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Journal Articles

A Holistic Evaluation of Data Center Water Cooling Total Cost of Ownership

Dustin W. Demetriou, Vinod Kamath, Howard Mahaney
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010912.
Paper No: EP-15-1100
DOI: https://doi.org/10.1115/1.4032494
Published Online: March 10, 2016
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Topics: Cooling, Data centers, Hardware, Water
Proceedings Papers

Understanding the True Total Cost of Ownership of Water Cooling for Data Centers

Dustin W. Demetriou, Vinod Kamath, Howard Mahaney
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A013, July 6–9, 2015
Paper No: IPACK2015-48152
DOI: https://doi.org/10.1115/IPACK2015-48152
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Topics: Cooling, Data centers, Water, Construction, Density, Doors, Energy dissipation, Heat, Heat exchangers, Innovation
Proceedings Papers

Thermodynamic Characterization of a Server Optimized for High Performance Computing Using Water Cooling

Mark E. Steinke, Vinod Kamath, Lynn Parnell
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A030, July 6–9, 2015
Paper No: IPACK2015-48466
DOI: https://doi.org/10.1115/IPACK2015-48466
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Topics: Cooling, Water, Design, Air flow, Heat, Energy consumption, Energy efficiency, Stress, Algorithms, Boundary-value problems
Proceedings Papers

Thermodynamic Characterization of a Direct Water Cooled Server Rack Running Synthetic and Real High Performance Computing Work Loads

Lynn Parnell, Garrison Vaughan, John Thompson, Daniel Duffy, Louis Capps, Mark E. Steinke, Vinod Kamath
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A031, July 6–9, 2015
Paper No: IPACK2015-48470
DOI: https://doi.org/10.1115/IPACK2015-48470
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Topics: Server racks, Stress, Water, Cooling, Flow (Dynamics), Temperature, Computers, Coolants, Density, Design
Proceedings Papers

A Computational Study to Compare the Data Center Cooling Energy Spent Using Traditional Air Cooled and Hybrid Water Cooled Servers

Aparna Vallury, Mark E. Steinke, Vinod Kamath, Lynn Parnell
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A032, July 6–9, 2015
Paper No: IPACK2015-48476
DOI: https://doi.org/10.1115/IPACK2015-48476
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Topics: Cooling, Data centers, Water, Air flow, Density, Heat exchangers, Optimization, Simulation models, Temperature
Proceedings Papers

Experimental Investigation of a Cost Effective Skived Microchannel Cold Plate for Mass Production

Mark E. Steinke, Vinod Kamath
Proc. ASME. ICNMM2015, ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, V001T07A004, July 6–9, 2015
Paper No: ICNMM2015-48460
DOI: https://doi.org/10.1115/ICNMM2015-48460
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Topics: Mass production, Microchannels, Cooling, Design, Thermal resistance, Water, Boundary-value problems, Construction, Fins, Flow (Dynamics)
Proceedings Papers

System-Level Design for Liquid Cooled Chiller-Less Data Center

Pritish R. Parida, Timothy Chainer, Madhusudan Iyengar, Milnes David, Mark Schultz, Michael Gaynes, Vinod Kamath, Bejoy Kochuparambil, Robert Simons, Roger Schmidt
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 1127-1139, November 9–15, 2012
Paper No: IMECE2012-88957
DOI: https://doi.org/10.1115/IMECE2012-88957
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Topics: Data centers, Design, Cooling, Energy consumption, Air conditioning, Computer simulation, Computers, Electronics, Refrigeration, Test facilities
Proceedings Papers

Experimental Characterization of Server Rack Energy Use at Elevated Ambient Temperatures

Madhusudan Iyengar, Roger Schmidt, Vinod Kamath, Bejoy Kochuparambil
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 617-622, July 6–8, 2011
Paper No: IPACK2011-52207
DOI: https://doi.org/10.1115/IPACK2011-52207
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Topics: Energy consumption, Experimental characterization, Server racks, Temperature, Doors, Heat exchangers, Data centers, Stress, Algorithms, Cooling
Proceedings Papers

Maintaining Datacom Rack Inlet Air Temperatures With Water Cooled Heat Exchanger

Roger Schmidt, Richard C. Chu, Mike Ellsworth, Madhu Iyengar, Don Porter, Vinod Kamath, Bret Lehman
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 663-673, July 17–22, 2005
Paper No: IPACK2005-73468
DOI: https://doi.org/10.1115/IPACK2005-73468
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Topics: Data centers, Doors, Heat exchangers, Temperature, Water