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Journal Articles

High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology

Xuesong Zhang, Qian Wang, Chenhui Xia, Chaojie Zhou, Gang Wang, Jian Cai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031009.
Paper No: EP-22-1039
https://doi.org/10.1115/1.4056991
Published Online: March 20, 2023
View Article titled, High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology
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Topics: Design, Dipoles (Electromagnetism), Manufacturing, Millimeter waves, Packaging, Radiation (Physics), Signals, Simulation, Warping, Waveguides
Journal Articles

Multi-Objective Evolutionary Algorithm With Machine Learning and Local Search for an Energy-Efficient Disassembly Line Balancing Problem in Remanufacturing

Guangdong Tian, Cheng Zhang, Xuesong Zhang, Yixiong Feng, Gang Yuan, Tao Peng, Duc Truong Pham
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. May 2023, 145(5): 051002.
Paper No: MANU-22-1525
https://doi.org/10.1115/1.4056573
Published Online: January 19, 2023
View Article titled, Multi-Objective Evolutionary Algorithm With Machine Learning and Local Search for an Energy-Efficient Disassembly Line Balancing Problem in Remanufacturing
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Topics: Algorithms, Energy efficiency, Optimization, Optimization algorithms, Energy consumption, Evolutionary algorithms, Machine learning
Journal Articles

A Hybrid Antenna in Package Solution Using FOWLP Technology

Xuesong Zhang, Qian Wang, Bo Wang, Gang Wang, Xin Gu, Yu Chen, Lin Tan, Shengjuan Zhou, Jian Cai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031005.
Paper No: EP-21-1024
https://doi.org/10.1115/1.4051379
Published Online: September 15, 2021
View Article titled, A Hybrid Antenna in Package Solution Using FOWLP Technology
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Topics: Design, Manufacturing, Millimeter waves, Semiconductor wafers, Warping, Waveguides, Solders, Temperature, Molding
Proceedings Papers

Cloud Manufacturing Resource Management Based on Metadata

Chun Zhao, Lin Zhang, Xuesong Zhang, Liang Zhang
Proc. ASME. MSEC2015, Volume 2: Materials; Biomanufacturing; Properties, Applications and Systems; Sustainable Manufacturing, V002T04A019, June 8–12, 2015
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2015-9388
https://doi.org/10.1115/MSEC2015-9388
View Paper titled, Cloud Manufacturing Resource Management Based on Metadata
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Topics: Manufacturing, Computer software, Hardware
eBook Chapter

iCloud: Identifying Faulty Cloudlets in Cloud Services

Series: ASME Press Select Proceedings
Publisher: ASME Press
Published: 2011
https://doi.org/10.1115/1.859933.paper44
ISBN: 9780791859933
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Topics: Leakage