dynamics), Fluids, Stress, Surface roughness, Boundary-value problems, Computational fluid dynamics, Drag (Fluid dynamics), Engineering simulation
Proceedings Papers

Friction Factors and Nusselt Numbers in Microchannels With Superhydrophobic Walls

Ryan Enright, Cormac Eason, Tara Dalton, Marc Hodes, Todd Salamon, Paul Kolodner, Tom Krupenkin
Proc. ASME. ICNMM2006, ASME 4th International Conference on Nanochannels, Microchannels, and Minichannels, Parts A and B, 599-609, June 19–21, 2006
Paper No: ICNMM2006-96134
DOI: https://doi.org/10.1115/ICNMM2006-96134
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Topics: Friction, Microchannels, Fluids, Flow (Dynamics), Heat transfer, Cooling, Electronics, Heat flux, Momentum, Pressure drop
Proceedings Papers

Numerical Simulation of Fluid Flow in Microchannels With Superhydrophobic Walls

Todd Salamon, Wonsuck Lee, Tom Krupenkin, Marc Hodes, Paul Kolodner, Ryan Enright, Andrew Salinger
Proc. ASME. IMECE2005, Heat Transfer, Part A, 819-829, November 5–11, 2005
Paper No: IMECE2005-82641
DOI: https://doi.org/10.1115/IMECE2005-82641
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Topics: Computer simulation, Fluid dynamics, Microchannels, Flow (Dynamics), Fluids, Wetting, Channel flow, Finite element analysis, Laminar flow, Pressure gradient