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Yogendra Joshi
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Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, October 27–29, 2020
Paper No: IPACK2020-2550
Journal Articles
Article Type: Research Papers
J. Eng. Sustain. Bldgs. Cities. August 2020, 1(3): 031001.
Paper No: JESBC-20-1004
Published Online: June 18, 2020
Journal Articles
Journal Articles
Journal Articles
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 7–9, 2019
Paper No: IPACK2019-6515
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A023, October 7–9, 2019
Paper No: IPACK2019-6519
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 7–9, 2019
Paper No: IPACK2019-6391
Journal Articles
Journal Articles
Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, August 27–30, 2018
Paper No: IPACK2018-8305
Journal Articles
Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, August 29–September 1, 2017
Paper No: IPACK2017-74108